Deutsch English Français

Contact

EP1039540

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...

Extract from the Register of European Patents

EP About this file: EP1039540

EP1039540 - Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 14.12.2001 Database last updated on 11.09.2024
Most recent event Tooltip	14.12.2001	Application deemed to be withdrawn	published on 30.01.2002 [2002/05]
Applicant(s)	For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP
	[N/P]
Former [2000/39]	For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP
Inventor(s)	01 / Yamada, Shigeru, c/o Oki Electric Ind. Co., Ltd. 7-12, Toranomon, 1-chome, Minato-ku Tokyo / JP
	02 / Uchida, Yasufumi, c/o Oki Electric Ind. Co., Ltd. 7-12, Toranomon, 1-chome, Minato-ku Tokyo / JP
	03 / Murakami, Noriko, c/o Oki Electric Ind. Co., Ltd. 7-12, Toranomon, 1-chome, Minato-ku Tokyo / JP
	04 / Shizuno, Yoshinori, c/o Oki Electric Ind. Co., Ltd. 7-12, Toranomon, 1-chome, Minato-ku Tokyo / JP
	[2000/39]
Representative(s)	Betten & Resch Patent- und Rechtsanwälte PartGmbB Postfach 10 02 51 80076 München / DE
	[N/P]
Former [2000/39]	Betten & Resch Reichenbachstrasse 19 80469 München / DE
Application number, filing date	00110728.3	24.10.1996
	[2000/39]
Priority number, date	JP19950275817	24.10.1995 Original published format: JP 27581795
	JP19950275818	24.10.1995 Original published format: JP 27581895
	JP19950275819	24.10.1995 Original published format: JP 27581995
	JP19950275820	24.10.1995 Original published format: JP 27582095
	[2000/39]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP1039540
	Date:	27.09.2000
	Language:	EN
	[2000/39]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	04.08.2000
Classification	IPC:	H01L23/495, H01L23/31, H01L21/60, H01L23/498, H01L23/367	[2000/39]
	CPC:	H01L24/11 (EP,US); H01L23/055 (EP,US); H01L23/3107 (EP,US); H01L23/3121 (EP,US); H01L23/3677 (EP,US); H01L23/49503 (EP,US); (+) H01L23/49531 (EP,US); H01L23/49811 (EP,US); H01L23/49827 (EP,US); H01L24/05 (EP,US); H01L24/13 (EP,US); H01L24/16 (EP,US); H01L24/48 (EP,US); H01L24/73 (EP,US); H01L24/78 (EP,US); H01L24/81 (EP,US); H01L24/85 (EP,US); H01L24/91 (EP,US); H01L2224/0401 (EP,US); H01L2224/04042 (EP,US); H01L2224/05556 (EP,US); H01L2224/11334 (EP,US); H01L2224/1134 (EP,US); H01L2224/1329 (EP,US); H01L2224/133 (EP,US); H01L2224/16 (EP,US); H01L2224/32245 (EP,US); H01L2224/45144 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US); H01L2224/484 (EP,US); H01L2224/48465 (EP,US); H01L2224/48471 (EP,US); H01L2224/48599 (EP,US); H01L2224/73265 (EP,US); H01L2224/78301 (EP,US); H01L2224/81801 (EP,US); H01L2224/85205 (EP,US); H01L2224/8592 (EP,US); H01L2224/92 (EP,US); H01L2224/92247 (EP,US); H01L24/45 (EP,US); H01L2924/00013 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01014 (EP,US); H01L2924/01023 (EP,US); H01L2924/01077 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/014 (EP,US); H01L2924/09701 (EP,US); H01L2924/15311 (EP,US); H01L2924/1532 (EP,US); H01L2924/181 (EP,US); H01L2924/351 (EP,US) (-)
	C-Set:	H01L2224/1329, H01L2924/00014 (US,EP); H01L2224/133, H01L2924/00014 (US,EP); H01L2224/45144, H01L2924/00014 (US,EP); H01L2224/48091, H01L2924/00014 (US,EP); (+) H01L2224/48247, H01L2224/48471, H01L2924/00, H01L2924/00012 (EP,US); H01L2224/48465, H01L2224/48091, H01L2924/00 (EP,US); H01L2224/48465, H01L2224/48091, H01L2924/00, H01L2924/00012 (EP,US); H01L2224/48465, H01L2224/48227 (US,EP); H01L2224/48465, H01L2224/48227, H01L2924/00 (US,EP); H01L2224/48465, H01L2224/48247, H01L2924/00 (EP,US); H01L2224/48465, H01L2224/48247, H01L2924/00, H01L2224/48247, H01L2924/00 (US,EP); H01L2224/484, H01L2924/00014 (US,EP); H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP); H01L2224/85205, H01L2924/00 (EP,US); H01L2224/92247, H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (EP,US); H01L2924/00013, H01L2224/13099 (US,EP); H01L2924/00014, H01L2224/05556 (US,EP); H01L2924/00014, H01L2224/05599 (EP); H01L2924/00014, H01L2224/85399 (EP); H01L2924/181, H01L2924/00012 (EP,US); H01L2924/351, H01L2924/00 (US,EP) (-)
Designated contracting states	[2001/24]
Former [2000/39]	DE, FR, NL
Title	German:	Halbleitereinrichtung mit verbesserter Struktur zur Vermeidung von Rissen und Herstellungsverfahren	[2000/39]
	English:	Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same	[2000/39]
	French:	Dispositif semi-conducteur présentant une structure améliorée pour éviter les craquements et procédé de fabrication	[2000/39]
Examination procedure	13.09.2000	Amendment by applicant (claims and/or description)
	28.03.2001	Application deemed to be withdrawn, date of legal effect [2002/05]
	08.08.2001	Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2002/05]
Parent application(s) Tooltip	EP96117092.5 / EP0771029
Fees paid	Renewal fee
	05.06.2000	Renewal fee patent year 03
	05.06.2000	Renewal fee patent year 04
	31.10.2000	Renewal fee patent year 05
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	16.05.2001	DE M01 Not yet paid
	16.05.2001	FR M01 Not yet paid
	16.05.2001	NL M01 Not yet paid
	Penalty fee Rule 85b EPC 1973
	16.05.2001	M01 Not yet paid
	Additional fee for renewal fee
	31.10.2001	06 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]EP0470559 (SIEMENS AG [DE]) [X] 1-3,5 * column 2, line 23 - line 34 * * column 4, line 28 - line 35 * * figures 1,2 *;
		[X]JPH0582677 ;
		[A]JPH07122677 ;
		[A]JPS6276747 ;
		[A]JPS59193033
		[X] - TRIBBEY D A ET AL, "SILICON-CARBON RESIN (GLOB TOP) OVER SILICONE DIE COAT FOR REDUCED STRESS ENCAPSULATION", MOTOROLA TECHNICAL DEVELOPMENTS, (19920501), vol. 15, page 119, XP000306172 [X] 1,4,5 * the whole document *
		[X] - PATENT ABSTRACTS OF JAPAN, (19930803), vol. 017, no. 415, Database accession no. (E - 1407), & JP05082677 A 19930402 (SANYO ELECTRIC CO LTD) [X] 1 * abstract *
		[A] - PENNISI R ET AL, "A NEW LIQUID ENCAPSULANT FOR IC PACKAGING", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), SAN DIEGO, MAY 18 - 20, 1992, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, (19920518), no. CONF. 42, pages 1015 - 1017, XP000474050 [A] 1 * page 1015, paragraph 2; figure 2 * * page 1016, paragraph 5 * DOI: http://dx.doi.org/10.1109/ECTC.1992.204329
		[A] - PATENT ABSTRACTS OF JAPAN, (19950929), vol. 095, no. 008, & JP07122677 A 19950512 (HITACHI LTD;OTHERS: 01) [A] 1 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19870908), vol. 011, no. 277, Database accession no. (E - 538), & JP62076747 A 19870408 (SHINDENGEN ELECTRIC MFG CO LTD) [A] 2,3 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19850307), vol. 009, no. 053, Database accession no. (E - 301), & JP59193033 A 19841101 (MATSUSHITA DENKI SANGYO KK) [A] 2,3 * abstract *

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.25; 35p