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EP1094499
European procedure
Extract from the Register of European Patents
EP About this file: EP1094499
| EP1094499 - Heating apparatus for bump bonding and bump bonding method [Right-click to bookmark this link] | |||
| Former [2001/17] | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus | ||
| [2008/41] | Status | No opposition filed within time limit Status updated on 07.05.2010 Database last updated on 18.11.2024 | Most recent event Tooltip | 03.12.2010 | Lapse of the patent in a contracting state | published on 05.01.2011 [2011/01] | Applicant(s) | For all designated states Panasonic Corporation 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [N/P] |
| Former [2008/47] | For all designated states Panasonic Corporation 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | ||
| Former [2001/17] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 / JP | Inventor(s) | 01 /
Narita, Shoriki 45-2-1104, Sakuragaoka-cho Hirakata-shi, Osaka-fu, 573-0018 / JP | 02 /
Imanishi, Makoto 24-5-509, Korikitano-cho Neyagawa-shi, Osaka-fu, 572-0080 / JP | 03 /
Mae, Takaharu 305-4-410, Nagao-tanimachi 1-chome Hirakata-shi, Osaka-fu, 573-0164 / JP | 04 /
Watanabe, Nobuhisa 39-1-105, Senriyama-takatsuka Suita-shi, Osaka-fu 565-0848 / JP | 05 /
Kanayama, Shinji 3-11-1-102, Shirakashi-cho Kashihara-shi Nara-ken 634-0051 / JP | [2001/17] | Representative(s) | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Postfach 10 60 78 28060 Bremen / DE | [N/P] |
| Former [2001/17] | Eisenführ, Speiser & Partner Martinistrasse 24 28195 Bremen / DE | Application number, filing date | 00122813.9 | 19.10.2000 | [2001/17] | Priority number, date | JP19990296631 | 19.10.1999 Original published format: JP 29663199 | [2001/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1094499 | Date: | 25.04.2001 | Language: | EN | [2001/17] | Type: | A3 Search report | No.: | EP1094499 | Date: | 15.06.2005 | [2005/24] | Type: | B1 Patent specification | No.: | EP1094499 | Date: | 01.07.2009 | Language: | EN | [2009/27] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.05.2005 | Classification | IPC: | H01L21/00 | [2001/17] | CPC: |
H01L21/67103 (EP,US);
H01L21/68 (EP,US)
| Designated contracting states | DE, GB [2006/10] |
| Former [2001/17] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Heizungsvorrichtung zum Bonden mittels Löthocker und Löthocker Bondenverfahren | [2008/41] | English: | Heating apparatus for bump bonding and bump bonding method | [2008/41] | French: | Dispositif de chauffage pour connecter des plots de contact et méthode de connection des plots | [2008/41] |
| Former [2001/17] | Heizungsvorrichtung zum Bonden mittels Löthocker, Löthocker Bondenverfahren und Löthockerherstellungsvorrichtung | ||
| Former [2001/17] | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus | ||
| Former [2001/17] | Dispositif de chauffage pour connecter des plots de contact, méthode de connection des plots et dispositif de formation des plots | Examination procedure | 15.12.2005 | Examination requested [2006/06] | 27.02.2006 | Despatch of a communication from the examining division (Time limit: M04) | 28.06.2006 | Reply to a communication from the examining division | 23.08.2006 | Despatch of a communication from the examining division (Time limit: M04) | 27.12.2006 | Reply to a communication from the examining division | 03.03.2009 | Communication of intention to grant the patent | 25.05.2009 | Fee for grant paid | 25.05.2009 | Fee for publishing/printing paid | Opposition(s) | 06.04.2010 | No opposition filed within time limit [2010/23] | Fees paid | Renewal fee | 31.10.2002 | Renewal fee patent year 03 | 31.10.2003 | Renewal fee patent year 04 | 02.11.2004 | Renewal fee patent year 05 | 31.10.2005 | Renewal fee patent year 06 | 31.10.2006 | Renewal fee patent year 07 | 31.10.2007 | Renewal fee patent year 08 | 19.03.2008 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 19.10.2009 | [2011/01] | Documents cited: | Search | [XY]JPH06232131 ; | [YA]JPH05299492 ; | [XY]US4578032 (MILLER C FREDRICK [US]) [X] 1,2,9,10,12 * abstract * * column 1, lines 35-30 * * column 2, lines 5-31 * * column 4, lines 10-13 * [Y] 5,7,11 | [XY] - PATENT ABSTRACTS OF JAPAN, (19941115), vol. 018, no. 599, Database accession no. (E - 1631), & JP06232131 A 19940819 (TOSHIBA CORP) [X] 1-3,6,10 * abstract * [Y] 5 | [YA] - PATENT ABSTRACTS OF JAPAN, (19940216), vol. 018, no. 095, Database accession no. (E - 1509), & JP05299492 A 19931112 (NACHI FUJIKOSHI CORP) [Y] 7,11 * abstract * [A] 1,10 |