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EP About this file: EP1213756

EP1213756 - Fabrication process of semiconductor package and semiconductor package [Right-click to bookmark this link]
Status	The application has been withdrawn Status updated on 22.07.2005 Database last updated on 11.09.2024
Most recent event Tooltip	19.03.2010	Change - representative	published on 21.04.2010 [2010/16]
Applicant(s)	For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 163-04 / JP
	[N/P]
Former [2002/24]	For all designated states HITACHI CHEMICAL CO., LTD. 1-1, Nishishinjuku 2-chome, Shinjuku-ku Tokyo 163-04 / JP
Inventor(s)	01 / Fukutomi, Naoki 8463-5, Yuki Yuki-shi, Ibaraki-ken 307 / JP
	02 / Tsubomatsu, Yoshiaki 24-2, Migimomi Tsuchiura-shi, Ibaraki-ken 300 / JP
	03 / Inoue, Fumio A403, Hitachi-Kasei-Shihoryo, 1-15-18, Hanabatake Tsukuba-shi, Ibaraki-ken 305 / JP
	04 / Yamazaki, Toshio 203, Hitachi-Matsushiro-House, 3-4-3, Matsushiro Tsukuba-shi, Ibaraki-ken 305 / JP
	05 / Ohhata, Hirohito 82-1 Imaizumi Shimotsuma-chi, Ibaraki / JP
	06 / Hagiwara, Shinsuke 1278-302, Tamado Shimodate-shi, Ibaraki-ken 308 / JP
	07 / Taguchi, Noriyuki 61-13, Nishitakenomaru Naka-ku, Yokohama / JP
	08 / Nomura, Hiroshi 227, Ajito Oyama-shi, Tochigi-ken 329-02 / JP
	[2002/45]
Former [2002/24]	01 / Fukutomi, Naoki 8463-5, Yuki Yuki-shi, Ibaraki-ken 307 / JP
	02 / Tsubomatsu, Yoshiaki 24-2, Migimomi Tsuchiura-shi, Ibaraki-ken 300 / JP
	03 / Inoue, Fumio A403, Hitachi-Kasei-Shihoryo, 1-15-18, Hanabatake Tsukuba-shi, Ibaraki-ken 305 / JP
	04 / Yamazaki, Toshio 203, Hitachi-Matsushiro-House, 3-4-3, Matsushiro Tsukuba-shi, Ibaraki-ken 305 / JP
	05 / Ohhata, Hirohito B204, Hitachi-Kasei-Shihoryo, 1-15-18, Hanabatake Tsukuba-shi, Ibaraki-ken 305 / JP
	06 / Hagiwara, Shinsuke 1278-302, Tamado Shimodate-shi, Ibaraki-ken 308 / JP
	07 / Taguchi, Noriyuki A504, Hitachi-Kasei-Shihoryo, 1-15-18, Hanabatake Tsukuba-shi, Ibaraki-ken 305 / JP
	08 / Nomura, Hiroshi 227, Ajito Oyama-shi, Tochigi-ken 329-02 / JP
Representative(s)	dompatent von Kreisler Selting Werner - Partnerschaft von Patent- und Rechtsanwälten mbB Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE
	[N/P]
Former [2010/15]	von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE
Former [2008/30]	Jönsson, Hans-Peter, et al Patentanwälte von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE
Former [2002/24]	Jönsson, Hans-Peter, Dr., et al Patentanwälte, von Kreisling Selting Werner, Deichmannhaus am Dom 50667 Köln / DE
Application number, filing date	02003794.1	17.03.1995
	[2002/24]
Priority number, date	JP19940048760	18.03.1994 Original published format: JP 4876094
	JP19940273469	08.11.1994 Original published format: JP 27346994
	JP19950007683	20.01.1995 Original published format: JP 768395
	JP19950056202	15.03.1995 Original published format: JP 5620295
	[2002/24]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP1213756
	Date:	12.06.2002
	Language:	EN
	[2002/24]
	Type:	A3 Search report
	No.:	EP1213756
	Date:	25.05.2005
	[2005/21]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	12.04.2005
Classification	IPC:	H01L21/68, H01L23/31, H01L23/498	[2002/24]
	CPC:	H01L21/568 (EP,US); H01L23/12 (KR); H01L21/4803 (EP,US); H01L21/56 (EP,US); H01L21/561 (EP,US); H01L23/3121 (EP,US); (+) H01L23/3128 (EP,US); H01L23/49811 (EP,US); H01L23/49816 (EP,US); H01L23/4985 (EP,US); H01L24/32 (EP,US); H01L24/83 (EP,US); H01L24/97 (EP,US); H05K3/30 (KR); H01L2221/68377 (EP,US); H01L2224/16237 (EP,US); H01L2224/2919 (EP,US); H01L2224/29339 (EP); H01L2224/32057 (EP,US); H01L2224/32225 (EP,US); H01L2224/32245 (EP,US); H01L2224/32503 (EP,US); H01L2224/45144 (EP,US); H01L2224/48091 (EP,US); H01L2224/48227 (EP,US); H01L2224/48228 (EP,US); H01L2224/48247 (EP,US); H01L2224/73204 (EP,US); H01L2224/73265 (EP,US); H01L2224/83001 (EP,US); H01L2224/83102 (EP,US); H01L2224/8319 (EP,US); H01L2224/83385 (EP,US); H01L2224/8381 (EP,US); H01L2224/8385 (EP,US); H01L2224/85001 (EP,US); H01L2224/92125 (EP,US); H01L2224/97 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US); H01L24/73 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01015 (EP,US); H01L2924/01019 (EP,US); H01L2924/01027 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US); H01L2924/0105 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/01322 (EP,US); H01L2924/01327 (EP,US); H01L2924/014 (EP,US); H01L2924/0665 (EP,US); H01L2924/07802 (EP,US); H01L2924/07811 (EP,US); H01L2924/12042 (EP,US); H01L2924/14 (EP,US); H01L2924/15153 (EP,US); H01L2924/1517 (EP,US); H01L2924/15183 (EP,US); H01L2924/15184 (EP,US); H01L2924/15311 (EP,US); H01L2924/181 (EP,US); H01L2924/203 (EP,US); H01L2924/351 (EP,US); H05K3/20 (EP,US) (-)
	C-Set:	H01L2224/2919, H01L2924/0665, H01L2924/00 (US,EP); H01L2224/45144, H01L2924/00014 (US,EP); H01L2224/45144, H01L2924/00015 (US,EP); H01L2224/48091, H01L2924/00014 (US,EP); (+) H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP); H01L2224/73265, H01L2224/32225, H01L2224/48227 (US,EP); H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP,US); H01L2224/73265, H01L2224/32225, H01L2224/48247, H01L2924/00 (EP,US); H01L2224/73265, H01L2224/32245, H01L2224/48227, H01L2924/00 (EP,US); H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US); H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP); H01L2224/92247, H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (EP,US); H01L2224/97, H01L2224/73204 (US,EP); H01L2224/97, H01L2224/73265 (US,EP); H01L2224/97, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP); H01L2224/97, H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US,EP); H01L2224/97, H01L2224/83 (US,EP); H01L2224/97, H01L2224/85 (US,EP); H01L2224/97, H01L2224/92247 (US,EP); H01L2224/97, H01L2224/92247, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP); H01L2224/97, H01L2924/15311 (US,EP); H01L2224/97, H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP); H01L2924/0665, H01L2924/00, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP,US); H01L2924/12042, H01L2924/00 (US,EP); H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP); H01L2924/181, H01L2924/00012 (EP,US); H01L2924/203, H01L2924/0002 (US,EP); H01L2924/351, H01L2924/00 (US,EP) (-)
Designated contracting states	DE, FR, GB [2002/24]
Title	German:	Halbleitergehäuseherstellung und Halbleitergehäuse	[2002/24]
	English:	Fabrication process of semiconductor package and semiconductor package	[2002/24]
	French:	Méthode de fabrication d'un boîtier semi-conducteur et boîtier semi-conducteur	[2002/24]
Examination procedure	20.02.2002	Examination requested [2002/24]
	16.07.2005	Application withdrawn by applicant [2005/36]
Parent application(s) Tooltip	EP95912471.0 / EP0751561
Fees paid	Renewal fee
	20.02.2002	Renewal fee patent year 03
	20.02.2002	Renewal fee patent year 04
	20.02.2002	Renewal fee patent year 05
	20.02.2002	Renewal fee patent year 06
	20.02.2002	Renewal fee patent year 07
	26.03.2002	Renewal fee patent year 08
	27.03.2003	Renewal fee patent year 09
	27.03.2004	Renewal fee patent year 10
	26.03.2005	Renewal fee patent year 11
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]JPH02153542 ;
		[Y]EP0391790 (SGS THOMSON MICROELECTRONICS [FR]) [Y] 1-18 * the whole document *;
		[Y]EP0582052 (MOTOROLA INC [US]) [Y] 1-18 * figures 3-6 *;
		[PA]WO9422168 (OLIN CORP [US])
		[A] - PATENT ABSTRACTS OF JAPAN, (19900904), vol. 014, no. 408, Database accession no. (E - 0972), & JP02153542 A 19900613 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1-18 * abstract *

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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