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Extract from the Register of European Patents

EP About this file: EP1356509

EP1356509 - STRUCTURAL REINFORCEMENT OF HIGHLY POROUS LOW K DIELECTRIC FILMS BY CU DIFFUSION BARRIER STRUCTURES [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.08.2013
Database last updated on 20.09.2024
Most recent event   Tooltip30.05.2014Lapse of the patent in a contracting state
New state(s): LU		published on 02.07.2014  [2014/27]
Applicant(s)For all designated states
Intel Corporation
2200 Mission College Boulevard
Santa Clara, CA 95054 / US
[N/P]
Former [2012/43]For all designated states
Intel Corporation
2200 Mission College Boulevard
Santa Clara, CA 95052 / US
Former [2003/44]For all designated states
INTEL CORPORATION
2200 Mission College Boulevard
Santa Clara, CA 95052 / US
Inventor(s)01 / WONG, Lawrence, D.
265 NW Silverado Drive
Beaverton, OR 97006 / US
 [2003/44]
Representative(s)Niederkofler, Oswald, et al
Samson & Partner Patentanwälte mbB
Widenmayerstrasse 6
80538 München / DE
[N/P]
Former [2012/43]Niederkofler, Oswald, et al
Samson & Partner Patentanwälte Widenmayerstrasse 5
80538 München / DE
Former [2003/44]Niederkofler, Oswald A., Dipl.-Phys., et al
Samson & Partner Widenmayerstrasse 5
80538 München / DE
Application number, filing date01991604.818.12.2001
[2003/44]
WO2001US50808
Priority number, dateUS2000074770120.12.2000         Original published format: US 747701
[2003/44]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO0250894
Date:27.06.2002
Language:EN
[2002/26]
Type: A2 Application without search report 
No.:EP1356509
Date:29.10.2003
Language:EN
The application published by WIPO in one of the EPO official languages on 27.06.2002 takes the place of the publication of the European patent application.
[2003/44]
Type: B1 Patent specification 
No.:EP1356509
Date:24.10.2012
Language:EN
[2012/43]
Search report(s)International search report - published on:EP05.12.2002
ClassificationIPC:H01L21/768, H01L21/316
[2012/16]
CPC:
H01L21/02126 (EP,US); H01L21/02203 (EP,US); H01L21/02304 (EP,US);
H01L21/02362 (EP,US); H01L21/31695 (US); H01L21/76801 (EP,US);
H01L21/76802 (EP,US); H01L21/76807 (EP,US) (-)
Former IPC [2003/44]H01L21/768
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE,   TR [2003/44]
TitleGerman:STRUKTURELLE VERSTÄRKUNG VON HOCHPORÖSEN SCHICHTEN MIT NIEDRIGER DIELEKTRIZITÄTSKONSTANTE DURCH KUPFER-DIFFUSIONSBARIERE-STRUKTUREN[2003/44]
English:STRUCTURAL REINFORCEMENT OF HIGHLY POROUS LOW K DIELECTRIC FILMS BY CU DIFFUSION BARRIER STRUCTURES[2003/44]
French:RENFORCEMENT STRUCTUREL DE FILMS DIELECTRIQUES FORTEMENT POREUX ET A FAIBLE CONSTANTE DIELECTRIQUE PAR DES STRUCTURES A EFFET DE BARRIERE A LA DIFFUSION DU CUIVRE[2003/44]
Entry into regional phase21.07.2003National basic fee paid 
21.07.2003Designation fee(s) paid 
21.07.2003Examination fee paid 
Examination procedure21.07.2003Amendment by applicant (claims and/or description)
21.07.2003Examination requested  [2003/44]
16.09.2008Despatch of a communication from the examining division (Time limit: M06)
26.03.2009Reply to a communication from the examining division
21.08.2009Despatch of a communication from the examining division (Time limit: M06)
23.02.2010Reply to a communication from the examining division
25.05.2011Despatch of a communication from the examining division (Time limit: M04)
04.10.2011Reply to a communication from the examining division
13.06.2012Communication of intention to grant the patent
06.09.2012Fee for grant paid
06.09.2012Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  16.09.2008
Opposition(s)25.07.2013No opposition filed within time limit [2013/40]
Fees paidRenewal fee
29.12.2003Renewal fee patent year 03
23.12.2004Renewal fee patent year 04
27.12.2005Renewal fee patent year 05
27.12.2006Renewal fee patent year 06
24.12.2007Renewal fee patent year 07
24.12.2008Renewal fee patent year 08
28.12.2009Renewal fee patent year 09
27.12.2010Renewal fee patent year 10
27.12.2011Renewal fee patent year 11
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
TR24.10.2012
IE18.12.2012
LU18.12.2012
CH31.12.2012
LI31.12.2012
MC31.12.2012
FR02.01.2013
GR25.01.2013
ES04.02.2013
PT25.02.2013
[2014/27]
Former [2014/21]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
TR24.10.2012
IE18.12.2012
CH31.12.2012
LI31.12.2012
MC31.12.2012
FR02.01.2013
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/50]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
IE18.12.2012
CH31.12.2012
LI31.12.2012
MC31.12.2012
FR02.01.2013
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/48]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
IE18.12.2012
CH31.12.2012
LI31.12.2012
MC31.12.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/47]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
IE18.12.2012
MC31.12.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/37]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
IT24.10.2012
NL24.10.2012
SE24.10.2012
MC31.12.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/34]AT24.10.2012
BE24.10.2012
CY24.10.2012
DK24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
MC31.12.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/33]AT24.10.2012
BE24.10.2012
CY24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
MC31.12.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/31]AT24.10.2012
BE24.10.2012
CY24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/28]BE24.10.2012
CY24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
GR25.01.2013
ES04.02.2013
PT25.02.2013
Former [2013/24]BE24.10.2012
CY24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
GR25.01.2013
ES04.02.2013
Former [2013/23]CY24.10.2012
FI24.10.2012
NL24.10.2012
SE24.10.2012
ES04.02.2013
Former [2013/22]FI24.10.2012
NL24.10.2012
SE24.10.2012
ES04.02.2013
Former [2013/21]SE24.10.2012
Cited inInternational search[Y]JPH11111843  ;
 [A]US5539240  (CRONIN JOHN E [US], et al);
 [Y]US5814558  (JENG SHIN-PUU [US], et al) [Y] 11-19 * column 4, line 1 - column 6, line 13 *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19990730), vol. 1999, no. 09, & JP11111843 A 19990423 (HITACHI LTD) [Y] 11-19 * abstract *
ExaminationUS6004863
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.