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Extract from the Register of European Patents

EP About this file: EP1266715

EP1266715 - Gold wire bonding at room temperature [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  13.06.2003
Database last updated on 16.11.2024
Most recent event   Tooltip12.06.2009Change - representativepublished on 15.07.2009  [2009/29]
Applicant(s)For all designated states
Agilent Technologies, Inc. (A Delaware Corporation)
395 Page Mill Road
Palo Alto CA 94303 / US
[N/P]
Former [2002/51]For all designated states
Agilent Technologies, Inc. (a Delaware corporation)
395 Page Mill Road
Palo Alto, CA 94303 / US
Inventor(s)01 / Chen, Kim H.
852 Beaver Court
Fremont, California 94539 / US
02 / Chan, Chun Yee
79 Yuk Tong Ave.
Singapore 596380 / SG
03 / Choi, Soojin
2890 Mauricia Ave.
Santa Clara, California 95051 / US
04 / Nigos, Johnny Monis
Block 616 Bedok Reservoir Rd. 07-1120
Singapore 470616 / SG
 [2002/51]
Representative(s)Schoppe, Fritz
Schoppe, Zimmermann, Stöckeler & Zinkler
Patentanwälte
Postfach 246
82043 Pullach bei München / DE
[N/P]
Former [2009/29]Schoppe, Fritz
Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246
82043 Pullach bei München / DE
Former [2002/51]Schoppe, Fritz, Dipl.-Ing.
Patentanwälte Schoppe, Zimmermann, Stöckeler & Zinkler, Postfach 71 08 67
81458 München / DE
Application number, filing date01130915.027.12.2001
[2002/51]
Priority number, dateUS2001088213514.06.2001         Original published format: US 882135
[2002/51]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1266715
Date:18.12.2002
Language:EN
[2002/51]
Search report(s)(Supplementary) European search report - dispatched on:EP12.09.2002
ClassificationIPC:B23K20/00, H01L21/607, H01L23/49
[2002/51]
CPC:
H01L24/85 (EP,US); B23K20/004 (EP,US); H01L24/78 (EP,US);
H01L2224/05644 (EP,US); H01L2224/45015 (EP,US); H01L2224/45144 (EP,US);
H01L2224/48463 (EP,US); H01L2224/48644 (EP,US); H01L2224/78301 (EP,US);
H01L2224/85099 (EP,US); H01L2224/85201 (EP,US); H01L2224/85203 (EP,US);
H01L2224/85205 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01018 (EP,US);
H01L2924/01033 (EP,US); H01L2924/01074 (EP,US); H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/01327 (EP,US);
H01L2924/14 (EP,US); H01L2924/20102 (EP,US); H01L2924/20305 (EP,US);
H01L2924/20306 (EP,US) (-)
C-Set:
H01L2224/45015, H01L2924/00014, H01L2924/20753 (EP,US);
H01L2224/45015, H01L2924/20753 (EP,US);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00015 (EP,US);
H01L2224/48463, H01L2924/00014 (US,EP);
H01L2224/48644, H01L2924/00 (US,EP);
H01L2224/85099, H01L2224/45144, H01L2924/00 (EP,US);
H01L2224/85203, H01L2924/00 (EP,US);
H01L2224/85205, H01L2224/45144, H01L2924/00 (US,EP)
(-)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE,   TR [2002/51]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
RONot yet paid
SINot yet paid
TitleGerman:Golddraht-Bonden bei Raumtemperatur[2002/51]
English:Gold wire bonding at room temperature[2002/51]
French:Microcablage d'un fil en alliage d'or à température ambiante[2002/51]
Examination procedure03.06.2003Application withdrawn by applicant  [2003/31]
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JPH11214424  ;
 [Y]DE4232745  (UNIV DRESDEN TECH [DE]) [Y] 1,2,9,11,12 * page 2, line 5 * * page 2, line 21 - line 22 *;
 [Y]US5660319  (FALCONE ROBERT J [US], et al) [Y] 1,2,5,6,11 * column 1, lines 54,55 * * column 3, line 11 - line 15 * * column 3, line 34 - line 37 * * column 3, line 58 - line 61; figures 14-19 *;
 [A]EP0822264  (TANAKA ELECTRONICS IND [JP]) [A] 1-11 * page 2, lines 35,36 * * page 6, line 16 - line 20 *;
 [Y]DE19809081  (BOSCH GMBH ROBERT [DE]) [Y] 1,2,5,6,11 * column 2, line 39 - line 46 * * column 3, line 43 - line 44 * * column 3, line 60 - line 61; figures 1F-G *;
 [Y]US6135341  (FALCONE ROBERT J [TW]) [Y] 1,2,9,11,12 * column 2, line 2 - line 5 * * column 2, line 13 - line 16 * * column 2, line 36 - line 39 *;
 [A]US6213378  (SINGH INDERJIT [US]) [A] 1-11* the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19991130), vol. 1999, no. 13, & JP11214424 A 19990806 (HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD) [A] 1-11 * abstract * * paragraphs [0012] - [0015] - [0082]; figures 3,4 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.