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EP1071126
European procedure
Extract from the Register of European Patents
EP About this file: EP1071126
| EP1071126 - Microcap wafer-level package with vias [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.10.2007 Database last updated on 22.08.2024 | Most recent event Tooltip | 26.09.2008 | Lapse of the patent in a contracting state | published on 29.10.2008 [2008/44] | Applicant(s) | For all designated states Avago Technologies Wireless IP (Singapore) Pte. Ltd. No. 1 Yishun Avenue 7 Singapore 768923 / SG | [2006/52] |
| Former [2006/49] | For all designated states Agilent Technologies, Inc. (a Delaware corporation) 395 Page Mill Road Palo Alto, CA 94303 / US | ||
| Former [2001/41] | For all designated states Agilent Technologies, Inc. (a Delaware corporation) 395 Page Mill Road Palo Alto, CA 94303 / US | ||
| Former [2001/32] | For all designated states Agilent Technologies Inc. a Delaware Corporation 395 Page Mill Road Palo Alto, CA 94303 / US | ||
| Former [2001/31] | For all designated states Agilent Technologies Inc. a Delaware Corporation 395 Page Mill Road Palo Alto, CA 94303 / US | ||
| Former [2001/04] | For all designated states Agilent Technologies Inc 395 Page Mill Road Palo Alto, CA 94306-2024 / US | Inventor(s) | 01 /
Ruby, Richard C. 567 Ninth Ave. Menlo Park, CA 94025 / US | 02 /
Bell, Tracy E. 195 W. Rincon Ave., Apt. 4 Campbell, CA 95008 / US | 03 /
Geefay, Frank S. 7961 Sunderland Dr. Cupertino, CA 95014 / US | 04 /
Desai, Yogesh M. 2202 Meadowgate Way San Jose, CA 95132 / US | [2001/04] | Representative(s) | Dilg, Haeusler, Schindelmann Patentanwaltsgesellschaft mbH Leonrodstraße 58 80636 München / DE | [N/P] |
| Former [2007/37] | Dilg, Haeusler, Schindelmann Patentanwaltsgesellschaft mbH Nußbaumstrasse 6 80336 München / DE | ||
| Former [2007/12] | Schoppe, Fritz, et al Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246 82043 Pullach bei München / DE | ||
| Former [2001/04] | Liesegang, Eva Forrester & Boehmert, Franz-Joseph-Strasse 38 80801 München / DE | Application number, filing date | 00113697.7 | 28.06.2000 | [2001/04] | Priority number, date | US19990360859 | 23.07.1999 Original published format: US 360859 | [2001/04] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1071126 | Date: | 24.01.2001 | Language: | EN | [2001/04] | Type: | A3 Search report | No.: | EP1071126 | Date: | 07.07.2004 | [2004/28] | Type: | B1 Patent specification | No.: | EP1071126 | Date: | 06.12.2006 | Language: | EN | [2006/49] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.05.2004 | Classification | IPC: | H01L23/055, H01L23/10, H01L23/04, H01L23/48, H01L23/485 | [2006/28] | CPC: |
B81B7/007 (EP,US);
H01L23/04 (EP,US);
H01L23/055 (EP,US);
H01L23/10 (EP,US);
H01L23/481 (EP,US);
H01L24/05 (EP,US);
H01L24/48 (EP,US);
H01L2224/04042 (EP,US);
H01L2224/05083 (EP,US);
H01L2224/05093 (EP,US);
H01L2224/05096 (EP,US);
H01L2224/05109 (EP,US);
H01L2224/05138 (EP,US);
H01L2224/05155 (EP,US);
H01L2224/05166 (EP,US);
H01L2224/05171 (EP,US);
H01L2224/05599 (EP,US);
H01L2224/05624 (EP,US);
H01L2224/05639 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/05647 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/48463 (EP,US);
H01L2224/85399 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01022 (EP,US);
H01L2924/01023 (EP,US);
H01L2924/01024 (EP,US);
H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01031 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01049 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
| C-Set: |
H01L2224/04042, H01L2924/00 (EP,US);
H01L2224/05138, H01L2924/01014 (US,EP);
H01L2224/05624, H01L2924/00014 (US,EP);
H01L2224/48463, H01L2924/00014 (US,EP);
H01L2224/85399, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US); |
| Former IPC [2001/04] | H01L21/48, H01L21/768, H01L23/498, H01L23/055, H01L23/10 | Designated contracting states | DE, FR, GB [2005/13] |
| Former [2001/04] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Verpackung auf Waferebene unter Verwendung einer Mikrokappe mit Vias | [2001/04] | English: | Microcap wafer-level package with vias | [2001/04] | French: | Boîtier à l'échelle d'une plaquette semiconductrice comprenant un micro-capuchon avec des vias | [2001/04] | Examination procedure | 09.12.2004 | Examination requested [2005/06] | 06.12.2005 | Despatch of a communication from the examining division (Time limit: M04) | 06.04.2006 | Reply to a communication from the examining division | 19.06.2006 | Communication of intention to grant the patent | 29.09.2006 | Fee for grant paid | 29.09.2006 | Fee for publishing/printing paid | Opposition(s) | 07.09.2007 | No opposition filed within time limit [2007/46] | Fees paid | Renewal fee | 24.06.2002 | Renewal fee patent year 03 | 23.06.2003 | Renewal fee patent year 04 | 23.06.2004 | Renewal fee patent year 05 | 21.06.2005 | Renewal fee patent year 06 | 28.06.2006 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 02.07.2007 | [2008/44] | Documents cited: | Search | [X]JPH09162690 ; | [A]US5006922 (MCSHANE MICHAEL B [US], et al) [A] 1-10 * abstract ** column 2, line 5 - line 45 *; | [XA]EP0609062 (TRW INC [US]) [X] 1,2,8 * abstract * * column 2, line 49 - column 3, line 36 * * column 4, line 28 - column 6, line 20 * * claims 1,7,8 * [A] 3-7,9,10; | [A]EP0615289 (SUMITOMO ELECTRIC INDUSTRIES [JP]) [A] 1-10 * abstract * * column 1, line 36 - column 2, line 54 *; | [XA]WO9422168 (OLIN CORP [US]) [X] 1,2,8,9 * abstract * * claims 1,21 * * page 8, line 4 - line 24 * * page 17, line 1 - page 18, line 25 * [A] 3-7,10 | [X] - PATENT ABSTRACTS OF JAPAN, (19971031), vol. 1997, no. 10, & JP09162690 A 19970620 (ROHM CO LTD) [X] 1,2,8 * abstract * |