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Extract from the Register of European Patents

EP About this file: EP1170397

EP1170397 - Deposition of amorphous silicon films by high density plasma CVD at low temperatures [Right-click to bookmark this link]
StatusThe application has been refused
Status updated on  10.01.2014
Database last updated on 01.01.2025
Most recent event   Tooltip10.01.2014Refusal of applicationpublished on 12.02.2014  [2014/07]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
[N/P]
Former [2002/02]For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, California 95054 / US
Inventor(s)01 / Li, Zhang
533 South Park
San Jose, California 95129 / US
02 / Rossman, Kent
440 Navaro Place No. 118
San Jose, California 95134 / US
03 / Yiin, Tzuyuan
1900 Tiani Ct
San Jose, California 95131 / US
 [2002/13]
Former [2002/02]01 / Li, Zhang
533 South Park
San Jose, California 95129 / US
02 / Rossman, Kent
440 Navaro Place No. 118
San Jose, California 95134 / US
03 / Yiin, Tzuyuan
1504 Ambergrove Drive
San Jose, California 95131 / US
Representative(s)Boult Wade Tennant LLP
Salisbury Square House
8 Salisbury Square
London EC4Y 8AP / GB
[N/P]
Former [2013/51]Boult Wade Tennant
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
Former [2004/34]Setna, Rohan P., et al
Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT / GB
Former [2002/02]Allard, Susan Joyce, et al
BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT / GB
Application number, filing date01305828.405.07.2001
[2002/02]
Priority number, dateUS20000216865P07.07.2000         Original published format: US 216865 P
[2002/02]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1170397
Date:09.01.2002
Language:EN
[2002/02]
Type: A3 Search report 
No.:EP1170397
Date:10.12.2003
[2003/50]
Search report(s)(Supplementary) European search report - dispatched on:EP23.10.2003
ClassificationIPC:C23C16/24, C23C16/507, H01L21/205
[2002/02]
CPC:
H01L21/02667 (EP,KR,US); H01L21/0262 (EP,KR,US); C23C16/24 (EP,KR,US);
C23C16/507 (EP,KR,US); H01L21/02532 (EP,KR,US); H01L21/02592 (KR)
Designated contracting statesDE,   GB [2004/36]
Former [2002/02]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Abscheidung amorpher Siliziumschichten bei niedrigen Temperaturen mittels CVD mit hoher Plasmadichte[2002/02]
English:Deposition of amorphous silicon films by high density plasma CVD at low temperatures[2002/02]
French:Dépôt à température basse de couches de silicium amorphe par CVD au plasma haute densité[2002/02]
Examination procedure09.06.2004Examination requested  [2004/33]
14.08.2009Despatch of a communication from the examining division (Time limit: M04)
17.12.2009Reply to a communication from the examining division
23.06.2010Despatch of a communication from the examining division (Time limit: M04)
29.07.2010Reply to a communication from the examining division
06.09.2011Despatch of a communication from the examining division (Time limit: M04)
16.01.2012Reply to a communication from the examining division
28.08.2013Cancellation of oral proceeding that was planned for 26.09.2013
26.09.2013Date of oral proceedings (cancelled)
27.09.2013Despatch of communication that the application is refused, reason: substantive examination [2014/07]
08.10.2013Application refused, date of legal effect [2014/07]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  14.08.2009
Fees paidRenewal fee
23.05.2003Renewal fee patent year 03
09.07.2004Renewal fee patent year 04
08.07.2005Renewal fee patent year 05
10.07.2006Renewal fee patent year 06
04.07.2007Renewal fee patent year 07
10.07.2008Renewal fee patent year 08
08.07.2009Renewal fee patent year 09
08.07.2010Renewal fee patent year 10
07.07.2011Renewal fee patent year 11
06.07.2012Renewal fee patent year 12
08.07.2013Renewal fee patent year 13
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Documents cited:Search[A]JPH03108318  ;
 [A]JPS6113616  ;
 [XA]US5204272  (GUHA SUBHENDU [US], et al) [X] 1-4,6 * column 9, line 6 - line 20 * [A] 5,7-17;
 [A]GB2311298  (HYUNDAI ELECTRONICS IND [KR], et al) [A] 1-17 * page 8, line 10 - page 9, line 1 *;
 [A]US6083344  (HANAWA HIROJI [US], et al) [A] 5,7-17 * column 5, line 43 - line 58 *;
 [PX]WO0074932  (PENN STATE RES FOUND [US], et al) [PX] 1-4,6* page 12, line 26 - page 14, line 20 *;
 [A]  - PATENT ABSTRACTS OF JAPAN, (19910805), vol. 015, no. 304, Database accession no. (E - 1096), & JP03108318 A 19910508 (NEC CORP) [A] 1-17 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19860606), vol. 010, no. 158, Database accession no. (E - 409), & JP61013616 A 19860121 (FUJITSU KK) [A] 5,7-17 * abstract *
 [A]  - KATO I ET AL, "INFLUENCE OF ION BOMBARDMENT ON A-SI: H FILMS FABRICATED BY PLASMA CHEMICAL VAPOR DEPOSITION", ELECTRONICS & COMMUNICATIONS IN JAPAN, PART II - ELECTRONICS, SCRIPTA TECHNICA. NEW YORK, US, (19950201), vol. 78, no. 2, ISSN 8756-663X, pages 70 - 77, XP000526348 [A] 1-17 * paragraph [0002] *
ExaminationEP0883166
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