| Angeführt in | Internationale Recherche | Art: | Patentliteratur | Veröffentlichungsnr.: | JPH06196486
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| Art: | Nichtpatentliteratur | Angaben zur Veröffentlichung: | [Y] ZAKEL E ET AL: "FLUXLESS FLiP CHIP ASSEMBLY ON RIGID AND FLEXIBLE POLYMER SUBSTRATES USING THE AU-SN METALLURGY", PROCEEDINGS OF THE IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, LA JOLLA, SEPT. 12 - 14, 1994, vol. VOL. 1, no. SYMP. 16, 12 September 1994 (1994-09-12), INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, pages 177 - 184, XP000530089 [Y] 1-6 * page 177 * | DOI: | http://dx.doi.org/10.1109/IEMT.1994.404670 | Art: | Nichtpatentliteratur | Angaben zur Veröffentlichung: | [Y] PATENT ABSTRACTS OF JAPAN vol. 018, no. 545 (E - 1617) 18 October 1994 (1994-10-18) [Y] 2 * abstract * | Art: | Nichtpatentliteratur | Angaben zur Veröffentlichung: | [A] ZAKEL ET AL: "Flip-chip bonding on green tape ceramic substrates", 9TH EUROPEAN HYBRID MICROELECTRONICS CONFERENCE, 2 June 1993 (1993-06-02) - 4 June 1993 (1993-06-04), NICE, FRANCE, pages 339 - 350, XP000607647 [A] 1,2,5 * page 340 * * page 343 * * page 344 * * page 347 - page 348 * | Art: | Nichtpatentliteratur | Angaben zur Veröffentlichung: | [A] KLOESER ET AL: "Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates", 1995 PROCEEDINGS 45TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 21 May 1995 (1995-05-21) - 24 May 1995 (1995-05-24), LAS VEGAS, NEVADA, pages 1179 - 1190, XP000607536 [A] 1 * page 1180 * |
