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EP1261021

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EP About this file: EP1261021

EP1261021 - Method of production of circuit board, semiconductor device, and plating system [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 17.04.2015 Database last updated on 20.09.2024
Most recent event Tooltip	17.04.2015	Application deemed to be withdrawn	published on 20.05.2015 [2015/21]
Applicant(s)	For all designated states SHINKO ELECTRIC INDUSTRIES CO. LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi Nagano 380-0921 / JP
	[N/P]
Former [2002/48]	For all designated states SHINKO ELECTRIC INDUSTRIES CO. LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP
Inventor(s)	01 / Mashino, Naohiro, Shinko Electric Ind. Co.Ltd 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP
	[2002/48]
Representative(s)	Santarelli Tour Trinity 1 bis Esplanade de la Défense 92035 Paris La Défense Cedex / FR
	[N/P]
Former [2003/18]	Santarelli 14, avenue de la Grande Armée, B.P. 237 75822 Paris Cedex 17 / FR
Former [2002/48]	Quantin, Bruno Marie Henri Rinuy, Santarelli, 14 Avenue de la Grande Armée 75017 Paris / FR
Application number, filing date	02291236.4	17.05.2002
	[2002/48]
Priority number, date	JP20010151027	21.05.2001 Original published format: JP 2001151027
	[2002/48]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP1261021
	Date:	27.11.2002
	Language:	EN
	[2002/48]
	Type:	A3 Search report
	No.:	EP1261021
	Date:	08.02.2006
	[2006/06]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	23.12.2005
Classification	IPC:	H01L21/48	[2002/48]
	CPC:	H05K3/423 (EP,US); H01L21/288 (EP,US); H01L21/2885 (EP,US); H01L21/32115 (EP,US); H01L21/3212 (EP,US); H01L21/4846 (EP,US); (+) H01L21/486 (EP,US); H01L21/76898 (EP,US); H05K3/045 (EP,US); H01L2224/16 (EP,US); H01L25/0657 (EP,US); H01L2924/01004 (EP,US); H01L2924/01019 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/10253 (EP,US); H01L2924/15311 (EP,US); H05K1/0306 (EP,US); H05K2201/0376 (EP,US); H05K2201/09036 (EP,US); H05K2201/09563 (EP,US); H05K2203/0143 (EP,US); H05K2203/1509 (EP,US); H05K3/107 (EP,US); H05K3/388 (EP,US); H05K3/4608 (EP,US); Y10T29/49155 (EP,US); Y10T29/49156 (EP,US); Y10T29/49165 (EP,US) (-)
	C-Set:	H01L2924/10253, H01L2924/00 (EP,US)
Designated contracting states	FR [2006/41]
Former [2002/48]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR
Title	German:	Leiterplattenherstellungsmethode, Halbleitervorrichtung und Beschichtungssystem	[2002/48]
	English:	Method of production of circuit board, semiconductor device, and plating system	[2002/48]
	French:	Méthode de fabrication des plaquettes de circuit imprimés, dispositif semi-conducteur et système de revêtement	[2002/48]
Examination procedure	04.04.2006	Examination requested [2006/25]
	23.04.2009	Despatch of a communication from the examining division (Time limit: M06)
	30.10.2009	Reply to a communication from the examining division
	25.09.2014	Despatch of a communication from the examining division (Time limit: M02)
	06.12.2014	Application deemed to be withdrawn, date of legal effect [2015/21]
	13.01.2015	Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2015/21]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 23.04.2009
Fees paid	Renewal fee
	24.05.2004	Renewal fee patent year 03
	06.07.2005	Renewal fee patent year 04
	27.03.2006	Renewal fee patent year 05
	14.05.2007	Renewal fee patent year 06
	31.03.2008	Renewal fee patent year 07
	12.05.2009	Renewal fee patent year 08
	31.03.2010	Renewal fee patent year 09
	11.05.2011	Renewal fee patent year 10
	29.03.2012	Renewal fee patent year 11
	10.05.2013	Renewal fee patent year 12
	27.03.2014	Renewal fee patent year 13
	Penalty fee
	Additional fee for renewal fee
	31.05.2005	04 M06 Fee paid on 06.07.2005
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]DE3150399 (SCHERING AG [DE]) [Y] 3 * the whole document *;
		[A]DD257176 (NARVA ROSA LUXEMBURG K [DD]) [A] 10,11 * the whole document *;
		[A]US4766017 (HEYMANN KURT [DE], et al) [A] 3 * the whole document *;
		[A]EP0712156 (AT & T CORP [US]) [A] 4 * the whole document *;
		[A]US5798298 (YANG MING-TZONG [TW], et al) [A] 4 * the whole document *;
		[X]WO9941434 (ACM RES INC [US]) [X] 10,11 * the whole document *;
		[Y]JPH11288940 (MOTOROLA INC) [Y] 7 * claims 1,5,6 *;
		[Y]JPH11307633 (SONY CORP) [Y] 4 * claim - *;
		[X]EP0973195 (ST MICROELECTRONICS INC [US]) [X] 1,8,9 * the whole document *;
		[A]GB2344464 (NEC CORP [JP]) [A] 5 * the whole document *;
		[X]US6083376 (AKRAM SALMAN [US], et al) [X] 10,11 * the whole document *;
		[YA]US6132586 (ADAMS JOHN A [US], et al) [Y] 2 * abstract * [A] 10,11;
		[XY]CN1275802 (NEC CORP [JP]) [X] 1,8 [Y] 2,2-7;
		[A]EP1061578 (SEIKO EPSON CORP [JP]) [A] 5 * figure 5; example 1 *;
		[Y]JP2001023989 (APPLIED MATERIALS INC) [Y] 7 * claim 8 *;
		[A]US6221769 (DHONG SANG HOO [US], et al) [A] 5 * column 6, line 44 - line 47; figure 2 * * column 7, line 45 - line 55; figure 4B *;
		[PA]WO0152307 (NUTOOL INC [US]) [PA] 10,11 * the whole document *;
		[PA]US6300244 (ITABASHI TAKEYUKI [JP], et al) [PA] 7 * column 7, line 55 - line 58 *;
		US6316359 [ ] (SIMPSON CINDY REIDSEMA [US]) [ ] * claims 1,5,6 *;
		US6342447 [ ] (HOSHINO AKIRA [JP]) [ ] * column 1, line 1 - column 2, line 64; figures 1,2,6 *;
		[PX]US2002053730 (MASHINO NAOHIRO [JP]) [PX] 6 * the whole document *;
		US2002058411 [ ] (HASEGAWA TOSHIAKI [JP], et al) [ ] * claim - *;
		US2002119657 [ ] (GANDIKOTA SRINIVAS [US], et al);
		[Y] - JAAFAR M A S ET AL, "A PLATED THROUGH-HOLE INTERCONNECT TECHNOLOGY IN SILICON", EXTENDED ABSTRACTS, ELECTROCHEMICAL SOCIETY. PRINCETON, NEW JERSEY, US, (199201), vol. 94/2, ISSN 0160-4619, page 490, XP000550868 [Y] 5,6 * the whole document *
		[A] - CHIN-AN CHANG ET AL, "Carbon as a barrier for the outdiffusion of Cu", INSPEC, THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB, (19890619), Database accession no. 3441060, XP002358614 [A] 7 * abstract *
		[ ] - Applied Physics Letters USA, (19890619), vol. 54, no. 25, ISSN 0003-6951, pages 2545 - 2547

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