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EP1054437
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EP About this file: EP1054437
| EP1054437 - Method and apparatus for attaching wafer to wafer frame and planarization apparatus including attaching apparatus [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 22.04.2005 Database last updated on 31.08.2024 | Most recent event Tooltip | 22.04.2005 | Application deemed to be withdrawn | published on 08.06.2005 [2005/23] | Applicant(s) | For all designated states TOKYO SEIMITSU CO., LTD. 7-1, Shimorenjaku 9-chome Mitaka-shi Tokyo / JP | [N/P] |
| Former [2000/47] | For all designated states TOKYO SEIMITSU CO., LTD. 7-1, Shimorenjaku 9-chome Mitaka-shi Tokyo / JP | Inventor(s) | 01 /
Ishikawa, Toshihiko 7-1, Shimorenjaku 9-chome Mitaka-shi, Tokyo / JP | 02 /
Katagiri, Yasushi 7-1, Shimorenjaku 9-chome Mitaka-shi, Tokyo / JP | [2000/47] | Representative(s) | Hering, Hartmut Patentanwälte Berendt, Leyh & Hering Innere Wiener Strasse 20 81667 München / DE | [N/P] |
| Former [2000/47] | Hering, Hartmut, Dipl.-Ing. Patentanwälte Berendt, Leyh & Hering Innere Wiener Strasse 20 81667 München / DE | Application number, filing date | 00110663.2 | 18.05.2000 | [2000/47] | Priority number, date | JP19990141381 | 21.05.1999 Original published format: JP 14138199 | [2000/47] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1054437 | Date: | 22.11.2000 | Language: | EN | [2000/47] | Type: | A3 Search report | No.: | EP1054437 | Date: | 19.01.2005 | [2005/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.12.2004 | Classification | IPC: | H01L21/00 | [2000/47] | CPC: |
H01L21/67132 (EP);
H01L21/6835 (EP);
H01L21/6836 (EP);
H01L2221/68327 (EP);
H01L2221/6834 (EP);
H01L2221/68395 (EP)
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE [2000/47] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | SI | Not yet paid | Title | German: | Verfahren und Vorrichtung zum Befestigen eines Wafers auf einem Waferrahmen und Planarisierungssystem ausgerüstet mit einer solchen Befestigungsvorrichtung | [2000/47] | English: | Method and apparatus for attaching wafer to wafer frame and planarization apparatus including attaching apparatus | [2000/47] | French: | Méthode et dispositif pour fixer une plaquette semiconductrice sur un cadre et appareil de planarisation comprenant ce dispositif de fixation | [2000/47] | Examination procedure | 01.12.2004 | Application deemed to be withdrawn, date of legal effect [2005/23] | 11.01.2005 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2005/23] | Fees paid | Renewal fee | 24.05.2002 | Renewal fee patent year 03 | 23.05.2003 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 31.05.2004 | 05 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]EP0848415 (NITTO DENKO CORP [JP]) [X] 1-5 * figure 1 * * claims 1,8 * * column 1 - column 3 *; | [X]EP0603514 (MOTOROLA INC [US]) [X] 1-5 * column 3 - column 8 * * column 7, line 18 - column 7, line 37 * |