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EP1116800

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EP About this file: EP1116800

EP1116800 - SPUTTERING TARGET [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 28.05.2010 Database last updated on 05.10.2024
Most recent event Tooltip	28.05.2010	No opposition filed within time limit	published on 30.06.2010 [2010/26]
Applicant(s)	For all designated states Nippon Mining & Metals Co., Ltd. 10-1, Toranomon 2-chome Minato-ku Tokyo / JP
	[2006/38]
Former [2005/20]	For all designated states Nikko Materials Co., Ltd. 10-1, Toranomon 2-chome, Minato-ku Tokyo 105-8407 / JP
Former [2001/29]	For all designated states Nikko Materials Company, Limited 10-1, Toranomon 2-chome, Minato-ku Tokyo 105-8407 / JP
Inventor(s)	01 / KUMAHARA, Yoshikazu, Isohara Fact. Nikko Materials Comp., Ltd, 4, 187-banchi, Usuba, Hanakawa-cho Kitaibaraki-shi, Ibaraki-ken 319-1535 / JP
	02 / ISHIZUKA, Keiichi, Isohara Fact. Nikko Materials Comp., Ltd, 4, 187-banchi, Usuba, Hanakawa-cho Kitaibaraki-shi, Ibaraki-ken 319-1535 / JP
	[2001/29]
Representative(s)	Hoarton, Lloyd Douglas Charles, et al Forresters IP LLP Skygarden Erika-Mann-Strasse 11 80636 München / DE
	[N/P]
Former [2008/44]	Hoarton, Lloyd Douglas Charles, et al Forrester & Boehmert Pettenkoferstrasse 20-22 80336 Munich / DE
Former [2007/18]	Hoarton, Lloyd Douglas Charles, et al Forrester & Boehmert Pettenkoferstrasse 20-22 80336 München / DE
Former [2001/29]	Meddle, Alan Leonard FORRESTER & BOEHMERT Franz-Joseph-Strasse 38 80801 München / DE
Application number, filing date	00922926.1	01.05.2000
	[2001/29]
	WO2000JP02865
Priority number, date	JP19990201360	15.07.1999 Original published format: JP 20136099
	[2001/29]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO0106029
	Date:	25.01.2001
	Language:	EN
	[2001/04]
	Type:	A1 Application with search report
	No.:	EP1116800
	Date:	18.07.2001
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 25.01.2001 takes the place of the publication of the European patent application.
	[2001/29]
	Type:	B1 Patent specification
	No.:	EP1116800
	Date:	22.07.2009
	Language:	EN
	[2009/30]
Search report(s)	International search report - published on:	JP	25.01.2001
	(Supplementary) European search report - dispatched on:	EP	27.07.2004
Classification	IPC:	C23C14/34	[2001/29]
	CPC:	C23C14/3414 (EP,US); C23C14/34 (KR); C23C14/3407 (EP,US)
Designated contracting states	CH, DE, LI [2004/20]
Former [2001/29]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE
Title	German:	SPUTTERTARGET	[2001/29]
	English:	SPUTTERING TARGET	[2001/29]
	French:	CIBLE DE PULVERISATION	[2001/29]
Entry into regional phase	23.01.2001	Translation filed
	23.01.2001	National basic fee paid
	23.01.2001	Search fee paid
	23.01.2001	Designation fee(s) paid
	23.01.2001	Examination fee paid
Examination procedure	23.01.2001	Examination requested [2001/29]
	27.10.2004	Amendment by applicant (claims and/or description)
	02.10.2006	Despatch of a communication from the examining division (Time limit: M04)
	03.01.2007	Reply to a communication from the examining division
	01.04.2009	Communication of intention to grant the patent
	08.05.2009	Fee for grant paid
	08.05.2009	Fee for publishing/printing paid
Opposition(s)	23.04.2010	No opposition filed within time limit [2010/26]
Fees paid	Renewal fee
	14.05.2002	Renewal fee patent year 03
	13.05.2003	Renewal fee patent year 04
	13.05.2004	Renewal fee patent year 05
	12.05.2005	Renewal fee patent year 06
	23.03.2006	Renewal fee patent year 07
	14.05.2007	Renewal fee patent year 08
	28.03.2008	Renewal fee patent year 09
	12.05.2009	Renewal fee patent year 10
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XY]JPH10182151 ;
		[PX]US5997704 (SHIONO ICHIROU [JP], et al) [PX] 1,2,7 * column 2, lines 48-59 *;
		[X]JPH10310471 ;
		[Y]US4662124 (KATO ICHIRO [JP], et al) [Y] 2,3 * the whole document *;
		[E]JP2001131737 ;
		[A]JPS59197568 ;
		[A]JPS61291964
		[XY] - PATENT ABSTRACTS OF JAPAN, (19981031), vol. 1998, no. 12, & JP10182151 A 19980707 (MORO SATORU ET AL) [X] 1,4,5,7 * abstract * [Y] 2,3,6
		[X] - PATENT ABSTRACTS OF JAPAN, (19990226), vol. 1999, no. 02, & JP10310471 A 19981124 (MITSUBISHI MATERIALS CORP) [X] 1 * abstract *
		[Y] - PATENT ABSTRACTS OF JAPAN, (19980227), vol. 1998, no. 03, & JP9287072 A 19971104 (JAPAN ENERGY CORP) [Y] 6 * abstract *
		[E] - PATENT ABSTRACTS OF JAPAN, (20010309), vol. 2000, no. 22, & JP2001131737 A 20010515 (NIKKO MATERIALS CO LTD) [E] 1-7 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19850326), vol. 0090, no. 66, Database accession no. (C - 271), & JP59197568 A 19841109 (MATSUSHITA DENKI SANGYO KK) [A] 1-7 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19870526), vol. 0111, no. 63, Database accession no. (C - 424), & JP61291964 A 19861222 (ANELVA CORP) [A] 1-7 * abstract *
	International search	[A]US4662124 (KATO ICHIRO [JP], et al);
		[A]JPH10298743 (TOSOH CORP);
		[A] - FUKUI,T. ET AL, "Warpage of InP wafers.", CONFERENCE PROCEEDINGS IEEE INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS, (1997), vol. 9, pages 272 - 275, XP000801135

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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