EP1104025 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 17.10.2008 Database last updated on 07.06.2024 | Most recent event Tooltip | 19.06.2009 | Lapse of the patent in a contracting state New state(s): GB | published on 22.07.2009 [2009/30] | Applicant(s) | For all designated states MITSUBISHI DENKI KABUSHIKI KAISHA 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310 / JP | [2006/18] |
Former [2001/22] | For all designated states MITSUBISHI DENKI KABUSHIKI KAISHA 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310 / JP | Inventor(s) | 01 /
MATSUMOTO, Hideo, c/o Mitsubishi Denki K.K. 7-3, Marunouchi 2-chome Chiyoda-ku, Tokyo 100-8310 / JP | [2007/49] |
Former [2001/22] | 01 /
MATSUMOTO, Hideo, c/o Mitsubishi Denki Kab. Kaisha 2-3, Marunouchi 2-chome Chiyoda-ku, Tokyo 100-8310 / JP | Representative(s) | Sajda, Wolf E., et al Meissner Bolte Patentanwälte Rechtsanwälte Partnerschaft mbB Postfach 86 06 24 81633 München / DE | [N/P] |
Former [2001/22] | Sajda, Wolf E., Dipl.-Phys., et al MEISSNER, BOLTE & PARTNER Postfach 86 06 24 81633 München / DE | Application number, filing date | 99918362.7 | 11.05.1999 | [2001/22] | WO1999JP02417 | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO0068992 | Date: | 16.11.2000 | Language: | EN | [2000/46] | Type: | A1 Application with search report | No.: | EP1104025 | Date: | 30.05.2001 | Language: | EN | The application published by WIPO in one of the EPO official languages on 16.11.2000 takes the place of the publication of the European patent application. | [2001/22] | Type: | B1 Patent specification | No.: | EP1104025 | Date: | 12.12.2007 | Language: | EN | [2007/50] | Search report(s) | International search report - published on: | JP | 16.11.2000 | (Supplementary) European search report - dispatched on: | EP | 01.02.2007 | Classification | IPC: | H01L23/053, H01L25/07 | [2007/18] | CPC: |
H01L23/053 (EP,US);
H01L25/072 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L2924/12041 (EP,US);
H01L2924/181 (EP,US)
(-)
| C-Set: |
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/45124, H01L2924/00015 (US,EP);
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/12041, H01L2924/00 (US,EP); |
Former IPC [2001/22] | H01L23/48 | Designated contracting states | CH, DE, FR, GB, LI [2001/22] | Title | German: | HALBLEITERVORRICHTUNG | [2001/22] | English: | SEMICONDUCTOR DEVICE | [2001/22] | French: | DISPOSITIF A SEMI-CONDUCTEUR | [2001/22] | Entry into regional phase | 09.02.2001 | Translation filed | 09.02.2001 | National basic fee paid | 09.02.2001 | Search fee paid | 09.02.2001 | Designation fee(s) paid | 09.02.2001 | Examination fee paid | Examination procedure | 09.02.2001 | Examination requested [2001/22] | 18.06.2007 | Communication of intention to grant the patent | 24.10.2007 | Fee for grant paid | 24.10.2007 | Fee for publishing/printing paid | Opposition(s) | 15.09.2008 | No opposition filed within time limit [2008/47] | Fees paid | Renewal fee | 09.02.2001 | Renewal fee patent year 03 | 28.05.2002 | Renewal fee patent year 04 | 27.05.2003 | Renewal fee patent year 05 | 27.05.2004 | Renewal fee patent year 06 | 30.05.2005 | Renewal fee patent year 07 | 28.03.2006 | Renewal fee patent year 08 | 25.05.2007 | Renewal fee patent year 09 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | CH | 12.12.2007 | LI | 12.12.2007 | GB | 11.05.2008 | [2009/30] |
Former [2008/24] | CH | 12.12.2007 | |
LI | 12.12.2007 | Documents cited: | Search | [A]DE1815799 (SIEMENS AG) [A] 1-6 * figure 1 *; | [A]US5014159 (BUTT SHELDON H [US]) [A] 1-5 * figure 16 *; | [A]EP0752720 (MITSUBISHI ELECTRIC CORP [JP]) [A] 1-6 * column 11, lines 14-58; figure 6 * | International search | [A]JPH0766340 (MITSUBISHI ELECTRIC CORP); | [A]JPH0922973 (MITSUBISHI ELECTRIC CORP) |