EP1278245 - METHOD AND APPARATUS FOR PRODUCING BONDED DIELECTRIC SEPARATION WAFER [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 07.01.2011 Database last updated on 09.09.2024 | Most recent event Tooltip | 07.01.2011 | No opposition filed within time limit | published on 09.02.2011 [2011/06] | Applicant(s) | For all designated states SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | [2006/31] |
Former [2003/06] | For all designated states Sumitomo Mitsubishi Silicon Corporation 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP | ||
Former [2003/04] | For all designated states Mitsubishi Materials Silicon Corporation 5-1, Ohtemachi 1-chome, Chiyoda-ku Tokyo 100-0004 / JP | Inventor(s) | 01 /
OI, Hiroyuki Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | 02 /
OKUDA, Hitoshi Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | [2003/04] | Representative(s) | Hössle Patentanwälte Partnerschaft Postfach 10 23 38 70019 Stuttgart / DE | [N/P] |
Former [2003/04] | Hössle Kudlek & Partner Patentanwälte, Postfach 10 23 38 70019 Stuttgart / DE | Application number, filing date | 01908349.2 | 05.03.2001 | [2003/04] | WO2001JP01728 | Priority number, date | JP20000130790 | 28.04.2000 Original published format: JP 2000130790 | [2003/04] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO0184633 | Date: | 08.11.2001 | Language: | EN | [2001/45] | Type: | A1 Application with search report | No.: | EP1278245 | Date: | 22.01.2003 | Language: | EN | The application published by WIPO in one of the EPO official languages on 08.11.2001 takes the place of the publication of the European patent application. | [2003/04] | Type: | B1 Patent specification | No.: | EP1278245 | Date: | 03.03.2010 | Language: | EN | [2010/09] | Search report(s) | International search report - published on: | JP | 08.11.2001 | (Supplementary) European search report - dispatched on: | EP | 02.05.2005 | Classification | IPC: | H01L27/12, H01L21/68, H01L21/762 | [2009/39] | CPC: |
H01L21/681 (EP,US);
H01L21/76256 (EP,US);
H01L21/76264 (EP,US);
Y10S438/977 (EP,US)
|
Former IPC [2005/24] | H01L27/12, H01L21/68 | ||
Former IPC [2003/04] | H01L27/12 | Designated contracting states | AT, DE, FR [2004/21] |
Former [2003/04] | AT, DE, FR, GB, IE, IT | Title | German: | VERFAHREN UND VORRICHTUNG ZUM HERSTELLEN EINES GEBONDETEN DIELEKTRISCHEN TRENNUNGSWAFERS | [2003/04] | English: | METHOD AND APPARATUS FOR PRODUCING BONDED DIELECTRIC SEPARATION WAFER | [2003/04] | French: | PROCEDE ET DISPOSITIF PERMETTANT LA PRODUCTION D'UNE TRANCHE DE SEPARATION DIELECTRIQUE COLLEE | [2003/04] | Entry into regional phase | 18.10.2002 | Translation filed | 18.10.2002 | National basic fee paid | 18.10.2002 | Search fee paid | 18.10.2002 | Designation fee(s) paid | 18.10.2002 | Examination fee paid | Examination procedure | 22.11.2001 | Request for preliminary examination filed International Preliminary Examining Authority: JP | 18.10.2002 | Examination requested [2003/04] | 08.01.2003 | Amendment by applicant (claims and/or description) | 28.02.2007 | Despatch of a communication from the examining division (Time limit: M04) | 25.06.2007 | Reply to a communication from the examining division | 18.09.2009 | Communication of intention to grant the patent | 14.01.2010 | Fee for grant paid | 14.01.2010 | Fee for publishing/printing paid | Opposition(s) | 06.12.2010 | No opposition filed within time limit [2011/06] | Fees paid | Renewal fee | 18.10.2002 | Renewal fee patent year 03 | 20.03.2004 | Renewal fee patent year 04 | 19.03.2005 | Renewal fee patent year 05 | 23.03.2006 | Renewal fee patent year 06 | 28.03.2007 | Renewal fee patent year 07 | 26.03.2008 | Renewal fee patent year 08 | 30.03.2009 | Renewal fee patent year 09 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JPH0897110 ; | [YA]JPH02267951 ; | [XAY]US5236118 (BOWER ROBERT W [US], et al) [X] 6 * column 1, line 5 - line 10 * * column 1, line 64 - column 2, line 20 * * column 3, line 25 - line 51; figure 1 * * column 3, line 64 - column 4, line 22; figure 1 * * column 4, line 26 - column 5, line 2; figure 4 * * column 5, line 45 - line 53 * * column 6, line 22 - line 26 * [A] 1-3 [Y] 4,5; | [YA]US5869386 (HAMAJIMA TOMOHIRO [JP], et al) [Y] 4,5 * column 1, line 5 - line 9 * * column 2, line 3 - line 10 * * column 4, line 35 - line 42; figures 2a,2b * * column 5, line 30 - line 37; figure 4 * * column 5, line 61 - line 67; figure 5 *[A] 1,2 | [X] - PATENT ABSTRACTS OF JAPAN, (19960830), vol. 1996, no. 08, & JP08097110 A 19960412 (CANON INC) [X] 6 * abstract * | [YA] - PATENT ABSTRACTS OF JAPAN, (19910118), vol. 015, no. 022, Database accession no. (E - 1024), & JP02267951 A 19901101 (SONY CORP) [Y] 4,5 * abstract * [A] 1,2 | International search | [Y]JPH03183130 (SONY CORP); | [Y]JPH0590117 (TOSHIBA CORP); | [Y]JPH05152181 (FUJITSU LTD); | [X]JPH0897110 (CANON KK); | [Y]EP0926706 (CANON KK [JP]); | [Y]JPH11274442 (SONY CORP); | [Y]JP2000021974 (MITSUBISHI MATERIAL SILICON) |