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EP1403923
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EP About this file: EP1403923
| EP1403923 - Press pack power semiconductor module [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 13.05.2005 Database last updated on 22.08.2024 | Most recent event Tooltip | 13.05.2005 | Application deemed to be withdrawn | published on 29.06.2005 [2005/26] | Applicant(s) | For all designated states ABB Research Ltd. Affolternstrasse 52 8050 Zürich / CH | [N/P] |
| Former [2004/14] | For all designated states ABB RESEARCH LTD. Affolternstrasse 52 8050 Zürich / CH | Inventor(s) | 01 /
Gunturi, Satish Im Ergel 10 5404 Baden / CH | 02 /
Schneider, Daniel Promenadengasse 12 8001 Zürich / CH | [2004/14] | Representative(s) | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property CH-IP Brown Boveri Strasse 6 5400 Baden / CH | [N/P] |
| Former [2004/14] | ABB Patent Attorneys c/o ABB Schweiz AG, Intellectual Property (CH-LC/IP), Brown Boveri Strasse 6 5400 Baden / CH | Application number, filing date | 02405836.4 | 27.09.2002 | [2004/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1403923 | Date: | 31.03.2004 | Language: | EN | [2004/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 14.05.2003 | Classification | IPC: | H01L23/48, H01L23/492 | [2004/14] | CPC: |
H01L24/72 (EP,US);
H01L23/051 (EP,US);
H01L23/4924 (EP,US);
H01L23/62 (EP,US);
H01L25/072 (EP,US);
H01L24/29 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01012 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/01322 (EP,US);
H01L2924/01327 (EP,US);
H01L2924/014 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/1301 (EP,US);
H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/3011 (EP,US)
(-)
| C-Set: |
H01L2924/10253, H01L2924/00 (EP,US);
H01L2924/1301, H01L2924/00 (US,EP);
H01L2924/1305, H01L2924/00 (US,EP)
| Designated contracting states | [2004/52] |
| Former [2004/14] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, SK, TR | Title | German: | Leistungshalbleitermodul in Druckpackung | [2004/14] | English: | Press pack power semiconductor module | [2004/14] | French: | Dispositif semi-conducteur dans un empaquetage à pression | [2004/14] | Examination procedure | 01.10.2004 | Application deemed to be withdrawn, date of legal effect [2005/26] | 25.01.2005 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2005/26] | Fees paid | Penalty fee | Penalty fee Rule 85a EPC 1973 | 09.11.2004 | DE M01 Not yet paid | Penalty fee Rule 85b EPC 1973 | 09.11.2004 | M01 Not yet paid | Additional fee for renewal fee | 30.09.2004 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPS5921033 ; | [XA]US4196442 (ARAKAWA HIDEO [JP], et al) [X] 1-3,8,9 * column 6, line 34 - column 8, line 41; figures 1,2 * [A] 4-7; | [A]EP0012019 (HITACHI LTD [JP]) [A] 1-10 * Paragraph bridging pages 2 and 3. *; | [Y]EP0049791 (HITACHI LTD [JP]) [Y] 1-3,8,9 * page 1, line 19 - page 1, line 23 *; | [A]DE3731624 (ASEA BROWN BOVERI [DE]) [A] 1-10 * See complete document. *; | [Y]DE3838968 (ASEA BROWN BOVERI [CH]) [Y] 1-3,8,9 * page 2, line 8 - page 4, line 40; figure 1 *; | [Y]US6320268 (LANG THOMAS [CH], et al) [Y] 1-3,8,9 * column 2, line 59 - column 3, line 18; figure 1 * | [A] - PATENT ABSTRACTS OF JAPAN, (19840515), vol. 008, no. 103, Database accession no. (E - 244), & JP59021033 A 19840202 (MITSUBISHI DENKI KK) [A] 1 * abstract * |