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Extract from the Register of European Patents

EP About this file: EP1337136

EP1337136 - Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  19.09.2014
Database last updated on 18.11.2024
Most recent event   Tooltip19.09.2014Application deemed to be withdrawnpublished on 22.10.2014  [2014/43]
Applicant(s)For all designated states
Invensas Corporation
2702 Orchard Parkway
San Jose, CA 95134 / US
[2012/14]
Former [2008/13]For all designated states
Tessera Interconnect Materials, Inc.
3099 Orchard Drive
San Jose, CA 95134 / US
Former [2008/08]For all designated states
Tessera Interconnect Materials, Inc.
3099 Orchard Drive
San Jose, CA 95134 / US
For all designated states
Socketstrate, Inc.
3099 Orchard Drive
San Jose, CA 95134 / US
Former [2005/45]For all designated states
North Corporation
32-1, Minami-Otsuka 3-chome, Toshima-ku
Tokyo 170-0005 / JP
For all designated states
Socketstrate, Inc.
3099 Orchard Drive
San Jose, CA 95134 / US
Former [2003/34]For all designated states
North Corporation
32-1, Minami-Otsuka 3-chome, Toshima-ku
Tokyo 170-0005 / JP
Inventor(s)01 / Tomoo, Iijima
North Corp., 3-32-1 Minami-Otsuka
Toshima-ku, Tokyo 170-0005 / JP
02 / Kimitaka, Endo
North Corp., 3-32-1 Minami-Otsuka
Toshima-ku, Tokyo 170-0005 / JP
 [2003/34]
Representative(s)Schmidt, Karsten, et al
ZACCO GmbH
Bayerstrasse 83
80335 München / DE
[N/P]
Former [2009/02]Schmidt, Karsten, et al
Albihns GmbH Bayerstrasse 83
80335 München / DE
Former [2007/25]Bergstrand, Mikael Gudmundsson
Albihns GmbH Bayerstrasse 83
80335 München / DE
Former [2003/34]VOSSIUS & PARTNER
Siebertstrasse 4
81675 München / DE
Application number, filing date03000528.409.01.2003
[2003/34]
Priority number, dateJP2002003941418.02.2002         Original published format: JP 2002039414
JP2002023377809.08.2002         Original published format: JP 2002233778
[2003/34]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1337136
Date:20.08.2003
Language:EN
[2003/34]
Type: A3 Search report 
No.:EP1337136
Date:27.07.2005
[2005/30]
Search report(s)(Supplementary) European search report - dispatched on:EP14.06.2005
ClassificationIPC:H05K3/46
[2003/34]
CPC:
H05K3/4617 (EP,US); H01L23/522 (KR); H05K3/4038 (EP,US);
H01L2924/0002 (EP,US); H05K2201/0154 (EP,US); H05K2201/0355 (EP,US);
H05K2201/096 (EP,US); H05K2201/10378 (EP,US); H05K2203/0113 (EP,US);
H05K2203/0143 (EP,US); H05K2203/0156 (EP,US); H05K2203/0369 (EP,US);
H05K2203/0384 (EP,US); H05K2203/063 (EP,US); H05K2203/1189 (EP,US);
H05K2203/1461 (EP,US); H05K2203/1476 (EP,US); H05K2203/1572 (EP,US);
H05K3/06 (EP,US); H05K3/108 (EP,US); H05K3/20 (EP,US);
H05K3/386 (EP,US); H05K3/4602 (EP,US); H05K3/4652 (EP,US);
H05K3/4658 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB [2006/16]
Former [2003/34]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  SI,  SK,  TR 
TitleGerman:Verbindungselement zwischen Leiterfolien, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung eines mehrschichtigen Leitersubstrats[2003/34]
English:Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate[2003/34]
French:Elément de liaison entre des films de câblage, son procédé de fabrication, et procédé de fabrication d'un substrat de câblage multicouche[2003/34]
Examination procedure04.01.2006Examination requested  [2006/10]
06.01.2014Despatch of a communication from the examining division (Time limit: M04)
17.05.2014Application deemed to be withdrawn, date of legal effect  [2014/43]
13.06.2014Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2014/43]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  06.01.2014
Fees paidRenewal fee
31.01.2005Renewal fee patent year 03
31.01.2006Renewal fee patent year 04
30.01.2007Renewal fee patent year 05
20.12.2007Renewal fee patent year 06
07.01.2009Renewal fee patent year 07
07.01.2010Renewal fee patent year 08
06.01.2011Renewal fee patent year 09
06.01.2012Renewal fee patent year 10
08.01.2013Renewal fee patent year 11
21.01.2014Renewal fee patent year 12
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Licence(s)ID:01 00/exclusive
For:AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR
Licencee:Socketstrate, Inc.
3099 Orchard Drive
San Jose, CA 95134 / US
Date:28.08.2005
ID:02 00/exclusive
For:AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR
Licencee:North Corporation
3-37-5 Minami-otsuka Toshima-ku
Tokyo 170 / JP
Date:26.08.2005
[2005/47]
Documents cited:Search[A]JPH09172259  ;
 [A]JPH10117066  ;
 [AY]GB1126370  (BRITISH AIRCRAFT CORP LTD) [A] 3 * the whole document * [Y] 9;
 [AY]US5374469  (HINO ATSUSHI [JP], et al) [A] 1,2,4,6,16 * column 9, line 26 - column 10, line 11; figures 4-6 * * column 15, lines 7-17; figure 22 * * column 15, lines 33-46; figure 24 * [Y] 9;
 [A]US5442143  (SCHMIDT WALTER [DE], et al) [A] 1,3,12 * figure -; claim - *;
 [A]US5822850  (ODAIRA HIROSHI [JP], et al) [A] 1,3-7,13 * figure -; claim - *;
 [A]US5865934  (YAMAMOTO YUICHI [JP], et al) [A] 1,3-7,9,13,16 * figure -; claim - *;
 [A]US6153518  (ABBOTT DONALD C [US], et al) [A] 1,3,8 * the whole document *;
 [A]US2002000328  (MOTOMURA TOMOHISA [JP], et al) [A] 1,3,13 * figure -; claim - *;
 [A]DE10037819  (BOSCH GMBH ROBERT [DE]) [A] 1,3,4,9 * column 2, line 6 - column 3, line 13; figure 1 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19971031), vol. 1997, no. 10, & JP09172259 A 19970630 (TOSHIBA CORP) [A] 1,3,4 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19980831), vol. 1998, no. 10, & JP10117066 A 19980506 (TOSHIBA CORP) [A] 3,4,14 * abstract *
ExaminationUS5600103
 JP2000228580
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