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EP1273380
European procedure
Extract from the Register of European Patents
EP About this file: EP1273380
| EP1273380 - Resonator for ultrasonic wire bonding [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.08.2005 Database last updated on 31.08.2024 | Most recent event Tooltip | 07.07.2006 | Lapse of the patent in a contracting state | published on 09.08.2006 [2006/32] | Applicant(s) | For all designated states Ultex Corporation 2-19-18, Higashihie, Hakata-ku Fukuoka-shi Fukuoka-ken 812-0007 / JP | [N/P] |
| Former [2003/02] | For all designated states Ultex Corporation 2-19-18, Higashihie, Hakata-ku Fukuoka-shi, Fukuoka-ken 812-0007 / JP | Inventor(s) | 01 /
Sato, Shigeru, c/o Ultex Corporation 2-19-18, Higashihie, Hakata-ku Fukuoka-shi, Fukuoka-ken 812-0007 / JP | [2003/02] | Representative(s) | Goddar, Heinz J., et al Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [N/P] |
| Former [2003/02] | Goddar, Heinz J., Dr., et al FORRESTER & BOEHMERT Pettenkoferstrasse 20-22 80336 München / DE | Application number, filing date | 02014644.5 | 02.07.2002 | [2003/02] | Priority number, date | JP20010205925 | 06.07.2001 Original published format: JP 2001205925 | [2003/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1273380 | Date: | 08.01.2003 | Language: | EN | [2003/02] | Type: | B1 Patent specification | No.: | EP1273380 | Date: | 29.09.2004 | Language: | EN | [2004/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 10.10.2002 | Classification | IPC: | B23K20/10, H01L21/00 | [2003/02] | CPC: |
H01L24/78 (EP,US);
B23K20/106 (EP,US);
H01L21/607 (KR);
H01L2224/45015 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/48 (EP,US);
H01L2224/78301 (EP,US);
H01L24/45 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/014 (EP,US)
(-)
| C-Set: |
H01L2224/45015, H01L2924/00 (US,EP);
H01L2224/45144, H01L2924/00014 (EP,US) | Designated contracting states | DE, FR, GB [2003/39] |
| Former [2003/02] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, SK, TR | Title | German: | Resonator für Ultraschallschweissen | [2003/02] | English: | Resonator for ultrasonic wire bonding | [2003/02] | French: | Resonateur pour jonction de fil par ultrasons | [2003/02] | Examination procedure | 26.02.2003 | Examination requested [2003/18] | 07.05.2003 | Despatch of a communication from the examining division (Time limit: M04) | 19.08.2003 | Reply to a communication from the examining division | 11.02.2004 | Communication of intention to grant the patent | 29.04.2004 | Fee for grant paid | 29.04.2004 | Fee for publishing/printing paid | Opposition(s) | 30.06.2005 | No opposition filed within time limit [2005/38] | Fees paid | Renewal fee | 14.07.2004 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 29.09.2004 | [2006/32] | Documents cited: | Search | [A]JP2001168142 ; | [PA]JP2002043377 ; | [A]US5326014 (MORITA MAKOTO [JP], et al) [A] 1 * column 3, lines 6-8 *; | [Y]EP0655815 (SGS THOMSON MICROELECTRONICS [IT]) [Y] 1 * column 4, lines 24-30; figure 1 *; | [Y]EP1074330 (ULTEX CORP [JP]) [Y] 1 * column 3, line 20 - line 24; figures 1,2 * | [A] - PATENT ABSTRACTS OF JAPAN, (20010210), vol. 2000, no. 23, & JP2001168142 A 20010622 (ARUTEKUSU:KK) [A] 1 * abstract * | [PA] - PATENT ABSTRACTS OF JAPAN, (20020604), vol. 2002, no. 06, & JP2002043377 A 20020208 (ARUTEKUSU:KK) [PA] 1 * abstract * |