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Extract from the Register of European Patents

EP About this file: EP1098366

EP1098366 - Semiconductor connection structure and method [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  23.01.2009
Database last updated on 02.09.2024
Most recent event   Tooltip23.01.2009Application deemed to be withdrawnpublished on 25.02.2009  [2009/09]
Applicant(s)For all designated states
STMicroelectronics, Inc.
1310 Electronics Drive Carrollton
Texas 75006-6000 / US
[N/P]
Former [2001/19]For all designated states
STMicroelectronics, Inc.
1310 Electronics Drive
Carrollton, Texas 75006-6000 / US
Inventor(s)01 / Miller, Robert O.
3727 Cannon Gate Circle
Carrollton, Texas 75007 / US
02 / Smith, Gregory C.
1505 Shonlea Drive
Carrollton, Texas 75007 / US
 [2001/19]
Representative(s)Driver, Virginia Rozanne, et al
Page White & Farrer Limited
Bedford House
21A John Street
London WC1N 2BF / GB
[N/P]
Former [2004/35]Driver, Virginia Rozanne, et al
Page White & Farrer 54 Doughty Street
London WC1N 2LS / GB
Former [2001/19]Palmer, Roger, et al
PAGE, WHITE & FARRER 54 Doughty Street
London WC1N 2LS / GB
Application number, filing date01100643.405.12.1995
[2001/19]
Priority number, dateUS1994036621529.12.1994         Original published format: US 366215
[2001/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1098366
Date:09.05.2001
Language:EN
[2001/19]
Search report(s)(Supplementary) European search report - dispatched on:EP22.03.2001
ClassificationIPC:H01L23/522, H01L23/532
[2001/19]
CPC:
H01L21/76843 (EP,US); H01L21/76849 (EP,US); H01L21/76865 (EP,US);
H01L21/76877 (EP,US); H01L21/76879 (EP,US); H01L21/76885 (EP,US);
H01L23/5226 (EP,US); H01L23/53223 (EP,US); H01L2924/0002 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT [2001/19]
TitleGerman:Halbleiterverbindungsstruktur und Verfahren[2001/19]
English:Semiconductor connection structure and method[2001/19]
French:Structure de connexion pour semiconducteur et procédé[2001/19]
Examination procedure08.11.2001Examination requested  [2002/01]
15.04.2002Despatch of a communication from the examining division (Time limit: M04)
15.07.2002Reply to a communication from the examining division
17.04.2003Despatch of a communication from the examining division (Time limit: M04)
21.08.2003Reply to a communication from the examining division
23.06.2005Despatch of a communication from the examining division (Time limit: M04)
10.10.2005Reply to a communication from the examining division
22.04.2008Despatch of a communication from the examining division (Time limit: M04)
03.09.2008Application deemed to be withdrawn, date of legal effect  [2009/09]
10.10.2008Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2009/09]
Parent application(s)   TooltipEP95308801.0  / EP0720228
Fees paidRenewal fee
17.01.2001Renewal fee patent year 03
17.01.2001Renewal fee patent year 04
17.01.2001Renewal fee patent year 05
17.01.2001Renewal fee patent year 06
27.12.2001Renewal fee patent year 07
30.12.2002Renewal fee patent year 08
24.12.2003Renewal fee patent year 09
11.10.2004Renewal fee patent year 10
15.12.2005Renewal fee patent year 11
13.12.2006Renewal fee patent year 12
12.12.2007Renewal fee patent year 13
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Documents cited:Search[A]EP0448276  (AMERICAN TELEPHONE & TELEGRAPH [US]) [A] 1 * column 3, line 1 - column 6, line 27; figures 1-6 *;
 [Y]US5070391  (LIOU FU-TAI [US], et al) [Y] 1,2,4-9 * column 2, line 31 - column 4, line 41; figures 1-6 *;
 [A]EP0506426  (SGS THOMSON MICROELECTRONICS [US]) [A] 1 * column 5, line 51 - column 10, line 28; figures 3A-3H *;
 [YA]DE4306322  (MITSUBISHI ELECTRIC CORP [JP]) [Y] 1,2,4-9 * column 6, line 61 - column 7, line 60; figures 1-6 * [A] 7,10;
 [A]EP0561132  (IBM [US]) [A] 1* sentence 9 - sentence 52; figures 4A-4E *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.