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Extract from the Register of European Patents

EP About this file: EP0940843

EP0940843 - Apparatus for heat-treating substrate and method for separating the substrate from the apparatus [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  14.09.2007
Database last updated on 10.08.2024
Most recent event   Tooltip14.09.2007No opposition filed within time limitpublished on 17.10.2007  [2007/42]
Applicant(s)For all designated states
NEC LCD Technologies, Ltd.
1753 Shimonumabe Nakahara-ku
Kawasaki, Kanagawa 211-8666 / JP
[2006/44]
Former [2003/39]For all designated states
NEC LCD Technologies, Ltd.
1753 Shimonumabe Nakahara-ku
Kawasaki, Kanagawa 211-8666 / JP
Former [1999/36]For all designated states
NEC CORPORATION
7-1, Shiba 5-chome, Minato-ku
Tokyo / JP
Inventor(s)01 / Satou, Yasuyuki
NEC Corporation, 7-1, Shiba 5-chome
Minato-ku, Tokyo / JP
[1999/36]
Representative(s)Glawe, Delfs, Moll
Partnerschaft mbB von
Patent- und Rechtsanwälten
Postfach 26 01 62
80058 München / DE
[N/P]
Former [1999/36]Glawe, Delfs, Moll & Partner
Patentanwälte Postfach 26 01 62
80058 München / DE
Application number, filing date99104402.504.03.1999
[1999/36]
Priority number, dateJP1998005324305.03.1998         Original published format: JP 5324398
[1999/36]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0940843
Date:08.09.1999
Language:EN
[1999/36]
Type: A3 Search report 
No.:EP0940843
Date:23.10.2002
[2002/43]
Type: B1 Patent specification 
No.:EP0940843
Date:02.11.2006
Language:EN
[2006/44]
Search report(s)(Supplementary) European search report - dispatched on:EP06.09.2002
ClassificationIPC:H01L21/00
[1999/36]
CPC:
H01L21/68742 (EP,US); H01L21/68 (KR)
Designated contracting statesDE,   FR,   GB [2003/29]
Former [1999/36]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Vorrichtung zur Wärmebehandlung eines Substrats und Verfahren zur Trennung des Substrats von der Vorrichtung[1999/36]
English:Apparatus for heat-treating substrate and method for separating the substrate from the apparatus[1999/36]
French:Dispositif pour traiter thermiquement un substrat et méthode pour séparer le substrat du dispositif[1999/36]
Examination procedure10.09.2002Examination requested  [2002/46]
18.02.2005Despatch of a communication from the examining division (Time limit: M06)
26.08.2005Reply to a communication from the examining division
13.09.2005Despatch of a communication from the examining division (Time limit: M06)
21.03.2006Reply to a communication from the examining division
08.05.2006Communication of intention to grant the patent
14.09.2006Fee for grant paid
14.09.2006Fee for publishing/printing paid
Opposition(s)03.08.2007No opposition filed within time limit [2007/42]
Fees paidRenewal fee
16.03.2001Renewal fee patent year 03
21.03.2002Renewal fee patent year 04
21.03.2003Renewal fee patent year 05
23.03.2004Renewal fee patent year 06
18.03.2005Renewal fee patent year 07
21.03.2006Renewal fee patent year 08
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Documents cited:Search[A]JPH07201718  ;
 [A]EP0482907  (FUJITSU LTD [JP], et al) [A] 1-39 * the whole document * * figures 3A,3B,5A,5B,7A,7B *;
 [A]US5569350  (OSADA TOMOAKI [JP], et al) [A] 1-39 * the whole document * * figures 12-14B *;
 [A]US5683518  (MOORE GARY M [US], et al) [A] 1-39 * column 37, line 11 - line 35 * * figure 11E *;
 [A]JPH0637172  ;
 US5738165  [ ] (IMAI YUJI [JP]) [ ] * the whole document * * figures 2,3 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19951226), vol. 1995, no. 11, & JP07201718 A 19950804 (TOKYO ELECTRON LTD;OTHERS: 01) [A] 1-39 * abstract * * figures 1-6 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19940513), vol. 018, no. 252, Database accession no. (E - 1547), & JP06037172 A 19940210 (NIKON CORP) [A] 1-39 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.