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EP1399961
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EP About this file: EP1399961
| EP1399961 - DYNAMIC METROLOGY SCHEMES AND SAMPLING SCHEMES FOR ADVANCED PROCESS CONTROL IN SEMICONDUCTOR PROCESSING [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.04.2010 Database last updated on 31.08.2024 | Most recent event Tooltip | 09.04.2010 | Application deemed to be withdrawn | published on 12.05.2010 [2010/19] | Applicant(s) | For all designated states Applied Materials, Inc. P.O. Box 450A Santa Clara, California 95052 / US | [N/P] |
| Former [2004/13] | For all designated states Applied Materials, Inc. P.O. Box 450A Santa Clara, California 95052 / US | Inventor(s) | 01 /
SHANMUGASUNDRAM, Arulkumar, P. 428 Madera Avenue 10 Sunnyvale, CA 94086 / US | 02 /
SCHWARM, Alexander, T. 9303 La Puente Drive Austin, TX 78749 / US | [2004/13] | Representative(s) | Blatchford, William Michael, et al Withers & Rogers LLP 4 More London Riverside London SE1 2AU / GB | [N/P] |
| Former [2008/35] | Blatchford, William Michael, et al Withers & Rogers LLP Goldings House 2 Hays Lane London SE1 2HW / GB | ||
| Former [2004/13] | Blatchford, William Michael, et al Withers & Rogers, Goldings House, 2 Hays Lane London SE1 2HW / GB | Application number, filing date | 02739908.8 | 17.06.2002 | [2004/13] | WO2002US19116 | Priority number, date | US20010298878P | 19.06.2001 Original published format: US 298878 P | US20010322459P | 17.09.2001 Original published format: US 322459 P | US20020135451 | 01.05.2002 Original published format: US 135451 | [2004/13] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO02103778 | Date: | 27.12.2002 | Language: | EN | [2002/52] | Type: | A2 Application without search report | No.: | EP1399961 | Date: | 24.03.2004 | Language: | EN | The application published by WIPO in one of the EPO official languages on 27.12.2002 takes the place of the publication of the European patent application. | [2004/13] | Search report(s) | International search report - published on: | EP | 11.12.2003 | Classification | IPC: | H01L21/66 | [2004/13] | CPC: |
B24B37/013 (EP,US);
B24B37/042 (EP,US);
B24B49/03 (EP,US);
B24B49/18 (EP,US);
B24B53/017 (EP,US);
G05B19/00 (EP,US);
G05B19/19 (EP,US);
G05B19/41865 (EP,US);
H01L21/67253 (EP,US);
H01L21/67276 (EP,US);
H01L22/00 (KR);
H01L22/20 (EP,US);
G05B2219/32053 (EP,US);
G05B2219/32065 (EP,US);
G05B2219/45031 (EP,US);
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR [2004/13] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | SI | Not yet paid | Title | German: | DYNAMISCHES MESS- UND PROBENSCHEMA ZUR FORTSCHRITTLICHEN HALBLEITERFERTIGUNGSKONTROLLE | [2004/13] | English: | DYNAMIC METROLOGY SCHEMES AND SAMPLING SCHEMES FOR ADVANCED PROCESS CONTROL IN SEMICONDUCTOR PROCESSING | [2004/13] | French: | SCHEMAS DYNAMIQUES DE METROLOGIE ET D'ECHANTILLONNAGE POUR PROCEDES AVANCES DE VERIFICATION LORS DU TRAITEMENT DE SEMI-CONDUCTEURS | [2004/13] | Entry into regional phase | 15.01.2004 | National basic fee paid | 15.01.2004 | Designation fee(s) paid | 15.01.2004 | Examination fee paid | Examination procedure | 15.01.2004 | Examination requested [2004/13] | 23.06.2009 | Despatch of a communication from the examining division (Time limit: M04) | 04.11.2009 | Application deemed to be withdrawn, date of legal effect [2010/19] | 09.12.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2010/19] | Fees paid | Renewal fee | 04.06.2004 | Renewal fee patent year 03 | 06.06.2005 | Renewal fee patent year 04 | 27.03.2006 | Renewal fee patent year 05 | 08.06.2007 | Renewal fee patent year 06 | 18.03.2008 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 30.06.2009 | 08 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]US6002989 (SHIBA MASATAKA [JP], et al) [X] 1-11,17-27,33-43,49-59 * abstract * * column 2, line 27 - column 4, line 53 * * column 11, line 39 - column 12, line 9 *; | [X]WO9959200 (APPLIED MATERIALS INC [US]) [X] 1-11,17-27,33-43,49-59 * page 16, paragraph 3 - page 19, paragraph 3; figures 1,4 *; | [PX]WO0152319 (ADVANCED MICRO DEVICES INC [US]) [PX] 1,17,33,43 * abstract *; | [X]US5546312 (MOZUMDER PURNENDU K [US], et al) [X] 1-12,17-28,33-44,49-60 * abstract * * column 3, lines 55,52 * * column 5, line 66 - column 6, line 3 * * column 9, line 48 - column 10, line 12 *; | [YA]WO0111679 (ADVANCED MICRO DEVICES INC [US]) [Y] 16,32,48 * page 6, lines 5-14 * [A] 12,31,44,60; | [PX]WO0180306 (ADVANCED MICRO DEVICES INC [US]) [PX] 1-12,17-28,33-44,49-63 * abstract * * page 16, lines 11-15 * * page 17, lines 1-8 *; | [XY]WO0054325 (NOVA MEASURING INSTR LTD [IL], et al) [X] 1-11,13-15,17-27,29-31,33-43,45-47,49-59,61-63 * page 11, line 4 - page 17, line 19; figures 6A-C,8A,B * [Y] 16,32,48; | [A] - WILLIAMS R ET AL, Optimized sample planning for wafer defect inspection, SEMICONDUCTOR MANUFACTURING CONFERENCE PROCEEDINGS, 1999 IEEE INTERNATIONAL SYMPOSIUM ON SANTA CLARA, CA, USA 11-13 OCT. 1999, PISCATAWAY, NJ, USA,IEEE, US, PAGE(S) 43-46, ISBN 0-7803-5403-6, XP010360683 [A] 1,17,33,49 * the whole document * DOI: http://dx.doi.org/10.1109/ISSM.1999.808734 | [A] - EL CHEMALI C AND AL, "Multizone uniformity control of a chemical mechanical polishing process utilizing a pre- and postmeasurement strategy", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART A, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, (200007), vol. 18, no. 4, pt 1-2, ISSN 0734-2101, pages 1287 - 1296, XP002217674 [A] 13-15,29-31,45-47,61-63 * abstract * DOI: http://dx.doi.org/10.1116/1.582342 |