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EP About this file: EP1278245

EP1278245 - METHOD AND APPARATUS FOR PRODUCING BONDED DIELECTRIC SEPARATION WAFER [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 07.01.2011 Database last updated on 09.09.2024
Most recent event Tooltip	07.01.2011	No opposition filed within time limit	published on 09.02.2011 [2011/06]
Applicant(s)	For all designated states SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo / JP
	[2006/31]
Former [2003/06]	For all designated states Sumitomo Mitsubishi Silicon Corporation 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
Former [2003/04]	For all designated states Mitsubishi Materials Silicon Corporation 5-1, Ohtemachi 1-chome, Chiyoda-ku Tokyo 100-0004 / JP
Inventor(s)	01 / OI, Hiroyuki Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP
	02 / OKUDA, Hitoshi Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP
	[2003/04]
Representative(s)	Hössle Patentanwälte Partnerschaft Postfach 10 23 38 70019 Stuttgart / DE
	[N/P]
Former [2003/04]	Hössle Kudlek & Partner Patentanwälte, Postfach 10 23 38 70019 Stuttgart / DE
Application number, filing date	01908349.2	05.03.2001
	[2003/04]
	WO2001JP01728
Priority number, date	JP20000130790	28.04.2000 Original published format: JP 2000130790
	[2003/04]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO0184633
	Date:	08.11.2001
	Language:	EN
	[2001/45]
	Type:	A1 Application with search report
	No.:	EP1278245
	Date:	22.01.2003
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 08.11.2001 takes the place of the publication of the European patent application.
	[2003/04]
	Type:	B1 Patent specification
	No.:	EP1278245
	Date:	03.03.2010
	Language:	EN
	[2010/09]
Search report(s)	International search report - published on:	JP	08.11.2001
	(Supplementary) European search report - dispatched on:	EP	02.05.2005
Classification	IPC:	H01L27/12, H01L21/68, H01L21/762	[2009/39]
	CPC:	H01L21/681 (EP,US); H01L21/76256 (EP,US); H01L21/76264 (EP,US); Y10S438/977 (EP,US)
	Former IPC [2005/24]	H01L27/12, H01L21/68
	Former IPC [2003/04]	H01L27/12
Designated contracting states	AT, DE, FR [2004/21]
Former [2003/04]	AT, DE, FR, GB, IE, IT
Title	German:	VERFAHREN UND VORRICHTUNG ZUM HERSTELLEN EINES GEBONDETEN DIELEKTRISCHEN TRENNUNGSWAFERS	[2003/04]
	English:	METHOD AND APPARATUS FOR PRODUCING BONDED DIELECTRIC SEPARATION WAFER	[2003/04]
	French:	PROCEDE ET DISPOSITIF PERMETTANT LA PRODUCTION D'UNE TRANCHE DE SEPARATION DIELECTRIQUE COLLEE	[2003/04]
Entry into regional phase	18.10.2002	Translation filed
	18.10.2002	National basic fee paid
	18.10.2002	Search fee paid
	18.10.2002	Designation fee(s) paid
	18.10.2002	Examination fee paid
Examination procedure	22.11.2001	Request for preliminary examination filed International Preliminary Examining Authority: JP
	18.10.2002	Examination requested [2003/04]
	08.01.2003	Amendment by applicant (claims and/or description)
	28.02.2007	Despatch of a communication from the examining division (Time limit: M04)
	25.06.2007	Reply to a communication from the examining division
	18.09.2009	Communication of intention to grant the patent
	14.01.2010	Fee for grant paid
	14.01.2010	Fee for publishing/printing paid
Opposition(s)	06.12.2010	No opposition filed within time limit [2011/06]
Fees paid	Renewal fee
	18.10.2002	Renewal fee patent year 03
	20.03.2004	Renewal fee patent year 04
	19.03.2005	Renewal fee patent year 05
	23.03.2006	Renewal fee patent year 06
	28.03.2007	Renewal fee patent year 07
	26.03.2008	Renewal fee patent year 08
	30.03.2009	Renewal fee patent year 09
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	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]JPH0897110 ;
		[YA]JPH02267951 ;
		[XAY]US5236118 (BOWER ROBERT W [US], et al) [X] 6 * column 1, line 5 - line 10 * * column 1, line 64 - column 2, line 20 * * column 3, line 25 - line 51; figure 1 * * column 3, line 64 - column 4, line 22; figure 1 * * column 4, line 26 - column 5, line 2; figure 4 * * column 5, line 45 - line 53 * * column 6, line 22 - line 26 * [A] 1-3 [Y] 4,5;
		[YA]US5869386 (HAMAJIMA TOMOHIRO [JP], et al) [Y] 4,5 * column 1, line 5 - line 9 * * column 2, line 3 - line 10 * * column 4, line 35 - line 42; figures 2a,2b * * column 5, line 30 - line 37; figure 4 * * column 5, line 61 - line 67; figure 5 *[A] 1,2
		[X] - PATENT ABSTRACTS OF JAPAN, (19960830), vol. 1996, no. 08, & JP08097110 A 19960412 (CANON INC) [X] 6 * abstract *
		[YA] - PATENT ABSTRACTS OF JAPAN, (19910118), vol. 015, no. 022, Database accession no. (E - 1024), & JP02267951 A 19901101 (SONY CORP) [Y] 4,5 * abstract * [A] 1,2
	International search	[Y]JPH03183130 (SONY CORP);
		[Y]JPH0590117 (TOSHIBA CORP);
		[Y]JPH05152181 (FUJITSU LTD);
		[X]JPH0897110 (CANON KK);
		[Y]EP0926706 (CANON KK [JP]);
		[Y]JPH11274442 (SONY CORP);
		[Y]JP2000021974 (MITSUBISHI MATERIAL SILICON)

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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