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Extract from the Register of European Patents

EP About this file: EP1085565

EP1085565 - Semiconductor device having sealing film formed on the surface having columnar electrodes thereon and method of manufacturing the same [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  02.02.2007
Database last updated on 20.09.2024
Most recent event   Tooltip02.02.2007Application deemed to be withdrawnpublished on 07.03.2007  [2007/10]
Applicant(s)For all designated states
CASIO COMPUTER CO., LTD.
6-2, Hon-machi 1-chome Shibuya-ku
Tokyo / JP
[N/P]
Former [2001/12]For all designated states
Casio Computer Co., Ltd.
6-2, Hon-machi 1-chome
Shibuya-ku, Tokyo / JP
Inventor(s)01 / Osamu, Kuwabara
1-33-9, Minamiogikubo, Suginami-ku
Tokyo / JP
 [2001/12]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [2001/12]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date00116963.007.08.2000
[2001/12]
Priority number, dateJP1999026061414.09.1999         Original published format: JP 26061499
[2001/12]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1085565
Date:21.03.2001
Language:EN
[2001/12]
Type: A3 Search report 
No.:EP1085565
Date:04.07.2001
[2001/27]
Search report(s)(Supplementary) European search report - dispatched on:EP23.05.2001
ClassificationIPC:H01L21/56
[2001/12]
CPC:
H01L21/56 (EP,US); H01L23/492 (KR); H01L2924/0002 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   NL [2002/13]
Former [2001/12]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Halbleiterbauelement mit einer Abdichtfolie, die über der Oberfläche mit darüberliegenden säulenförmigen Elektroden hergestellt wird, und Verfahren zu deren Herstellung[2001/12]
English:Semiconductor device having sealing film formed on the surface having columnar electrodes thereon and method of manufacturing the same[2001/12]
French:Dispositif à semiconducteur avec un film d'étanchéité formé sur la surface sur laquelle on trouve des électrodes en forme de colonne, et son procédé de fabrication[2001/12]
Examination procedure07.08.2000Examination requested  [2001/12]
26.04.2006Despatch of a communication from the examining division (Time limit: M04)
07.09.2006Application deemed to be withdrawn, date of legal effect  [2007/10]
17.10.2006Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2007/10]
Fees paidRenewal fee
14.08.2002Renewal fee patent year 03
13.08.2003Renewal fee patent year 04
12.08.2004Renewal fee patent year 05
12.08.2005Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
31.08.200607   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XAY]JPH07183425  ;
 [YA]JPH05129373  ;
 [Y]JPH04346235  ;
 [PX]JP2000208535  ;
 [A]US5232651  (OKUNO ATSUSHI [JP], et al) [A] 1,3,10-12,19 * figure 9A * * column 2, line 36 - column 3, line 61 * * column 7, line 60 - column 8, line 30 *;
 [XA]US5650667  (LIOU SHIANN-MING [US]) [X] 1,2,9 * figures 1-3 * * column 2, line 49 - line 67 * * column 3, line 19 - line 56 * [A] 10,30,32;
 [XA]US5908317  (HEO YOUNGWOOK [KR]) [X] 1,2,4,9,32-35 * figures 1-3,6 * * column 3, line 66 - column 7, line 7 * [A] 3,5-8,10-31;
 [PX]EP0993040  (JAPAN REC CO LTD [JP]) [PX] 1,2,4,6-10,13-19,22,32-34 * figures 1-13 * * paragraphs [0027] - [0042] *;
 [E]EP1085564  (CASIO COMPUTER CO LTD [JP]) [E] 1-35 * figures 1-12 ** paragraphs [0010] - [0026] *
 [XAY]  - PATENT ABSTRACTS OF JAPAN, (19951130), vol. 1995, no. 10, & JP07183425 A 19950721 (TOSHIBA CORP) [X] 1,2,4,6-8,17,31-35 * abstract * [A] 3,5,9,11,12,14 [Y] 10,13,15,16,19-28
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19930909), vol. 017, no. 501, Database accession no. (E - 1429), & JP05129373 A 19930525 (NEC CORP) [Y] 10,13,15,16 * abstract * [A] 1-7,11,12,14,26,30-35
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19930421), vol. 017, no. 203, Database accession no. (E - 1354), & JP04346235 A 19921202 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 19-28 * abstract *
 [PX]  - PATENT ABSTRACTS OF JAPAN, (20001117), vol. 2000, no. 10, & JP2000208535 A 20000728 (SHINKO ELECTRIC IND CO LTD) [PX] 1,4,6,7,10,13,15,16,19,32-35 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.