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Extract from the Register of European Patents

EP About this file: EP1341014

EP1341014 - High-density optical connecting block [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  19.09.2003
Database last updated on 31.08.2024
Most recent event   Tooltip12.06.2009Change - representativepublished on 15.07.2009  [2009/29]
Applicant(s)For all designated states
FITEL USA CORPORATION (a Delaware Corporation)
2000 Northeast Expressway, Suite F020 Norcross
Georgia 30071 / US
[N/P]
Former [2003/36]For all designated states
FITEL USA CORPORATION (a Delaware Corporation)
2000 Northeast Expressway, Suite F020
Norcross, Georgia 30071 / US
Inventor(s)01 / Anderson, Jerry Max
6002 Windchase Court
Austell, Georgia 30001 / US
02 / Sheldon, Steven Edward
908 Treetrail Parkway
Norcross, Georgia 30093 / US
 [2003/36]
Representative(s)Schoppe, Fritz
Schoppe, Zimmermann, Stöckeler & Zinkler
Patentanwälte
Postfach 246
82043 Pullach bei München / DE
[N/P]
Former [2009/29]Schoppe, Fritz
Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246
82043 Pullach bei München / DE
Former [2003/36]Schoppe, Fritz, Dipl.-Ing.
Patentanwälte Schoppe, Zimmermann, Stöckeler & Zinkler, Postfach 246
82043 Pullach bei München / DE
Application number, filing date02004645.428.02.2002
[2003/36]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1341014
Date:03.09.2003
Language:EN
[2003/36]
Search report(s)(Supplementary) European search report - dispatched on:EP12.07.2002
ClassificationIPC:G02B6/38, // G02B6/44
[2003/36]
CPC:
G02B6/3879 (EP); G02B6/3833 (EP); G02B6/44526 (EP);
G02B6/3893 (EP)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE,   TR [2003/36]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
RONot yet paid
SINot yet paid
TitleGerman:Optischer Verbindungsblock mit hoher Dichte[2003/36]
English:High-density optical connecting block[2003/36]
French:Bloc de raccordement optique à haute densité[2003/36]
Examination procedure12.08.2002Examination requested  [2003/36]
13.05.2003Despatch of a communication from the examining division (Time limit: M04)
12.09.2003Application withdrawn by applicant  [2003/45]
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Documents cited:Search[XY]JPH1114861  ;
 [A]JPH11154563  ;
 US5214735  [ ] (HENNEBERGER ROY L [US], et al) [ ] * the whole document *;
 [Y]US5268982  (SCHAFFER RONALD R [US], et al) [Y] 6,10 * column 4, lines 32-52; figure 5 *;
 [A]US5497444  (WHEELER TODD A [US]) [A] 1-5 * column 4, lines 57-67; figure 18 * * column 5, lines 30-50 * * column 7, lines 6-20 * * column 7, lines 39-56 *;
 [A]WO0052504  (ADC TELECOMMUNICATIONS INC [US]) [A] 1-5 * page 8, lines 3-22; figures 4,33 * * page 12, line 34 - page 13, line 6 * * page 13, line 27 - page 14, line 2 *;
 [A]EP1160603  (TYCO ELECTRONICS RAYCHEM NV [BE]) [A] 1-5 * paragraph [0026]; figure 1 *;
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19990430), vol. 1999, no. 04, & JP11014861 A 19990122 (SUMITOMO ELECTRIC IND LTD;NIPPON TELEGR & TELEPH CORP ) [X] 1-5,7,8 * abstract * * paragraphs [0019] , [0025] , [0026] * [Y] 6,10
 [YA]  - IWANO S, "MU CONNECTOR SYSTEM FOR COMPACT AND DENSE PACKAGING", 1999 PROCEEDINGS 49TH. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 1999. SAN DIEGO, CA, JUNE 1 - 4, 1999, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY: IEEE, US, (19990601), ISBN 0-7803-5232-7, pages 369 - 374, XP000903812 [Y] 6,10 * the whole document * * figure 2 * [A] 9
 [A]  - PATENT ABSTRACTS OF JAPAN, (19990930), vol. 1999, no. 11, & JP11154563 A 19990608 (NTT ADVANCED TECHNOLOGY CORP;MOLEX JAPAN CO LTD) [A] 9 * abstract * * paragraphs [0001] , [0014] *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.