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EP0901155
European procedure
Extract from the Register of European Patents
EP About this file: EP0901155
| EP0901155 - Semiconductor mounting assembly for applying an adhesive on a substrate [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.06.2005 Database last updated on 06.07.2024 | Most recent event Tooltip | 07.07.2006 | Lapse of the patent in a contracting state | published on 09.08.2006 [2006/32] | Applicant(s) | For all designated states ESEC Trading SA Hinterbergstr. 32, Postfach 5503 6330 Cham / CH | [2001/09] |
| Former [1999/10] | For all designated states ESEC SA Hinterbergstrasse 32 CH-6330 Cham / CH | Inventor(s) | 01 /
Viggiano, Franco, Dr. Eichrüti 4 6330 Cham / CH | 02 /
Koster, Christof Sonnmatt 8 6319 Allenwinden / CH | [1999/10] | Representative(s) | Falk, Urs Patentanwaltsbüro Dr. Urs Falk Eichholzweg 9A 6312 Steinhausen / CH | [N/P] |
| Former [2000/35] | Falk, Urs, Dr. Patentanwaltsbüro Dr. Urs Falk, Eichholzweg 9A 6312 Steinhausen / CH | ||
| Former [2000/10] | Falk, Urs Esec Management SA Postfach 5503 6330 Cham / CH | Application number, filing date | 98810103.6 | 06.02.1998 | [1999/10] | Priority number, date | CH19970002089 | 05.09.1997 Original published format: CH 208997 | [1999/10] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0901155 | Date: | 10.03.1999 | Language: | DE | [1999/10] | Type: | B1 Patent specification | No.: | EP0901155 | Date: | 18.08.2004 | Language: | DE | [2004/34] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.04.1998 | Classification | IPC: | H01L21/00 | [1999/10] | CPC: |
H01L21/6715 (EP,KR,US);
H01L24/743 (EP,KR,US);
H01L2224/743 (EP,KR,US)
| C-Set: |
H01L2224/743, H01L2924/00 (EP,US)
| Designated contracting states | CH, DE, FR, LI [1999/47] |
| Former [1999/10] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat | [1999/10] | English: | Semiconductor mounting assembly for applying an adhesive on a substrate | [1999/10] | French: | Ensemble de montage de semiconducteurs pour appliquer un adhésif sur un substrat | [1999/10] | Examination procedure | 10.09.1999 | Examination requested [1999/45] | 14.10.2003 | Despatch of a communication from the examining division (Time limit: M04) | 18.12.2003 | Reply to a communication from the examining division | 03.02.2004 | Communication of intention to grant the patent | 14.06.2004 | Fee for grant paid | 14.06.2004 | Fee for publishing/printing paid | Opposition(s) | 19.05.2005 | No opposition filed within time limit [2005/32] | Fees paid | Renewal fee | 29.02.2000 | Renewal fee patent year 03 | 28.02.2001 | Renewal fee patent year 04 | 28.02.2002 | Renewal fee patent year 05 | 28.02.2003 | Renewal fee patent year 06 | 01.03.2004 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 18.08.2004 | [2006/32] | Documents cited: | Search | [A]US4868007 (TAGUCHI KATSUHIKO [JP]) [A] 1,2 * abstract *; | [A]US5415693 (YONEDA TOMIO [JP], et al) [A] 1,7 * abstract * * column 5, lines 38-43 * |