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EP0997514
European procedure
Extract from the Register of European Patents
EP About this file: EP0997514
| EP0997514 - Rosin containing emulsion for pressure-sensitive adhesive [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 04.06.2004 Database last updated on 31.08.2024 | Most recent event Tooltip | 04.06.2004 | No opposition filed within time limit | published on 21.07.2004 [2004/30] | Applicant(s) | For all designated states NIPPON SHOKUBAI CO., LTD. 4-1-1 Koraibashi Chuo-ku Osaka-shi, Osaka / JP | [N/P] |
| Former [2000/18] | For all designated states NIPPON SHOKUBAI CO., LTD. 4-1-1 Koraibashi Chuo-ku, Osaka-shi, Osaka / JP | Inventor(s) | 01 /
Tanaka, Yasumasa 312-20, Noguchi, Noguchicho Kakogawa-shi, Hyogo-ken / JP | 02 /
Tsunemine, Naoki 9-10-401, Takashirocho Suita-shi, Osaka-fu / JP | 03 /
Konosu, Osamu 5-3-503,Nishimachi Takatsuki-shi, Osaka-fu / JP | [2000/18] | Representative(s) | Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE | [N/P] |
| Former [2000/18] | Müller-Boré & Partner Patentanwälte Grafinger Strasse 2 81671 München / DE | Application number, filing date | 99121584.9 | 29.10.1999 | [2000/18] | Priority number, date | JP19980308995 | 29.10.1998 Original published format: JP 30899598 | [2000/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0997514 | Date: | 03.05.2000 | Language: | EN | [2000/18] | Type: | B1 Patent specification | No.: | EP0997514 | Date: | 30.07.2003 | Language: | EN | [2003/31] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.03.2000 | Classification | IPC: | C09J201/00, // (C09J201/00, 193:04) | [2000/18] | CPC: |
C09J201/06 (EP,US);
C08L2666/26 (EP,US)
| C-Set: |
C09J201/06, C08L2666/26 (EP,US)
| Designated contracting states | BE, DE, FR, GB, IT [2001/03] |
| Former [2000/18] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Kolophonium-haltige Emulsion für druckreaktives Klebmittel | [2000/18] | English: | Rosin containing emulsion for pressure-sensitive adhesive | [2000/18] | French: | Emulsion contenant de la colophane pour adhésif sensible à la pression | [2002/48] |
| Former [2000/18] | Emulsion contenant du colophane pour l'adhésif sensitif à la pression | Examination procedure | 05.10.2000 | Examination requested [2000/48] | 04.11.2000 | Loss of particular rights, legal effect: designated state(s) | 15.02.2001 | Despatch of communication of loss of particular rights: designated state(s) AT, CH, CY, DK, ES, FI, GR, IE, LI, LU, MC, NL, PT, SE | 14.06.2002 | Despatch of a communication from the examining division (Time limit: M04) | 10.09.2002 | Reply to a communication from the examining division | 30.01.2003 | Communication of intention to grant the patent | 28.05.2003 | Fee for grant paid | 28.05.2003 | Fee for publishing/printing paid | Opposition(s) | 04.05.2004 | No opposition filed within time limit [2004/30] | Fees paid | Renewal fee | 29.10.2001 | Renewal fee patent year 03 | 28.10.2002 | Renewal fee patent year 04 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 06.12.2000 | AT M01 Not yet paid | 06.12.2000 | CH M01 Not yet paid | 06.12.2000 | CY M01 Not yet paid | 06.12.2000 | DK M01 Not yet paid | 06.12.2000 | ES M01 Not yet paid | 06.12.2000 | FI M01 Not yet paid | 06.12.2000 | GR M01 Not yet paid | 06.12.2000 | IE M01 Not yet paid | 06.12.2000 | LU M01 Not yet paid | 06.12.2000 | MC M01 Not yet paid | 06.12.2000 | NL M01 Not yet paid | 06.12.2000 | PT M01 Not yet paid | 06.12.2000 | SE M01 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]DE4409239 (HENKEL KGAA [DE]) [A] 1 * claim 5 *; | [X]JPS6084371 | [X] - PATENT ABSTRACTS OF JAPAN, (19850909), vol. 009, no. 222, Database accession no. (C - 302), & JP60084371 A 19850513 (TOA GOSEI KAGAKU KOGYO KK) [X] 1,3 * abstract * |