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Extract from the Register of European Patents

EP About this file: EP1354354

EP1354354 - MICROELECTRONIC PACKAGE HAVING AN INTEGRATED HEAT SINK AND BUILD-UP LAYERS [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 11.12.2009 Database last updated on 15.11.2024
Most recent event Tooltip	11.12.2009	Application deemed to be withdrawn	published on 13.01.2010 [2010/02]
Applicant(s)	For all designated states Intel Corporation 2200 Mission College Boulevard Santa Clara, CA 95054 / US
	[N/P]
Former [2003/43]	For all designated states INTEL CORPORATION 2200 Mission College Boulevard Santa Clara, CA 95052 / US
Inventor(s)	01 / HENAO, Maria, V. 6161 Viado Los Cierros Pleasanton, CA 94566 / US
	02 / MU, Xiao-Chun 19685 Via Escuela Drive Saratoga, CA 95070 / US
	03 / MA, Qing 919 Brentwood Drive San Jose, CA 95129 / US
	04 / VU, Quat, T. 2464 El Camino Real PMB No. 126 Santa Clara, CA 95051 / US
	05 / TOWLE, Steven, N. 301 West Desert Flower Lane Phoenix, AZ 85045 / US
	[2004/01]
Former [2003/43]	01 / HENAO, Maria, V. 6161 Viado Los Cierros Pleasanton, CA 94566 / US
	02 / MU, Xiao-Chun 19685 Via Escuela Drive Saratoga, CA 95070 / US
	03 / MA, Qing 919 Brentwood Drive San Jose, CA 95129 / US
	04 / VU, Quat, T. 2464 El Camino Real Santa Clara, CA 95051 / US
	05 / TOWLE, Steven, N. 301 West Desert Flower Lane Phoenix, AZ 85045 / US
Representative(s)	Collins, John David Marks & Clerk LLP 90 Long Acre London WC2E 9RA / GB
	[N/P]
Former [2003/43]	Collins, John David Marks & Clerk, 57-60 Lincoln's Inn Fields London WC2A 3LS / GB
Application number, filing date	01992286.3	09.11.2001
	[2003/43]
	WO2001US49898
Priority number, date	US20000733289	08.12.2000 Original published format: US 733289
	[2003/43]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	WO0247162
	Date:	13.06.2002
	Language:	EN
	[2002/24]
	Type:	A2 Application without search report
	No.:	EP1354354
	Date:	22.10.2003
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 13.06.2002 takes the place of the publication of the European patent application.
	[2003/43]
Search report(s)	International search report - published on:	EP	07.08.2003
Classification	IPC:	H01L23/433, H01L23/538	[2003/43]
	CPC:	H01L24/20 (EP,US); H01L23/34 (KR); H01L21/561 (EP,US); H01L23/16 (EP,US); H01L23/3128 (EP,US); H01L23/4334 (EP,US); (+) H01L23/5389 (EP,US); H01L24/19 (EP,US); H01L24/97 (EP,US); H01L2224/0401 (EP,US); H01L2224/04105 (EP,US); H01L2224/12105 (EP,US); H01L2224/16225 (EP,US); H01L2224/20 (EP,US); H01L2224/24137 (EP); H01L2224/24227 (EP,US); H01L2224/32225 (EP,US); H01L2224/32245 (EP,US); H01L2224/73267 (EP,US); H01L2224/92244 (EP,US); H01L2224/97 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01042 (EP,US); H01L2924/01047 (EP,US); H01L2924/01061 (EP,US); H01L2924/01078 (EP,US); H01L2924/01082 (EP,US); H01L2924/12042 (EP,US); H01L2924/14 (EP,US); H01L2924/15153 (EP,US); H01L2924/1517 (EP,US); H01L2924/15174 (EP,US); H01L2924/15311 (EP,US); H01L2924/19041 (EP,US); H01L2924/19042 (EP,US); H01L2924/19043 (EP,US); H01L2924/30107 (EP,US); H01L2924/3011 (EP,US) (-)
	C-Set:	H01L2224/24227, H01L2924/1517 (US,EP); H01L2224/97, H01L2224/82 (EP,US); H01L2224/97, H01L2924/15311 (US,EP); H01L2924/12042, H01L2924/00 (EP,US); (+) H01L2924/1517, H01L2924/15153 (US,EP) (-)
Designated contracting states	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR [2003/43]
Extension states	AL	Not yet paid
	LT	Not yet paid
	LV	Not yet paid
	MK	Not yet paid
	RO	Not yet paid
	SI	Not yet paid
Title	German:	MIKROELEKTRONISCHES GEHÄUSE MIT INTEGRIERTEM KÜHLKÖRPER UND AUFBAUSCHICHTEN	[2003/43]
	English:	MICROELECTRONIC PACKAGE HAVING AN INTEGRATED HEAT SINK AND BUILD-UP LAYERS	[2003/43]
	French:	BOITIER MICRO-ELECTRONIQUE COMPRENANT UN DRAIN THERMIQUE INTEGRE ET DES COUCHES ACCUMULEES	[2003/43]
Entry into regional phase	09.06.2003	National basic fee paid
	09.06.2003	Designation fee(s) paid
	09.06.2003	Examination fee paid
Examination procedure	03.07.2002	Request for preliminary examination filed International Preliminary Examining Authority: US
	10.06.2003	Examination requested [2003/43]
	05.06.2007	Despatch of a communication from the examining division (Time limit: M06)
	14.12.2007	Reply to a communication from the examining division
	02.06.2009	Application deemed to be withdrawn, date of legal effect [2010/02]
	14.08.2009	Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2010/02]
Fees paid	Renewal fee
	26.01.2004	Renewal fee patent year 03
	22.11.2004	Renewal fee patent year 04
	29.11.2005	Renewal fee patent year 05
	27.11.2006	Renewal fee patent year 06
	27.11.2007	Renewal fee patent year 07
	Penalty fee
	Additional fee for renewal fee
	30.11.2003	03 M06 Fee paid on 26.01.2004
	30.11.2008	08 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited in	International search	[Y]JPS624351 ;
		[A]JPH03155144 ;
		[A]JPH11233678 ;
		[A]US5048179 (SHINDO MASAHIRO [JP], et al) [A] 10,18 * the whole document *;
		[A]EP0604005 (TEXAS INSTRUMENTS INC [US]) [A] 10,18 * the whole document *;
		[XY]US6025995 (MARCINKIEWICZ WALTER M [US]) [X] 1-9 * the whole document * [Y] 10-28;
		[XA]US6154366 (MA QING [US], et al) [X] 1-6 * column 4, line 44 - column 5, line 26; figure 4 * [A] 10,18;
		[PX]US2001010627 (AKAGAWA MASATOSHI [JP]) [PX] 1-3,5-8 * page 5, column R - page 6, column L; figures 5A-5F *;
		[PX]US6271469 (MA QING [US], et al) [PX] 1-9 * the whole document *;
		[XA] - BURDICK B ET AL, EXTENSION OF THE CHIP-ON-FLEX TECHNOLOGY TO KNOWN GOOD DIE, INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, VOL. 19, NR. 4, PAGE(S) 435-440, ISSN 1063-1674, XP000678162 [X] 1-6 * figure 3 * [A] 10,18
		[Y] - PATENT ABSTRACTS OF JAPAN, (19870602), vol. 011, no. 171, Database accession no. (E - 512), & JP62004351 A 19870110 (TOSHIBA CORP) [Y] 10-28 * the whole document *
		[A] - PATENT ABSTRACTS OF JAPAN, (19910930), vol. 015, no. 387, Database accession no. (E - 1117), & JP03155144 A 19910703 (SHARP CORP) [A] 10-28 * the whole document *
		[A] - PATENT ABSTRACTS OF JAPAN, (19991130), vol. 1999, no. 13, & JP11233678 A 19990827 (SUMITOMO METAL ELECTRONICS DEVICES INC) [A] 10,18 * the whole document *

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