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Extract from the Register of European Patents

EP About this file: EP1147488

EP1147488 - METHOD FOR EMBEDDING AN IC COMPONENT INTO A FOAMED LAYER OF A CHIP CARD [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  03.11.2006
Database last updated on 29.07.2024
Most recent event   Tooltip05.12.2008Lapse of the patent in a contracting state
New state(s): CY		published on 07.01.2009  [2009/02]
Applicant(s)For all designated states
Giesecke & Devrient GmbH
Prinzregentenstrasse 159
81677 München / DE
[2001/43]
Inventor(s)01 / HOPPE, Joachim
Clemens-Bolz-Weg 7
D-81377 München / DE
02 / HOHMANN, Arno
Arnimstrasse 14
D-81369 München / DE
03 / STRASSMAIER, Josef
Hauptstrasse 28
D-83550 Emmering / DE
04 / ZAPF, Rudolf
Sambergerstrasse 25a
D-81477 München / DE
 [2001/43]
Representative(s)Klunker . Schmitt-Nilson . Hirsch
Patentanwälte
Destouchesstrasse 68
80796 München / DE
[N/P]
Former [2008/39]Klunker . Schmitt-Nilson . Hirsch
Destouchesstrasse 68
80796 München / DE
Former [2005/46]Klunker . Schmitt-Nilson . Hirsch
Winzererstrasse 106
80797 München / DE
Application number, filing date99959298.322.11.1999
[2001/43]
WO1999EP08986
Priority number, dateDE199815498627.11.1998         Original published format: DE 19854986
[2001/43]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO0033248
Date:08.06.2000
Language:DE
[2000/23]
Type: A1 Application with search report 
No.:EP1147488
Date:24.10.2001
Language:DE
The application published by WIPO in one of the EPO official languages on 08.06.2000 takes the place of the publication of the European patent application.
[2001/43]
Type: B1 Patent specification 
No.:EP1147488
Date:28.12.2005
Language:DE
[2005/52]
Search report(s)International search report - published on:EP08.06.2000
ClassificationIPC:G06K19/077, B29C43/18
[2001/43]
CPC:
B32B37/182 (EP); B29C44/569 (EP); B29C59/02 (EP);
G06K19/07745 (EP); B29K2105/04 (EP); B32B2038/0024 (EP);
B32B2305/022 (EP); B32B2425/00 (EP); B32B2429/00 (EP);
B32B2519/02 (EP); H01L2924/0002 (EP) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE [2001/43]
TitleGerman:VERFAHREN ZUM EINBETTEN EINES IC-BAUSTEINS IN EINER GESCHÄUMTEN SCHICHT EINER CHIPKARTE[2001/43]
English:METHOD FOR EMBEDDING AN IC COMPONENT INTO A FOAMED LAYER OF A CHIP CARD[2001/43]
French:PROCEDE POUR ENROBER UN MODULE A CIRCUITS INTEGRES DANS LA COUCHE MOUSSEE D'UNE CARTE A PUCE[2001/43]
Entry into regional phase27.06.2001National basic fee paid 
27.06.2001Designation fee(s) paid 
27.06.2001Examination fee paid 
Examination procedure26.06.2000Request for preliminary examination filed
International Preliminary Examining Authority: EP
27.06.2001Examination requested  [2001/43]
10.10.2001Amendment by applicant (claims and/or description)
28.05.2003Despatch of a communication from the examining division (Time limit: M04)
22.08.2003Reply to a communication from the examining division
07.06.2005Date of oral proceedings
20.06.2005Communication of intention to grant the patent
20.06.2005Minutes of oral proceedings despatched
31.10.2005Fee for grant paid
31.10.2005Fee for publishing/printing paid
Opposition(s)29.09.2006No opposition filed within time limit [2006/49]
Fees paidRenewal fee
30.11.2001Renewal fee patent year 03
02.12.2002Renewal fee patent year 04
01.12.2003Renewal fee patent year 05
30.11.2004Renewal fee patent year 06
30.11.2005Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCY28.12.2005
FI28.12.2005
GB28.12.2005
IE28.12.2005
IT28.12.2005
NL28.12.2005
DK28.03.2006
GR28.03.2006
SE28.03.2006
ES08.04.2006
PT29.05.2006
[2009/02]
Former [2008/18]FI28.12.2005
GB28.12.2005
IE28.12.2005
IT28.12.2005
NL28.12.2005
DK28.03.2006
GR28.03.2006
SE28.03.2006
ES08.04.2006
PT29.05.2006
Former [2007/23]FI28.12.2005
GB28.12.2005
IE28.12.2005
NL28.12.2005
DK28.03.2006
GR28.03.2006
SE28.03.2006
ES08.04.2006
PT29.05.2006
Former [2007/02]FI28.12.2005
IE28.12.2005
NL28.12.2005
DK28.03.2006
GR28.03.2006
SE28.03.2006
PT29.05.2006
Former [2006/49]FI28.12.2005
IE28.12.2005
NL28.12.2005
GR28.03.2006
SE28.03.2006
PT29.05.2006
Former [2006/45]FI28.12.2005
NL28.12.2005
GR28.03.2006
SE28.03.2006
Former [2006/38]FI28.12.2005
GR28.03.2006
SE28.03.2006
Former [2006/27]FI28.12.2005
SE28.03.2006
Former [2006/25]FI28.12.2005
Cited inInternational search[A]DE3122981  (GAO GES AUTOMATION ORG [DE]) [A] 1,3,6,9,10 * page 8, line 14 - page 9, line 29; figure - *;
 [A]FR2624999  (SGS THOMSON MICROELECTRONICS [FR]) [A] 1,10 * page 6, line 4 - line 10; figure 3 *;
 [X]CH672285  (LANDIS & GYR AG) [X] 1,10 * page 3, column L, line 24 - column R, line 66; figure - *;
 [X]DE4142392  (GAO GES AUTOMATION ORG [DE]) [X] 1,3,10 * column 6, line 49 - column 7, line 24; figure - *;
 [A]WO9325978  (GEC AVERY LTD [GB], et al) [A] 1,4,10* page 5 - page 6; figure -; claim 5 *;
 [A]DE4241482  (SIEMENS AG [DE]) [A] 1,3,10 * column 2, line 25 - line 66; figure - *;
 [A]US5476629  (YABE ISAO [JP], et al) [A] 1,2,10 * column 5, line 35 - column 7, line 17; figure - *;
 [X]DE4435802  (GIESECKE & DEVRIENT GMBH [DE]) [X] 1-10 * column 5, line 27 - line 39; figure 4 *;
 [A]DE4444788  (ODS GMBH & CO KG [DE]) [A] 1,10 * column 2, line 42 - column 3, line 55; figure - *;
 [A]DE19645069  (MEINEN TOMAS [DE]) [A] 1,4,10 * column 3, line 14 - line 52; figure - *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.