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EP1237187
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EP About this file: EP1237187
| EP1237187 - Resin-encapsulated semiconductor device and method for manufacturing the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 08.02.2013 Database last updated on 14.03.2026 | Most recent event Tooltip | 08.02.2013 | Application deemed to be withdrawn | published on 13.03.2013 [2013/11] | Applicant(s) | For all designated states Panasonic Corporation 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [N/P] |
| Former [2008/47] | For all designated states Panasonic Corporation 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | ||
| Former [2002/36] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 / JP | Inventor(s) | 01 /
Minamio, Masanori 3-15-102-102, Kamihamuro Takatsuki-shi, Osaka 569-1044 / JP | 02 /
Nomura, Toru 4-19-13-404, Minamimukonosho Amagasaki-shi, Hyogo 661-0033 / JP | 03 /
Kawai, Fumihiko 19, Saga-shikimigahara-wakamiyashita-cho Ukyo-ku, Kyoto-shi, Kyoto 569-1044 / JP | [2002/36] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
| Former [2002/36] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Maximilianstrasse 58 80538 München / DE | Application number, filing date | 02004517.5 | 27.02.2002 | [2002/36] | Priority number, date | JP20010056521 | 01.03.2001 Original published format: JP 2001056521 | [2002/36] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1237187 | Date: | 04.09.2002 | Language: | EN | [2002/36] | Type: | A3 Search report | No.: | EP1237187 | Date: | 08.12.2004 | [2004/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 27.10.2004 | Classification | IPC: | H01L23/495, H01L23/31, H01L21/68 | [2004/50] | CPC: |
H10W74/019 (EP,US);
H10W70/424 (EP,US);
H10W74/01 (EP,US);
H10W74/014 (EP,US);
H10W74/111 (EP,US);
H10W72/0198 (EP,US);
H10W72/07352 (EP,US);
H10W72/07504 (EP,US);
H10W72/07554 (EP,US);
H10W72/321 (EP,US);
H10W72/5449 (EP,US);
H10W72/547 (EP,US);
|
| Former IPC [2002/36] | H01L23/495, H01L23/31 | Designated contracting states | DE, GB, NL [2005/35] |
| Former [2002/36] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Harzeingekapselte Halbleiteranordnung und Herstellungsverfahren | [2002/36] | English: | Resin-encapsulated semiconductor device and method for manufacturing the same | [2002/36] | French: | Dispositif semi-conducteur encapsulé par une résine et son procédé de fabrication | [2002/36] | Examination procedure | 24.05.2005 | Examination requested [2005/29] | 25.11.2005 | Despatch of a communication from the examining division (Time limit: M06) | 10.04.2006 | Reply to a communication from the examining division | 14.02.2007 | Despatch of a communication from the examining division (Time limit: M03) | 16.05.2007 | Reply to a communication from the examining division | 04.08.2008 | Despatch of a communication from the examining division (Time limit: M04) | 11.12.2008 | Reply to a communication from the examining division | 07.04.2011 | Despatch of a communication from the examining division (Time limit: M04) | 25.07.2011 | Reply to a communication from the examining division | 04.09.2012 | Application deemed to be withdrawn, date of legal effect [2013/11] | 12.10.2012 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2013/11] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 25.11.2005 | Fees paid | Renewal fee | 20.02.2004 | Renewal fee patent year 03 | 25.02.2005 | Renewal fee patent year 04 | 23.02.2006 | Renewal fee patent year 05 | 27.02.2007 | Renewal fee patent year 06 | 28.02.2008 | Renewal fee patent year 07 | 26.02.2009 | Renewal fee patent year 08 | 26.02.2010 | Renewal fee patent year 09 | 25.02.2011 | Renewal fee patent year 10 | Penalty fee | Additional fee for renewal fee | 29.02.2012 | 11 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA] JP2000286377 | [XA] JP2000077596 | [XA] JP2000307045 [A] 6 | [XA] JPH10335566 [A] 1 | [A] JP2000150760 | [A] JPH11307707 | [XA] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) | [XA] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) | [XA] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 14 5 March 2001 (2001-03-05) [X] 1,4 * the whole document *[A] 6 | [XA] PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) [X] 6 * the whole document *[A] 1 | [A] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06) [A] 1,2,6,7 * the whole document * | [A] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29) [A] 1-4,6-8 * abstract * | by applicant | JP2000286377 | JP2000077596 |