EP1376231 - Photosensitive polymer composition, method of forming relief patterns, and electronic equipment [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.02.2010 Database last updated on 29.10.2024 | Most recent event Tooltip | 05.02.2010 | No opposition filed within time limit | published on 10.03.2010 [2010/10] | Applicant(s) | For all designated states Hitachi Chemical DuPont MicroSystems Ltd. 4-1, Koishikawa 1-chome Bunkyou-ku Tokyo 112-0002 / JP | [2008/35] |
Former [2004/01] | For all designated states Hitachi Chemical DuPont MicroSystems Ltd. 10-13, Shibuya 3-chome Shibuya-ku, Tokyo 150-0002 / JP | Inventor(s) | 01 /
Nunomura, Masataka, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | 02 /
Ooe, Masayuki, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | 03 /
Nakano, Hajime, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | 04 /
Tsumaru, Yoshiko, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | 05 /
Ueno, Takumi, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | [2004/15] |
Former [2004/01] | 01 /
Nunomura, Masataka, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | ||
02 /
Ooe, Masayuki, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | |||
03 /
Nakano, Hajime, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | |||
04 /
Tsumaru, Yoshihiko, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | |||
05 /
Ueno, Takumi, Yamazaki R&D Center Hitachi Chemical DuPont Microsys. Ltd., 4-13-1 Higashi-cho, Hitachi, Ibaraki 317-8555 / JP | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastrasse 30 81925 München / DE | [N/P] |
Former [2004/01] | HOFFMANN - EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE | Application number, filing date | 03011014.2 | 16.05.2003 | [2004/01] | Priority number, date | JP20020143166 | 17.05.2002 Original published format: JP 2002143166 | JP20030069898 | 14.03.2003 Original published format: JP 2003069898 | [2004/01] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1376231 | Date: | 02.01.2004 | Language: | EN | [2004/01] | Type: | B1 Patent specification | No.: | EP1376231 | Date: | 01.04.2009 | Language: | EN | [2009/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.11.2003 | Classification | IPC: | G03F7/039, G03F7/023 | [2004/01] | CPC: |
G03F7/0233 (EP,US);
G03F7/027 (KR);
G03F7/0392 (EP,US);
H05K3/4676 (EP,US);
Y10S430/107 (EP,US);
Y10T428/24612 (EP,US)
| Designated contracting states | DE, FR [2004/39] |
Former [2004/01] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Fotoempfindliche Kunststoffzusammensetzung, Verfahren zur Herstellung von Reliefmustern, und elektronische Bauteile | [2004/01] | English: | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | [2004/01] | French: | Composition photosensible à base de polymère, procédé de fabrication d'images en relief et composants électroniques | [2004/01] | Examination procedure | 22.12.2003 | Examination requested [2004/10] | 13.04.2004 | Despatch of a communication from the examining division (Time limit: M04) | 03.07.2004 | Loss of particular rights, legal effect: designated state(s) | 10.08.2004 | Reply to a communication from the examining division | 25.10.2004 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR | 21.04.2008 | Communication of intention to grant the patent | 21.08.2008 | Fee for grant paid | 21.08.2008 | Fee for publishing/printing paid | Opposition(s) | 05.01.2010 | No opposition filed within time limit [2010/10] | Fees paid | Renewal fee | 25.05.2005 | Renewal fee patent year 03 | 22.05.2006 | Renewal fee patent year 04 | 23.05.2007 | Renewal fee patent year 05 | 26.05.2008 | Renewal fee patent year 06 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 09.08.2004 | AT   M01   Not yet paid | 09.08.2004 | BE   M01   Not yet paid | 09.08.2004 | BG   M01   Not yet paid | 09.08.2004 | CH   M01   Not yet paid | 09.08.2004 | CY   M01   Not yet paid | 09.08.2004 | CZ   M01   Not yet paid | 09.08.2004 | DK   M01   Not yet paid | 09.08.2004 | EE   M01   Not yet paid | 09.08.2004 | ES   M01   Not yet paid | 09.08.2004 | FI   M01   Not yet paid | 09.08.2004 | GB   M01   Not yet paid | 09.08.2004 | GR   M01   Not yet paid | 09.08.2004 | HU   M01   Not yet paid | 09.08.2004 | IE   M01   Not yet paid | 09.08.2004 | IT   M01   Not yet paid | 09.08.2004 | LU   M01   Not yet paid | 09.08.2004 | MC   M01   Not yet paid | 09.08.2004 | NL   M01   Not yet paid | 09.08.2004 | PT   M01   Not yet paid | 09.08.2004 | RO   M01   Not yet paid | 09.08.2004 | SE   M01   Not yet paid | 09.08.2004 | SI   M01   Not yet paid | 09.08.2004 | SK   M01   Not yet paid | 09.08.2004 | TR   M01   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US5442024 (KUNIMUNE KOUICHI [JP], et al) [A] 1-19 * the whole document *; | [X]US5516875 (SIMMONS III HOWARD E [US]) [X] 1-10,12-14,16-19 * the whole document *; | [A]EP0997777 (HITACHI CHEM DUPONT MICROSYS [JP]) [A] 1-19* the whole document *; | [X]US2002048719 (JUNG MYUNG-SUP [KR], et al) [X] 1-10,12-14,16-19 * the whole document * |