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EP1307079
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EP About this file: EP1307079
| EP1307079 - Marking apparatus used in a process for producing multi-layered printed circuit board [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 02.07.2004 Database last updated on 03.09.2024 | Most recent event Tooltip | 26.09.2008 | Change - representative | published on 29.10.2008 [2008/44] | Applicant(s) | For all designated states Adtec Engineering Co., Ltd. 4-30, Shiba Kouen 3-chome, Minato-ku Tokyo 105-0011 / JP | [N/P] |
| Former [2003/18] | For all designated states Adtec Engineering Co., Ltd. 4-30, Shiba Kouen 3-chome, Minato-ku Tokyo 105-0011 / JP | Inventor(s) | 01 /
Ida, Ryoichi Adtec Eng. Co., Ltd., 4-30 Shiba Kouen 3-chome Minato-ku, Tokyo 105-0011 / JP | 02 /
Sangu, Katsuya Adtec Eng. Co., Ltd., 4-30 Shiba Kouen 3-chome Minato-ku, Tokyo 105-0011 / JP | 03 /
Momose, Katsumi Adtec Eng. Co., Ltd., 4-30 Shiba Kouen 3-chome Minato-ku, Tokyo 105-0011 / JP | 04 /
Nakagawa, Wataru Adtec Eng. Co., Ltd., 4-30 Shiba Kouen 3-chome Minato-ku, Tokyo 105-0011 / JP | [2003/18] | Representative(s) | Klingseisen, Franz, et al Klingseisen, Rings & Partner Patentanwälte Postfach 10 15 61 80089 München / DE | [N/P] |
| Former [2008/44] | Klingseisen, Franz, et al Klingseisen & Partner Postfach 10 15 61 80089 München / DE | ||
| Former [2003/18] | Klingseisen, Franz, Dipl.-Ing., et al Patentanwälte, Dr. F. Zumstein, Dipl.-Ing. F. Klingseisen, Postfach 10 15 61 80089 München / DE | Application number, filing date | 02023671.7 | 22.10.2002 | [2003/18] | Priority number, date | JP20010328514 | 26.10.2001 Original published format: JP 2001328514 | [2003/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1307079 | Date: | 02.05.2003 | Language: | EN | [2003/18] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.02.2003 | Classification | IPC: | H05K3/46, H05K1/02 | [2003/18] | CPC: |
H05K3/4679 (EP,US);
H05K3/00 (KR);
H05K1/0269 (EP,US);
H05K2201/09918 (EP,US);
H05K3/0008 (EP,US);
H05K3/0082 (EP,US);
H05K3/4652 (EP,US)
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| Designated contracting states | (deleted) [2004/04] |
| Former [2003/18] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, SK, TR | Title | German: | Markierungsvorrichtung zur Anwendung in einem Verfahren zur Herstellung einer mehrschichtigen Leiterplatte | [2003/18] | English: | Marking apparatus used in a process for producing multi-layered printed circuit board | [2003/18] | French: | Dispositif de marquage utilisé dans un procédé de fabrication d'un panneau à circuit imprimé multicouche | [2003/18] | Examination procedure | 04.11.2003 | Application deemed to be withdrawn, date of legal effect [2004/34] | 03.03.2004 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2004/34] | Fees paid | Penalty fee | Penalty fee Rule 85a EPC 1973 | 15.12.2003 | AT M01 Not yet paid | 15.12.2003 | BE M01 Not yet paid | 15.12.2003 | BG M01 Not yet paid | 15.12.2003 | CH M01 Not yet paid | 15.12.2003 | CY M01 Not yet paid | 15.12.2003 | CZ M01 Not yet paid | 15.12.2003 | DE M01 Not yet paid | 15.12.2003 | DK M01 Not yet paid | 15.12.2003 | EE M01 Not yet paid | 15.12.2003 | ES M01 Not yet paid | 15.12.2003 | FI M01 Not yet paid | 15.12.2003 | FR M01 Not yet paid | 15.12.2003 | GB M01 Not yet paid | 15.12.2003 | GR M01 Not yet paid | 15.12.2003 | IE M01 Not yet paid | 15.12.2003 | IT M01 Not yet paid | 15.12.2003 | LU M01 Not yet paid | 15.12.2003 | MC M01 Not yet paid | 15.12.2003 | NL M01 Not yet paid | 15.12.2003 | PT M01 Not yet paid | 15.12.2003 | SE M01 Not yet paid | 15.12.2003 | SK M01 Not yet paid | 15.12.2003 | TR M01 Not yet paid | Penalty fee Rule 85b EPC 1973 | 15.12.2003 | M01 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2001148571 ; | [X]EP0264243 (LOMA PARK ASSOC INC [US]) [X] 1 * abstract *; | [Y]DE4240141 (DU PONT DEUTSCHLAND [DE]) [Y] 3,4 * page 4, line 25 - line 32 *; | [XY]EP1039789 (IBIDEN CO LTD [JP]) [X] 1,2 * column 16, line 26 - line 56; figure 5 * [Y] 3-5; | [DY]EP1139706 (ADTEC ENG CO LTD [JP]) [DY] 5 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (20010309), vol. 2000, no. 22, & JP2001148571 A 20010529 (CLOVER DENSHI KOGYO KK) [A] 1,2 * abstract * |