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Extract from the Register of European Patents

EP About this file: EP1303876

EP1303876 - METHOD OF FORMING COPPER INTERCONNECT CAPPING LAYERS WITH IMPROVED INTERFACE AND ADHESION [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.07.2010
Database last updated on 17.07.2024
Most recent event   Tooltip02.07.2010No opposition filed within time limitpublished on 04.08.2010  [2010/31]
Applicant(s)For all designated states
Globalfoundries Inc.
Maples Corporate Services Limited
P.O. Box 309
Ugland House
KY1-1104 Grand Cayman / KY
[N/P]
Former [2009/52]For all designated states
GlobalFoundries, Inc.
Maple Corporate Services Limited P.O. Box 309 Ugland House
Grand Cayman KY1-1104 / KY
Former [2008/36]For all designated states
ADVANCED MICRO DEVICES, INC.
One AMD Place Mail Stop 68 P.O. Box 3453
Sunnyvale CA 94088-3453 / US
Former [2003/17]For all designated states
ADVANCED MICRO DEVICES INC.
One AMD Place, P.O. Box 3453
Sunnyvale, California 94088-3453 / US
Inventor(s)01 / NGO, Minh, Van
40986 Canyon Heights Drive
Fremont, CA 94539 / US
02 / RUELKE, Hartmut
Wamenuender-Str. 7
01109 Dresden Wilschdorf / DE
03 / MERGILI, Lothar
Am Schulfeld 5
01109 Dresden / DE
04 / HOHAGE, Joerg
Mendelssohnallee 30
01309 Dresden / DE
05 / YOU, Lu
5978 Friar Way
San Jose, CA 95129 / US
06 / HUERTAS, Robert, A.
975 Matador Drive
Hollister, CA 95023 / CA
07 / HUANG, Richard
1068 West Hill Court
Cupertino, CA 95014 / US
 [2003/25]
Former [2003/17]01 / NGO, Minh, Van
40986 Canyon Heights Drive
Fremont, CA 94539 / US
02 / RUELKE, Hartmut
Wamenuender-Str. 7
01109 Dresden Wilschdorf / DE
03 / MERGILI, Lothar
Emil-Hoegg-Str. 13
01445 Radebeul / DE
04 / HOHAGE, Joerg
Mendelssohnallee 30
01309 Dresden / DE
05 / YOU, Lu
3655 Pruperidge Avenue 156
Santa Clara, CA 95051 / US
06 / HUERTAS, Robert, A.
975 Matador Drive
Hollister, CA 95023 / CA
07 / HUANG, Richard
1068 West Hill Court
Cupertino, CA 95014 / US
Representative(s)Brookes IP
Windsor House
6-10 Mount Ephraim Road
Tunbridge Wells, Kent TN1 1EE / GB
[N/P]
Former [2009/31]Brookes Batchellor LLP
102-108 Clerkenwell Road London
EC1M 5SA / GB
Former [2009/14]Brookes Batchellor LLP
102-108 Clerkenwell Road
London EC1M 5SA / GB
Former [2003/17]Sanders, Peter Colin Christopher
Brookes Batchellor, 102-108 Clerkenwell Road
London EC1M 5SA / GB
Application number, filing date01941965.404.06.2001
[2003/17]
WO2001US18228
Priority number, dateUS2000062645526.07.2000         Original published format: US 626455
[2003/17]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO0209173
Date:31.01.2002
Language:EN
[2002/05]
Type: A2 Application without search report 
No.:EP1303876
Date:23.04.2003
Language:EN
The application published by WIPO in one of the EPO official languages on 31.01.2002 takes the place of the publication of the European patent application.
[2003/17]
Type: B1 Patent specification 
No.:EP1303876
Date:26.08.2009
Language:EN
[2009/35]
Search report(s)International search report - published on:EP23.05.2002
ClassificationIPC:H01L21/768
[2003/17]
CPC:
H01L21/76883 (EP,US); H01L21/768 (KR); H01L21/76834 (EP,US);
Y10S438/913 (EP,US)
Designated contracting statesDE,   GB [2004/22]
Former [2003/17]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
RONot yet paid
SINot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG VON ABDECKSCHICHTEN FÜR EINE KUPFER-VERBINDUNGSSTRUKTUR MIT VERBESSERTER ZWISCHENFLÄCHE UND HAFTUNG[2003/17]
English:METHOD OF FORMING COPPER INTERCONNECT CAPPING LAYERS WITH IMPROVED INTERFACE AND ADHESION[2003/17]
French:PROCEDE DE FORMATION DE COUCHES DE COIFFAGE D'INTERCONNEXION A INTERFACE ET ADHESION AMELIOREES[2003/17]
Entry into regional phase29.01.2003National basic fee paid 
29.01.2003Designation fee(s) paid 
29.01.2003Examination fee paid 
Examination procedure15.02.2002Request for preliminary examination filed
International Preliminary Examining Authority: EP
29.01.2003Examination requested  [2003/17]
04.03.2009Communication of intention to grant the patent
06.07.2009Fee for grant paid
06.07.2009Fee for publishing/printing paid
Opposition(s)27.05.2010No opposition filed within time limit [2010/31]
Fees paidRenewal fee
29.01.2003Renewal fee patent year 03
04.06.2004Renewal fee patent year 04
06.06.2005Renewal fee patent year 05
27.03.2006Renewal fee patent year 06
08.06.2007Renewal fee patent year 07
18.03.2008Renewal fee patent year 08
05.06.2009Renewal fee patent year 09
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Cited inInternational search[A]WO0029642  (APPLIED MATERIALS INC [US]) [A] 1,5 * page 4 - page 6 *;
 [A]JPH11330246  ;
 [PA]US6174810  (ISLAM RABIUL [US], et al) [PA] * column 3 - column 4 *;
 [A]GB2345790  (IBM [US]) [A] 1,5 * page 4 - page 5 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20000229), vol. 2000, no. 02, & JP11330246 A 19991130 (MOTOROLA INC) [A] 1,5 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.