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EP1321980

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EP About this file: EP1321980

EP1321980 - SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 19.04.2013 Database last updated on 20.09.2024
Most recent event Tooltip	19.04.2013	Application deemed to be withdrawn	published on 22.05.2013 [2013/21]
Applicant(s)	For all designated states IBIDEN CO., LTD. 1, Kandacho 2-chome Ogaki-shi, Gifu 503-0917 / JP
	[N/P]
Former [2003/26]	For all designated states Ibiden Co., Ltd. 1, Kandacho 2-chome Ogaki-shi, Gifu 503-0917 / JP
Inventor(s)	01 / SAKAMOTO, Hajime, Ogaki-kita-kojou, Ibiden Co., Ltd 1, Kitakata 1-chome, Ibigawacho Ibi-gun, Gifu 501-0695 / JP
	02 / WANG, Dongdong, Ogaki-kita-kojou, Ibiden Co., Ltd 1, Kitakata 1-chome, Ibigawacho Ibi-gun, Gifu 501-0695 / JP
	[2003/26]
Representative(s)	Vossius & Partner Patentanwälte Rechtsanwälte mbB Siebertstrasse 3 81675 München / DE
	[N/P]
Former [2008/35]	Vossius & Partner Siebertstrasse 3 81675 München / DE
Former [2003/26]	VOSSIUS & PARTNER Siebertstrasse 4 81675 München / DE
Application number, filing date	01925925.8	25.04.2001
	[2003/26]
	WO2001JP03589
Priority number, date	JP20000290231	25.09.2000 Original published format: JP 2000290231
	JP20000290232	25.09.2000 Original published format: JP 2000290232
	JP20000382806	15.12.2000 Original published format: JP 2000382806
	JP20000382807	15.12.2000 Original published format: JP 2000382807
	JP20000382813	15.12.2000 Original published format: JP 2000382813
	JP20000382814	15.12.2000 Original published format: JP 2000382814
	[2003/26]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO0227786
	Date:	04.04.2002
	Language:	EN
	[2002/12]
	Type:	A1 Application with search report
	No.:	EP1321980
	Date:	25.06.2003
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 04.04.2002 takes the place of the publication of the European patent application.
	[2003/26]
Search report(s)	International search report - published on:	JP	04.04.2002
	(Supplementary) European search report - dispatched on:	EP	01.03.2007
Classification	IPC:	H01L23/12, H01L21/60, H05K3/46	[2003/26]
	CPC:	H01L21/568 (EP,US); H01L23/525 (KR); H01L23/49838 (US); H01L21/6835 (EP,US); H01L23/49816 (EP,US); H01L23/49822 (US); (+) H01L23/49866 (US); H01L23/49894 (EP,US); H01L23/5389 (EP,US); H01L24/19 (EP,US); H01L24/24 (EP,US); H01L24/27 (EP,US); H01L24/97 (EP,US); H05K1/185 (EP,US); H01L2224/0401 (EP,US); H01L2224/04105 (EP,US); H01L2224/1147 (EP,US); H01L2224/12105 (EP,US); H01L2224/20 (EP,US); H01L2224/24137 (EP,US); H01L2224/24227 (EP,US); H01L2224/274 (EP,US); H01L2224/32225 (EP,US); H01L2224/32245 (EP,US); H01L2224/45144 (EP,US); H01L2224/73267 (EP,US); H01L2224/92244 (EP,US); H01L2224/94 (EP,US); H01L2224/97 (EP,US); H01L23/49811 (EP,US); H01L2924/01004 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01011 (EP,US); H01L2924/01012 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01018 (EP,US); H01L2924/01019 (EP,US); H01L2924/0102 (EP,US); H01L2924/01024 (EP,US); H01L2924/01027 (EP,US); H01L2924/01029 (EP,US); H01L2924/0103 (EP,US); H01L2924/01033 (EP,US); H01L2924/01039 (EP,US); H01L2924/01046 (EP,US); H01L2924/01047 (EP,US); H01L2924/01051 (EP,US); H01L2924/01074 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/12042 (EP,US); H01L2924/14 (EP,US); H01L2924/15153 (EP,US); H01L2924/1517 (EP,US); H01L2924/15174 (EP,US); H01L2924/15311 (EP,US); H01L2924/15312 (EP,US); H01L2924/1532 (EP,US); H01L2924/15787 (EP,US); H01L2924/30107 (EP,US); H01L2924/3511 (EP,US); H05K2201/09036 (EP,US); H05K2201/09563 (EP,US); H05K2201/096 (EP,US); H05K3/4602 (EP,US); Y10T29/49124 (EP,US); Y10T29/49126 (EP,US); Y10T29/49128 (EP,US); Y10T29/4913 (EP,US); Y10T29/49133 (EP,US); Y10T29/49139 (EP,US); Y10T29/49144 (EP,US); Y10T29/49146 (EP,US); Y10T29/49155 (EP,US); Y10T29/49165 (EP,US) (-)
	C-Set:	H01L2224/24227, H01L2924/1517 (US,EP); H01L2224/45144, H01L2924/00 (EP,US); H01L2224/94, H01L2224/03 (EP,US); H01L2224/97, H01L2224/82 (US,EP); (+) H01L2224/97, H01L2924/15311 (US,EP); H01L2924/12042, H01L2924/00 (EP,US); H01L2924/1517, H01L2924/15153 (US,EP); H01L2924/15787, H01L2924/00 (EP,US); H01L2924/3512, H01L2924/00 (EP,US) (-)
Designated contracting states	DE, FI, GB, NL [2004/21]
Former [2003/26]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR
Title	German:	HALBLEITERELEMENT, VERFAHREN ZUR HERSTELLUNG DES HALBLEITERELEMENTS, MEHRSCHICHTIGE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DER MEHRSCHICHTIGEN LEITERPLATTE	[2003/26]
	English:	SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD	[2003/26]
	French:	ELEMENT SEMI-CONDUCTEUR, PROCEDE DE FABRICATION D'UN ELEMENT SEMI-CONDUCTEUR, CARTE A CIRCUIT IMPRIME MULTICOUCHE, ET PROCEDE DE FABRICATION D'UNE CARTE A CIRCUIT IMPRIME MULTICOUCHE	[2003/26]
Entry into regional phase	13.03.2003	Translation filed
	11.04.2003	National basic fee paid
	11.04.2003	Search fee paid
	11.04.2003	Designation fee(s) paid
	11.04.2003	Examination fee paid
Examination procedure	15.04.2002	Request for preliminary examination filed International Preliminary Examining Authority: JP
	11.04.2003	Examination requested [2003/26]
	13.09.2007	Despatch of a communication from the examining division (Time limit: M06)
	25.03.2008	Reply to a communication from the examining division
	07.10.2008	Despatch of a communication from the examining division (Time limit: M06)
	17.04.2009	Reply to a communication from the examining division
	18.01.2010	Despatch of a communication from the examining division (Time limit: M06)
	28.06.2010	Reply to a communication from the examining division
	24.08.2010	Despatch of a communication from the examining division (Time limit: M06)
	03.03.2011	Reply to a communication from the examining division
	24.05.2012	Despatch of a communication from the examining division (Time limit: M06)
	04.12.2012	Application deemed to be withdrawn, date of legal effect [2013/21]
	07.01.2013	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2013/21]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 13.09.2007
Fees paid	Renewal fee
	11.04.2003	Renewal fee patent year 03
	30.04.2004	Renewal fee patent year 04
	02.05.2005	Renewal fee patent year 05
	30.03.2006	Renewal fee patent year 06
	27.04.2007	Renewal fee patent year 07
	31.03.2008	Renewal fee patent year 08
	24.04.2009	Renewal fee patent year 09
	25.02.2010	Renewal fee patent year 10
	21.04.2011	Renewal fee patent year 11
	25.04.2012	Renewal fee patent year 12
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]US3775844 (PARKS H) [A] 27-40 * the whole document *;
		[A]EP0471938 (IBM [US]) [A] 1 * the whole document *;
		[X]US5111278 (EICHELBERGER CHARLES W [US]) [X] 1,24 * the whole document *;
		[X]US5455459 (FILLION RAYMOND A [US], et al) [X] 6-13,16-23 see Figure 1 and accompanying description;
		[A]US5521122 (KURAMOCHI TOSHIYUKI [JP]) [A] 35,36 * the whole document *;
		[X]US5629564 (NYE III HENRY A [US], et al) [X] 16-23 * column 6, line 39 - column 8, line 10; figure 3 *;
		[XY]EP0777274 (LOCKHEED CORP [US]) [X] 1-3,24,25 * column 5, line 47 - column 10, line 57; figures 1,3,4 * [Y] 4,5,26,41-43;
		[Y]JPH1098081 (HITACHI CABLE) [Y] 41-43* abstract *;
		[XA]US5841193 (EICHELBERGER CHARLES WILLIAM [US]) [X] 14,15 * column 10, lines 64,65 * [A] 35;
		[A]US6025995 (MARCINKIEWICZ WALTER M [US]) [A] 1 * the whole document *;
		[X]EP1003209 (SHINKO ELECTRIC IND CO [JP]) [X] 14,15 * paragraphs [0009] , [0022] - [0033]; figures 1-5 *;
		[Y]EP1024531 (SHINKO ELECTRIC IND CO [JP]) [Y] 4,5,26 * paragraphs [0025] - [0027]; figures 1,2 *;
		[A]EP1032030 (LUCENT TECHNOLOGIES INC [US]) [A] 14-17 * paragraphs [0013] , [0031] *
	International search	[A]JPH03101234 (NEC CORP);
		[A]JPH0465832 (FUJITSU LTD);
		[X]JPH10284632 (FUJITSU LTD);
		[X]JP2000260902 (NGK SPARK PLUG CO)

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