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EP1273384
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EP About this file: EP1273384
| EP1273384 - Lead-free solder alloy [Right-click to bookmark this link] | Status | The application has been refused Status updated on 21.02.2014 Database last updated on 02.11.2024 | Most recent event Tooltip | 21.02.2014 | Refusal of application | published on 26.03.2014 [2014/13] | Applicant(s) | For all designated states SENJU METAL INDUSTRY CO., LTD. 23 Senju-Hashido-cho Adachi-ku Tokyo / JP | [N/P] |
| Former [2003/02] | For all designated states SENJU METAL INDUSTRY CO., LTD. 23 Senju-Hashido-cho Adachi-ku Tokyo / JP | Inventor(s) | 01 /
Munekata, Osamu 4-20-18, Hanaguri, Souka-shi Saitama / JP | 02 /
Toyoda, Yoshitaka 4-16-21, Kahinata, Satte-shi Saitama / JP | 03 /
Ohnishi, Tsukasa 405, Yatsuka, Souka-shi Saitama / JP | 04 /
Ueshima, Minoru 2-483-1, Takano, Misato-shi Saitama / JP | [2003/02] | Representative(s) | Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE | [N/P] |
| Former [2011/13] | Zimmermann & Partner Postfach 330 920 80069 München / DE | ||
| Former [2003/02] | Warcoin, Jacques, et al Cabinet Régimbeau 20, rue de Chazelles 75847 Paris cedex 17 / FR | Application number, filing date | 02291590.4 | 26.06.2002 | [2003/02] | Priority number, date | JP20010195903 | 28.06.2001 Original published format: JP 2001195903 | [2003/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1273384 | Date: | 08.01.2003 | Language: | EN | [2003/02] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.10.2002 | Classification | IPC: | B23K35/26 | [2003/02] | CPC: |
C22C13/00 (EP,KR,US);
B23K1/0016 (EP,US);
B23K1/085 (EP,US);
B23K1/203 (EP,US);
B23K35/262 (EP,US);
B23K2101/42 (EP,US);
H05K3/3463 (EP,US)
(-)
| Designated contracting states | DE, FR, GB [2003/39] |
| Former [2003/02] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Bleifreie Weichlötlegierung | [2003/02] | English: | Lead-free solder alloy | [2003/02] | French: | Alliage de soudure sans plomb | [2003/02] | Examination procedure | 10.06.2003 | Examination requested [2003/33] | 09.07.2003 | Loss of particular rights, legal effect: designated state(s) | 27.10.2003 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, CY, DK, ES, FI, GR, IE, IT, LU, MC, NL, PT, SE, TR | 18.11.2005 | Despatch of a communication from the examining division (Time limit: M06) | 24.04.2006 | Reply to a communication from the examining division | 02.04.2007 | Despatch of a communication from the examining division (Time limit: M06) | 21.09.2007 | Reply to a communication from the examining division | 07.11.2007 | Observations by third parties | 01.02.2008 | Despatch of a communication from the examining division (Time limit: M06) | 25.07.2008 | Reply to a communication from the examining division | 02.10.2008 | Observations by third parties | 12.01.2009 | Observations by third parties | 29.05.2009 | Despatch of a communication from the examining division (Time limit: M06) | 04.12.2009 | Reply to a communication from the examining division | 31.03.2011 | Date of oral proceedings | 19.07.2011 | Despatch of communication that the application is refused, reason: substantive examination [2014/13] | 19.07.2011 | Minutes of oral proceedings despatched | 17.09.2013 | Application refused, date of legal effect [2014/13] | Appeal following examination | 19.09.2011 | Appeal received No. T0114/12 | 17.11.2011 | Statement of grounds filed | 17.09.2013 | Result of appeal procedure: appeal of the applicant was rejected | 17.09.2013 | Date of oral proceedings | 23.09.2013 | Minutes of oral proceedings despatched | Divisional application(s) | EP07117095.5 / EP1897649 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 18.11.2005 | Fees paid | Renewal fee | 18.06.2004 | Renewal fee patent year 03 | 20.06.2005 | Renewal fee patent year 04 | 12.06.2006 | Renewal fee patent year 05 | 29.05.2007 | Renewal fee patent year 06 | 05.05.2008 | Renewal fee patent year 07 | 22.06.2009 | Renewal fee patent year 08 | 14.06.2010 | Renewal fee patent year 09 | 30.06.2011 | Renewal fee patent year 10 | 29.06.2012 | Renewal fee patent year 11 | 28.06.2013 | Renewal fee patent year 12 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 12.08.2003 | AT M01 Not yet paid | 12.08.2003 | BE M01 Not yet paid | 12.08.2003 | CH M01 Not yet paid | 12.08.2003 | CY M01 Not yet paid | 12.08.2003 | DK M01 Not yet paid | 12.08.2003 | ES M01 Not yet paid | 12.08.2003 | FI M01 Not yet paid | 12.08.2003 | GR M01 Not yet paid | 12.08.2003 | IE M01 Not yet paid | 12.08.2003 | IT M01 Not yet paid | 12.08.2003 | LU M01 Not yet paid | 12.08.2003 | MC M01 Not yet paid | 12.08.2003 | NL M01 Not yet paid | 12.08.2003 | PT M01 Not yet paid | 12.08.2003 | SE M01 Not yet paid | 12.08.2003 | TR M01 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JP2001071173 ; | [X]JP2000015476 ; | [X]JPH1034376 ; | [X]EP0336575 (COOKSON GROUP PLC [GB]) [X] 1,2,4,5 * example 2 *; | [A]EP0855242 (MATSUSHITA ELECTRIC IND CO LTD [JP], et al); | [X]US5980822 (MOON YOUNG-ZOON [KR], et al) [X] 1,2,4,5 * claim . *; | [X]WO0103878 (MULTICORE SOLDERS LTD [GB], et al) [X] 1,2,4-8 * claim - *; | [A]EP1106301 (NIPPON SHEET GLASS CO LTD [JP]) | [X] - PATENT ABSTRACTS OF JAPAN, (20010710), vol. 2000, no. 20, & JP2001071173 A 20010321 (ISHIKAWA KINZOKU KK) [X] 1-3 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (20000831), vol. 2000, no. 04, & JP2000015476 A 20000118 (ISHIKAWA KINZOKU KK) [X] 1-4 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19980430), vol. 1998, no. 06, & JP10034376 A 19980210 (NIPPON GENMA:KK) [X] 1-4 * abstract * | Examination | JP2002263880 | US2003024733 | by applicant | EP0336575 | US5390845 | JPH1034376 | US5980822 | JP2000015476 | WO0103878 | JP2001071173 | other | GB601029 | US5390845 | US5817194 |