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EP1076355
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EP About this file: EP1076355
| EP1076355 - Method and apparatus for cleaning a chamber configured for copper deposition [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 06.08.2004 Database last updated on 06.07.2024 | Most recent event Tooltip | 06.08.2004 | Application deemed to be withdrawn | published on 22.09.2004 [2004/39] | Applicant(s) | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | [N/P] |
| Former [2001/07] | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, California 95054 / US | Inventor(s) | 01 /
Pavate, Vikram 1800 Stokes Street No. 164 San Jose, California 95126 / US | 02 /
Sung, Bing XI 51 Peter Coutts Circle Stanford, California 94305 / US | 03 /
Ding, Peijum 1020 W Riverside Way San Jose, California 95129 / US | 04 /
Hong, Ilyoung R. 5233 Rio Lobo Drive San Jose, California 95136 / US | 05 /
Chin, Barryl L. 13174 Cumberland Drive Saratoga, California 95070 / US | [2001/07] | Representative(s) | Bayliss, Geoffrey Cyril, et al BOULT WADE TENNANT Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | [N/P] |
| Former [2001/07] | Bayliss, Geoffrey Cyril, et al BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | Application number, filing date | 00306846.7 | 10.08.2000 | [2001/07] | Priority number, date | US19990373103 | 12.08.1999 Original published format: US 373103 | [2001/07] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1076355 | Date: | 14.02.2001 | Language: | EN | [2001/07] | Classification | IPC: | H01L21/00 | [2001/07] | CPC: |
C23C14/564 (EP);
H01J37/32862 (EP);
H01L21/20 (KR)
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE [2001/07] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | SI | Not yet paid | Title | German: | Verfahren und Vorrichtung zum Reinigen einer Kupferplattierungskammer | [2001/07] | English: | Method and apparatus for cleaning a chamber configured for copper deposition | [2001/07] | French: | Méthode et procédé pour nettoyer une chambre de dépot de cuivre | [2001/07] | Examination procedure | 02.03.2004 | Application deemed to be withdrawn, date of legal effect [2004/39] | 22.04.2004 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2004/39] | Fees paid | Renewal fee | 02.08.2002 | Renewal fee patent year 03 | Penalty fee | Additional fee for renewal fee | 31.08.2003 | 04 M06 Not yet paid |
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