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Extract from the Register of European Patents

EP About this file: EP1052694

EP1052694 - SEMICONDUCTOR DEVICE HAVING INSULATING FILM OF FLUORINE-ADDED CARBON FILM AND METHOD OF PRODUCING THE SAME [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  22.08.2008
Database last updated on 30.09.2024
Most recent event   Tooltip22.08.2008Application deemed to be withdrawnpublished on 24.09.2008  [2008/39]
Applicant(s)For all designated states
TOKYO ELECTRON LIMITED
3-6 Akasaka, 5-chome, Minato-ku
Tokyo 107-8481 / JP
[N/P]
Former [2000/46]For all designated states
Tokyo Electron Limited
3-6 Akasaka, 5-chome, Minato-ku
Tokyo 107-8481 / JP
Inventor(s)01 / AKAHORI, Takashi
401, Bear Palace 37-5, Matsuki Hachioji-shi
Tokyo 192-0362 / JP
02 / SUZUKI, Akira
6-17-15, Akasakadai Sakai-shi
Osaka 590-0144 / JP
[2000/46]
Representative(s)Liesegang, Roland
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[N/P]
Former [2000/46]Liesegang, Roland, Dr.-Ing.
FORRESTER & BOEHMERT Franz-Joseph-Strasse 38
80801 München / DE
Application number, filing date99900145.608.01.1999
[2000/46]
WO1999JP00034
Priority number, dateJP1998001495610.01.1998         Original published format: JP 1495698
JP1998031685720.10.1998         Original published format: JP 31685798
[2000/46]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9935684
Date:15.07.1999
Language:EN
[1999/28]
Type: A1 Application with search report 
No.:EP1052694
Date:15.11.2000
Language:EN
The application published by WIPO in one of the EPO official languages on 15.07.1999 takes the place of the publication of the European patent application.
[2000/46]
Search report(s)International search report - published on:JP15.07.1999
(Supplementary) European search report - dispatched on:EP08.10.2004
ClassificationIPC:H01L21/768, H01L21/314, H01L21/312
[2004/48]
CPC:
H01L21/32051 (EP,US); H01L21/768 (KR); C23C16/26 (EP,US);
C23C16/30 (EP,US); C23C16/56 (EP,US); H01L21/0212 (EP,US);
H01L21/02274 (EP,US); H01L21/0234 (EP,US); H01L21/02343 (EP,US);
H01L21/3127 (US); H01L21/76814 (EP,US); H01L21/76826 (EP,US);
H01L21/76828 (EP,US); H01L21/76843 (EP,US); H01L21/2855 (EP,US);
H01L21/28556 (EP,US); H01L21/76801 (EP,US) (-)
Former IPC [2000/46]H01L21/768, H01L21/314
Designated contracting statesBE,   DE,   FR,   GB,   IT [2000/46]
TitleGerman:HALBLEITERANORDNUNG MIT ISOLIERENDEM FILM AUF FLUORKOHLENSTOFFBASIS[2000/46]
English:SEMICONDUCTOR DEVICE HAVING INSULATING FILM OF FLUORINE-ADDED CARBON FILM AND METHOD OF PRODUCING THE SAME[2000/46]
French:DISPOSITIF A SEMI-CONDUCTEURS PRESENTANT UNE COUCHE ISOLANTE CONSTITUEE D'UN FILM DE CARBONE FLUORE ET PROCEDE DE PRODUCTION DUDIT DISPOSITIF[2000/46]
Entry into regional phase05.07.2000Translation filed 
05.07.2000National basic fee paid 
05.07.2000Search fee paid 
05.07.2000Designation fee(s) paid 
05.07.2000Examination fee paid 
Examination procedure06.08.1999Request for preliminary examination filed
International Preliminary Examining Authority: JP
05.07.2000Examination requested  [2000/46]
19.09.2007Despatch of a communication from the examining division (Time limit: M06)
01.04.2008Application deemed to be withdrawn, date of legal effect  [2008/39]
07.05.2008Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2008/39]
Divisional application(s)EP08003967.0  / EP1947685
Fees paidRenewal fee
11.01.2001Renewal fee patent year 03
14.01.2002Renewal fee patent year 04
14.01.2003Renewal fee patent year 05
14.01.2004Renewal fee patent year 06
12.01.2005Renewal fee patent year 07
12.01.2006Renewal fee patent year 08
12.01.2007Renewal fee patent year 09
14.01.2008Renewal fee patent year 10
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Documents cited:Search[A]EP0795895  (NEC CORP [JP]) [A] 1,7,19 * the whole document *;
 [PA]WO9821748  (TOKYO ELECTRON LTD [JP], et al) [PA] 1,7,19* the whole document *;
 [A]  - CHIN-JONG CHAN ET AL, "Adhesion of copper to polytetrafluoroethylene polymer film with adhesive layers", MATERIALS SCIENCE OF HIGH TEMPERATURE POLYMERS FOR MICROELECTRONICS SYMPOSIUM MATER. RES. SOC PITTSBURGH, PA, USA, (1991), pages 363 - 368, XP008034857 [A] 1,7,19 * the whole document *
 [A]  - COSTA E ET AL, "Fluorocarbon and tungsten carbide multilayer coatings", SURFACE AND COATINGS TECHNOLOGY ELSEVIER SWITZERLAND, (1997), vol. 97, no. 1-3, ISSN 0257-8972, pages 680 - 686, XP001202108 [A] 1,6,7,19 * the whole document *

DOI:   http://dx.doi.org/10.1016/S0257-8972(97)00332-0
International search[A]JPH08264648  (NEC CORP);
 [A]JPH09246242  (NEC CORP);
 [AE]JPH10335461  (NEC CORP);
 [AE]JPH1116918  (NEC CORP)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.