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EP1049140
European procedure
Extract from the Register of European Patents
EP About this file: EP1049140
| EP1049140 - Apparatus and method for mounting semiconductor chips on a substrate [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 16.06.2006 Database last updated on 03.09.2024 | Most recent event Tooltip | 12.10.2007 | Lapse of the patent in a contracting state | published on 14.11.2007 [2007/46] | Applicant(s) | For all designated states Unaxis International Trading Ltd Hinterbergstrasse 32 Postfach 5503 6330 Cham / CH | [N/P] |
| Former [2005/28] | For all designated states Unaxis International Trading Ltd Hinterbergstrasse 32 Postfach 5503 6330 Cham / CH | ||
| Former [2001/09] | For all designated states ESEC Trading SA Hinterbergstr. 32, Postfach 5503 6330 Cham / CH | ||
| Former [2000/44] | For all designated states Esec SA Hinterbergstrasse 32, Postfach 5503 6330 Cham / CH | Inventor(s) | 01 /
Stalder, Roland Querstrasse 16 8050 Zürich / CH | [2000/44] | Representative(s) | Falk, Urs Patentanwaltsbüro Dr. Urs Falk Eichholzweg 9A 6312 Steinhausen / CH | [N/P] |
| Former [2000/44] | Falk, Urs, Dr. Patentanwaltsbüro Dr. Urs Falk, Eichholzweg 9A 6312 Steinhausen / CH | Application number, filing date | 00810354.1 | 25.04.2000 | [2000/44] | Priority number, date | EP19990810367 | 30.04.1999 Original published format: EP 99810367 | [2000/44] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP1049140 | Date: | 02.11.2000 | Language: | DE | [2000/44] | Type: | B1 Patent specification | No.: | EP1049140 | Date: | 10.08.2005 | Language: | DE | [2005/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.07.2000 | Classification | IPC: | H01L21/00 | [2000/44] | CPC: |
H01L21/67132 (EP);
H01L21/681 (EP);
H01L21/6838 (EP);
H01L2221/68322 (EP)
| Designated contracting states | AT, CH, DE, LI [2001/29] |
| Former [2000/44] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Einrichtung und Verfahren zur Montage von Halbleiterchips auf einem Substrat | [2000/44] | English: | Apparatus and method for mounting semiconductor chips on a substrate | [2000/44] | French: | Dispositif et méthode pour le montage de puces semi-conductrices sur un substrat | [2000/44] | Examination procedure | 02.05.2001 | Examination requested [2001/27] | 25.06.2004 | Communication of intention to grant the patent | 20.07.2004 | Fee for grant paid | 20.07.2004 | Fee for publishing/printing paid | Opposition(s) | 11.05.2006 | No opposition filed within time limit [2006/29] | Fees paid | Renewal fee | 02.05.2002 | Renewal fee patent year 03 | 02.05.2003 | Renewal fee patent year 04 | 03.05.2004 | Renewal fee patent year 05 | 02.05.2005 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 25.04.2006 | [2007/46] | Documents cited: | Search | [A]US4667402 (WILDE RUEDIGER [DE]) [A] 1,6 * the whole document *; | [A]EP0565781 (MIROSLAV TRESKY DR ING [CH]) [A] 1,6 * the whole document * |