EP0949669 - Method of fabricating semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 01.02.2008 Database last updated on 30.10.2024 | Most recent event Tooltip | 21.11.2008 | Change - lapse in a contracting state Updated state(s): FR | published on 24.12.2008 [2008/52] | Applicant(s) | For all designated states Seiko Epson Corporation 4-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP | [N/P] |
Former [2007/13] | For all designated states SEIKO EPSON CORPORATION 4-1, Nishi-shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP | ||
Former [1999/41] | For all designated states SEIKO EPSON CORPORATION 4-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 163-0811 / JP | Inventor(s) | 01 /
Kawahara, Kei c/o Seiko Epson Corporation, 3-5, Owa 3-chome Suwa-shi, Nagano-ken / JP | [1999/41] | Representative(s) | MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Straße 29 80336 München / DE | [N/P] |
Former [1999/41] | Hoffmann, Eckart, Dipl.-Ing. Patentanwalt, Bahnhofstrasse 103 82166 Gräfelfing / DE | Application number, filing date | 99106823.0 | 06.04.1999 | [1999/41] | Priority number, date | JP19980111480 | 07.04.1998 Original published format: JP 11148098 | [1999/41] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0949669 | Date: | 13.10.1999 | Language: | EN | [1999/41] | Type: | A3 Search report | No.: | EP0949669 | Date: | 30.08.2000 | [2000/35] | Type: | B1 Patent specification | No.: | EP0949669 | Date: | 28.03.2007 | Language: | EN | [2007/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.07.2000 | Classification | IPC: | H01L21/60, H01L21/285, H01L21/28 | [1999/41] | CPC: |
H01L21/76843 (EP);
H01L21/18 (KR);
H01L21/28518 (EP);
H01L21/76856 (EP);
H01L23/485 (EP);
H01L29/6659 (EP);
H01L2924/0002 (EP)
(-)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP)
| Designated contracting states | DE, FI, FR, GB, NL [2001/20] |
Former [1999/41] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Herstellungsverfahren einer Halbleiteranordnung | [1999/41] | English: | Method of fabricating semiconductor device | [1999/41] | French: | Méthode de fabrication d'un dispositif semiconducteur | [1999/41] | Examination procedure | 03.01.2001 | Examination requested [2001/10] | 19.10.2004 | Despatch of a communication from the examining division (Time limit: M04) | 24.02.2005 | Reply to a communication from the examining division | 14.11.2006 | Communication of intention to grant the patent | 19.01.2007 | Fee for grant paid | 19.01.2007 | Fee for publishing/printing paid | Opposition(s) | 02.01.2008 | No opposition filed within time limit [2008/10] | Fees paid | Renewal fee | 30.04.2001 | Renewal fee patent year 03 | 30.04.2002 | Renewal fee patent year 04 | 29.04.2003 | Renewal fee patent year 05 | 29.04.2004 | Renewal fee patent year 06 | 28.04.2005 | Renewal fee patent year 07 | 29.03.2006 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FI | 28.03.2007 | FR | 28.03.2007 | NL | 28.03.2007 | DE | 01.11.2007 | [2008/52] |
Former [2008/24] | FI | 28.03.2007 | |
NL | 28.03.2007 | ||
DE | 01.11.2007 | ||
FR | 16.11.2007 | ||
Former [2008/16] | FI | 28.03.2007 | |
NL | 28.03.2007 | ||
DE | 01.11.2007 | Documents cited: | Search | [A]JPH05166798 ; | [A]US4512073 (HSU SHENG T [US]) [A] 1-9 * column 2, line 31 - column 3, line 31 * * figures 3,4 *; | [A]US4888297 (ABOELFOTOH MOHAMED O [US], et al) [A] 1,4,5 * column 4, line 53 - column 5, line 32 * * column 6, line 21 - line 24 ** column 8, line 32 - column 9, line 16 *; | [Y]US5144390 (MATLOUBIAN MISHEL [US]) [Y] 12 * column 7, line 59 - line 66 * * column 8, line 35 - line 39 *; | [DXY]EP0607820 (NEC CORP [JP]) [DX] 1-11 * column 3, line 49 - column 6, line 6 * * claims 1-11 * * figures 1B,1C * [Y] 12 | [A] - PATENT ABSTRACTS OF JAPAN, (19931014), vol. 017, no. 568, Database accession no. (E - 1447), & JP05166798 A 19930702 (SONY CORP) [A] 1-4 * abstract * * figure 1 * |