EP1101839 - Methods and apparatus for forming metal layers on substrates [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 17.12.2004 Database last updated on 02.11.2024 | Most recent event Tooltip | 17.12.2004 | Application deemed to be withdrawn | published on 02.02.2005 [2005/05] | Applicant(s) | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | [N/P] |
Former [2001/21] | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, California 95054 / US | Inventor(s) | 01 /
Dordi, Yezdi 104 Water Hays Drive Palo Alto, California 94303 / US | 02 /
Sugarman, Michael 134 Belvedere Street San Francisco, California 94117 / US | [2001/21] | Representative(s) | Bayliss, Geoffrey Cyril, et al BOULT WADE TENNANT Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | [N/P] |
Former [2001/21] | Bayliss, Geoffrey Cyril, et al BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | Application number, filing date | 00310208.4 | 17.11.2000 | [2001/21] | Priority number, date | US19990443832 | 19.11.1999 Original published format: US 443832 | [2001/21] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1101839 | Date: | 23.05.2001 | Language: | EN | [2001/21] | Type: | A3 Search report | No.: | EP1101839 | Date: | 21.01.2004 | [2004/04] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.12.2003 | Classification | IPC: | C25D7/12, C25F3/14, C23F1/02 | [2004/04] | CPC: |
C25D7/123 (EP,US);
H01L21/20 (KR);
H01L21/76877 (US);
C25D17/001 (EP,US);
H01L21/2885 (EP,US);
H01L21/76873 (EP)
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Former IPC [2001/21] | C25D7/12 | Designated contracting states | (deleted) [2004/42] |
Former [2001/21] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Verfahren und Vorrichtung zur Bildung von Metallschichten auf Substraten | [2001/21] | English: | Methods and apparatus for forming metal layers on substrates | [2001/21] | French: | Procédé et appareil pour la formation de couches metalliques sur des substrats | [2001/21] | Examination procedure | 08.06.2004 | Application deemed to be withdrawn, date of legal effect [2005/05] | 30.08.2004 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2005/05] | Fees paid | Renewal fee | 11.11.2002 | Renewal fee patent year 03 | 07.11.2003 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]WO9946064 (SEMITOOL INC [US], et al) [X] 1,2,10,15,20 * figures 2A-D * * page 3, paragraphs 2,3 * * page 5, line 29 - page 6, line 25 * * page 11, lines 3-14 *; | [PX]US6056869 (UZOH CYPRIAN EMEKA [US]) [PX] 1,2,10 * column 1, paragraph 1 * * column 2, lines 7-36 * * column 4, lines 21-41 * * column 5, lines 9-11,23-31 * * column 9, lines 14-31 * * claims 1,6,19,28 * |