EP1189273 - Semiconductor device and production process [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 26.06.2009 Database last updated on 24.08.2024 | Most recent event Tooltip | 26.06.2009 | Application deemed to be withdrawn | published on 29.07.2009 [2009/31] | Applicant(s) | For all designated states SHINKO ELECTRIC INDUSTRIES CO. LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi Nagano 380-0921 / JP | [N/P] |
Former [2002/12] | For all designated states SHINKO ELECTRIC INDUSTRIES CO. LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP | Inventor(s) | 01 /
Horiuchi, Michio c/o Shinko Electric Ind.,CO.,Ltd. 711 Aza Shariden Oaza Kurita, Nagano-shi, Nagano 380-0921 / JP | 02 /
Kurihara, Takashi c/o Shinko Electric Ind.,CO.,Ltd. 711 Aza Shariden Oaza Kurita, Nagano-shi, Nagano 380-0921 / JP | [2002/12] | Representative(s) | Finnie, Peter John, et al Gill Jennings & Every LLP The Broadgate Tower 20 Primrose Street London EC2A 2ES / GB | [N/P] |
Former [2005/45] | Finnie, Peter John, et al Gill Jennings & Every, Broadgate House, 7 Eldon Street London EC2M 7LH / GB | ||
Former [2002/12] | Rackham, Stephen Neil GILL JENNINGS & EVERY, Broadgate House, 7 Eldon Street London EC2M 7LH / GB | Application number, filing date | 01306877.0 | 13.08.2001 | [2002/12] | Priority number, date | JP20000280555 | 14.09.2000 Original published format: JP 2000280555 | [2002/12] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1189273 | Date: | 20.03.2002 | Language: | EN | [2002/12] | Type: | A3 Search report | No.: | EP1189273 | Date: | 27.08.2003 | [2003/35] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.07.2003 | Classification | IPC: | H01L21/68, H01L23/13, H01L23/31, H01L23/498, H01L25/065 | [2003/16] | CPC: |
H01L21/568 (EP,US);
H01L21/50 (KR);
H01L23/02 (US);
H01L21/6835 (EP,US);
H01L23/13 (EP,US);
H01L23/3107 (EP,US);
H01L23/49816 (EP,US);
H01L2221/68377 (EP,US);
H01L2224/05599 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/32145 (EP);
H01L2224/32225 (EP,US);
H01L2224/45099 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/4824 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/73253 (EP);
H01L2224/73265 (EP,US);
H01L2224/85001 (EP,US);
H01L2224/85399 (EP,US);
H01L2224/92125 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01087 (EP,US);
H01L2924/15153 (EP,US);
H01L2924/1517 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/1532 (EP,US);
H01L2924/181 (EP,US);
| C-Set: |
H01L2224/05599, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32145, H01L2224/48247, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/85399, H01L2924/00014 (US,EP);
H01L2224/92125, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00012 (US,EP) (-) |
Former IPC [2002/12] | H01L21/68, H01L23/13, H01L23/31, H01L23/498 | Designated contracting states | DE, FR, GB [2004/21] |
Former [2002/12] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Halbleiterbauteil und seine Herstellung | [2002/12] | English: | Semiconductor device and production process | [2002/12] | French: | Dispositif semi-conducteur et methode de fabrication associée | [2002/12] | Examination procedure | 13.02.2004 | Examination requested [2004/16] | 17.09.2008 | Despatch of a communication from the examining division (Time limit: M04) | 28.01.2009 | Application deemed to be withdrawn, date of legal effect [2009/31] | 04.03.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2009/31] | Fees paid | Renewal fee | 13.08.2003 | Renewal fee patent year 03 | 12.08.2004 | Renewal fee patent year 04 | 12.08.2005 | Renewal fee patent year 05 | 14.08.2006 | Renewal fee patent year 06 | 14.08.2007 | Renewal fee patent year 07 | 14.08.2008 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2000012745 ; | [Y]US4214364 (GALE GEOFFREY N [CA], et al) [Y] 11 * figure 2 *; | [Y]US5384689 (SHEN MING-TUNG [TW]) [Y] 1,2,5,6,9,10 * the whole document *; | [A]EP0771029 (OKI ELECTRIC IND CO LTD [JP]) [A] 3,4 * the whole document *; | [A]US5693573 (CHOI SIHN [KR]) [A] 3,4,9-11 * the whole document *; | [A]US5696666 (MILES BARRY M [US], et al) [A] 1,2 * the whole document *; | [XY]US5723900 (KOJIMA AKIRA [JP], et al) [X] 3,4,9,10 * the whole document * [Y] 1,2,5,6,11; | [Y]US5776798 (QUAN SON KY [US], et al) [Y] 11 * figure 12 *; | [A]WO9836450 (SEIKO EPSON CORP [JP], et al) [A] 1,2 * figure 1 *; | [A]US5844168 (SCHUELLER RANDOLPH DENNIS [US], et al) [A] 1,2 * figure 3 *; | [A]US5854741 (SHIM IL KWON [KR], et al) [A] 1,2 * figure 1 *; | [A]EP0915505 (SHARP KK [JP]) [A] 9,10 * the whole document *; | [X]US5925934 (LIM THIAM BENG [SG]) [X] 7,8 * the whole document *; | [XY]US5977640 (BERTIN CLAUDE LOUIS [US], et al) [X] 7-10 * figures 10,11 * [Y] 11; | [Y]EP0969504 (SHINKO ELECTRIC IND CO [JP]) [Y] 7-11 * the whole document *; | [A]US6023098 (HIGASHIGUCHI YUTAKA [JP], et al) [A] 1,2 * figure 8 *; | [Y]US6060373 (SAITOH MASARU [JP]) [Y] 7-10 * the whole document *; | [Y]US6077724 (CHEN TSUNG-CHIEH [TW]) [Y] 9,10 * the whole document *; | US6180435 [ ] (ISE HIROSHI [JP], et al) [ ] * the whole document * | [A] - PATENT ABSTRACTS OF JAPAN, (20000831), vol. 2000, no. 04, & JP2000012745 A 20000114 (NEC CORP) [A] 11 * abstract * |