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Extract from the Register of European Patents

EP About this file: EP1189273

EP1189273 - Semiconductor device and production process [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  26.06.2009
Database last updated on 24.08.2024
Most recent event   Tooltip26.06.2009Application deemed to be withdrawnpublished on 29.07.2009  [2009/31]
Applicant(s)For all designated states
SHINKO ELECTRIC INDUSTRIES CO. LTD.
711, Aza Shariden, Oaza Kurita Nagano-shi
Nagano 380-0921 / JP
[N/P]
Former [2002/12]For all designated states
SHINKO ELECTRIC INDUSTRIES CO. LTD.
711, Aza Shariden, Oaza Kurita
Nagano-shi, Nagano 380-0921 / JP
Inventor(s)01 / Horiuchi, Michio
c/o Shinko Electric Ind.,CO.,Ltd. 711 Aza Shariden
Oaza Kurita, Nagano-shi, Nagano 380-0921 / JP
02 / Kurihara, Takashi
c/o Shinko Electric Ind.,CO.,Ltd. 711 Aza Shariden
Oaza Kurita, Nagano-shi, Nagano 380-0921 / JP
 [2002/12]
Representative(s)Finnie, Peter John, et al
Gill Jennings & Every LLP The Broadgate Tower 20 Primrose Street
London EC2A 2ES / GB
[N/P]
Former [2005/45]Finnie, Peter John, et al
Gill Jennings & Every, Broadgate House, 7 Eldon Street
London EC2M 7LH / GB
Former [2002/12]Rackham, Stephen Neil
GILL JENNINGS & EVERY, Broadgate House, 7 Eldon Street
London EC2M 7LH / GB
Application number, filing date01306877.013.08.2001
[2002/12]
Priority number, dateJP2000028055514.09.2000         Original published format: JP 2000280555
[2002/12]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1189273
Date:20.03.2002
Language:EN
[2002/12]
Type: A3 Search report 
No.:EP1189273
Date:27.08.2003
[2003/35]
Search report(s)(Supplementary) European search report - dispatched on:EP15.07.2003
ClassificationIPC:H01L21/68, H01L23/13, H01L23/31, H01L23/498, H01L25/065
[2003/16]
CPC:
H01L21/568 (EP,US); H01L21/50 (KR); H01L23/02 (US);
H01L21/6835 (EP,US); H01L23/13 (EP,US); H01L23/3107 (EP,US);
H01L23/49816 (EP,US); H01L2221/68377 (EP,US); H01L2224/05599 (EP,US);
H01L2224/16225 (EP,US); H01L2224/32145 (EP); H01L2224/32225 (EP,US);
H01L2224/45099 (EP,US); H01L2224/48091 (EP,US); H01L2224/48227 (EP,US);
H01L2224/4824 (EP,US); H01L2224/48247 (EP,US); H01L2224/73204 (EP,US);
H01L2224/73253 (EP); H01L2224/73265 (EP,US); H01L2224/85001 (EP,US);
H01L2224/85399 (EP,US); H01L2224/92125 (EP,US); H01L24/48 (EP,US);
H01L2924/00014 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US);
H01L2924/01087 (EP,US); H01L2924/15153 (EP,US); H01L2924/1517 (EP,US);
H01L2924/15311 (EP,US); H01L2924/1532 (EP,US); H01L2924/181 (EP,US);
H01L2924/18161 (EP,US); H01L2924/18165 (EP,US) (-)
C-Set:
H01L2224/05599, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32145, H01L2224/48247, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/85399, H01L2924/00014 (US,EP);
H01L2224/92125, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Former IPC [2002/12]H01L21/68, H01L23/13, H01L23/31, H01L23/498
Designated contracting statesDE,   FR,   GB [2004/21]
Former [2002/12]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Halbleiterbauteil und seine Herstellung[2002/12]
English:Semiconductor device and production process[2002/12]
French:Dispositif semi-conducteur et methode de fabrication associée[2002/12]
Examination procedure13.02.2004Examination requested  [2004/16]
17.09.2008Despatch of a communication from the examining division (Time limit: M04)
28.01.2009Application deemed to be withdrawn, date of legal effect  [2009/31]
04.03.2009Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2009/31]
Fees paidRenewal fee
13.08.2003Renewal fee patent year 03
12.08.2004Renewal fee patent year 04
12.08.2005Renewal fee patent year 05
14.08.2006Renewal fee patent year 06
14.08.2007Renewal fee patent year 07
14.08.2008Renewal fee patent year 08
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JP2000012745  ;
 [Y]US4214364  (GALE GEOFFREY N [CA], et al) [Y] 11 * figure 2 *;
 [Y]US5384689  (SHEN MING-TUNG [TW]) [Y] 1,2,5,6,9,10 * the whole document *;
 [A]EP0771029  (OKI ELECTRIC IND CO LTD [JP]) [A] 3,4 * the whole document *;
 [A]US5693573  (CHOI SIHN [KR]) [A] 3,4,9-11 * the whole document *;
 [A]US5696666  (MILES BARRY M [US], et al) [A] 1,2 * the whole document *;
 [XY]US5723900  (KOJIMA AKIRA [JP], et al) [X] 3,4,9,10 * the whole document * [Y] 1,2,5,6,11;
 [Y]US5776798  (QUAN SON KY [US], et al) [Y] 11 * figure 12 *;
 [A]WO9836450  (SEIKO EPSON CORP [JP], et al) [A] 1,2 * figure 1 *;
 [A]US5844168  (SCHUELLER RANDOLPH DENNIS [US], et al) [A] 1,2 * figure 3 *;
 [A]US5854741  (SHIM IL KWON [KR], et al) [A] 1,2 * figure 1 *;
 [A]EP0915505  (SHARP KK [JP]) [A] 9,10 * the whole document *;
 [X]US5925934  (LIM THIAM BENG [SG]) [X] 7,8 * the whole document *;
 [XY]US5977640  (BERTIN CLAUDE LOUIS [US], et al) [X] 7-10 * figures 10,11 * [Y] 11;
 [Y]EP0969504  (SHINKO ELECTRIC IND CO [JP]) [Y] 7-11 * the whole document *;
 [A]US6023098  (HIGASHIGUCHI YUTAKA [JP], et al) [A] 1,2 * figure 8 *;
 [Y]US6060373  (SAITOH MASARU [JP]) [Y] 7-10 * the whole document *;
 [Y]US6077724  (CHEN TSUNG-CHIEH [TW]) [Y] 9,10 * the whole document *;
 US6180435  [ ] (ISE HIROSHI [JP], et al) [ ] * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20000831), vol. 2000, no. 04, & JP2000012745 A 20000114 (NEC CORP) [A] 11 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.