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Extract from the Register of European Patents

EP About this file: EP1376231

EP1376231 - Photosensitive polymer composition, method of forming relief patterns, and electronic equipment [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.02.2010
Database last updated on 29.10.2024
Most recent event   Tooltip05.02.2010No opposition filed within time limitpublished on 10.03.2010  [2010/10]
Applicant(s)For all designated states
Hitachi Chemical DuPont MicroSystems Ltd.
4-1, Koishikawa 1-chome Bunkyou-ku Tokyo
112-0002 / JP
[2008/35]
Former [2004/01]For all designated states
Hitachi Chemical DuPont MicroSystems Ltd.
10-13, Shibuya 3-chome
Shibuya-ku, Tokyo 150-0002 / JP
Inventor(s)01 / Nunomura, Masataka, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
02 / Ooe, Masayuki, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
03 / Nakano, Hajime, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
04 / Tsumaru, Yoshiko, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
05 / Ueno, Takumi, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
 [2004/15]
Former [2004/01]01 / Nunomura, Masataka, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
02 / Ooe, Masayuki, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
03 / Nakano, Hajime, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
04 / Tsumaru, Yoshihiko, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
05 / Ueno, Takumi, Yamazaki R&D Center
Hitachi Chemical DuPont Microsys. Ltd., 4-13-1
Higashi-cho, Hitachi, Ibaraki 317-8555 / JP
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastrasse 30
81925 München / DE
[N/P]
Former [2004/01]HOFFMANN - EITLE
Patent- und Rechtsanwälte Arabellastrasse 4
81925 München / DE
Application number, filing date03011014.216.05.2003
[2004/01]
Priority number, dateJP2002014316617.05.2002         Original published format: JP 2002143166
JP2003006989814.03.2003         Original published format: JP 2003069898
[2004/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1376231
Date:02.01.2004
Language:EN
[2004/01]
Type: B1 Patent specification 
No.:EP1376231
Date:01.04.2009
Language:EN
[2009/14]
Search report(s)(Supplementary) European search report - dispatched on:EP11.11.2003
ClassificationIPC:G03F7/039, G03F7/023
[2004/01]
CPC:
G03F7/0233 (EP,US); G03F7/027 (KR); G03F7/0392 (EP,US);
H05K3/4676 (EP,US); Y10S430/107 (EP,US); Y10T428/24612 (EP,US)
Designated contracting statesDE,   FR [2004/39]
Former [2004/01]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Fotoempfindliche Kunststoffzusammensetzung, Verfahren zur Herstellung von Reliefmustern, und elektronische Bauteile[2004/01]
English:Photosensitive polymer composition, method of forming relief patterns, and electronic equipment[2004/01]
French:Composition photosensible à base de polymère, procédé de fabrication d'images en relief et composants électroniques[2004/01]
Examination procedure22.12.2003Examination requested  [2004/10]
13.04.2004Despatch of a communication from the examining division (Time limit: M04)
03.07.2004Loss of particular rights, legal effect: designated state(s)
10.08.2004Reply to a communication from the examining division
25.10.2004Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR
21.04.2008Communication of intention to grant the patent
21.08.2008Fee for grant paid
21.08.2008Fee for publishing/printing paid
Opposition(s)05.01.2010No opposition filed within time limit [2010/10]
Fees paidRenewal fee
25.05.2005Renewal fee patent year 03
22.05.2006Renewal fee patent year 04
23.05.2007Renewal fee patent year 05
26.05.2008Renewal fee patent year 06
Penalty fee
Penalty fee Rule 85a EPC 1973
09.08.2004AT   M01   Not yet paid
09.08.2004BE   M01   Not yet paid
09.08.2004BG   M01   Not yet paid
09.08.2004CH   M01   Not yet paid
09.08.2004CY   M01   Not yet paid
09.08.2004CZ   M01   Not yet paid
09.08.2004DK   M01   Not yet paid
09.08.2004EE   M01   Not yet paid
09.08.2004ES   M01   Not yet paid
09.08.2004FI   M01   Not yet paid
09.08.2004GB   M01   Not yet paid
09.08.2004GR   M01   Not yet paid
09.08.2004HU   M01   Not yet paid
09.08.2004IE   M01   Not yet paid
09.08.2004IT   M01   Not yet paid
09.08.2004LU   M01   Not yet paid
09.08.2004MC   M01   Not yet paid
09.08.2004NL   M01   Not yet paid
09.08.2004PT   M01   Not yet paid
09.08.2004RO   M01   Not yet paid
09.08.2004SE   M01   Not yet paid
09.08.2004SI   M01   Not yet paid
09.08.2004SK   M01   Not yet paid
09.08.2004TR   M01   Not yet paid
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Documents cited:Search[A]US5442024  (KUNIMUNE KOUICHI [JP], et al) [A] 1-19 * the whole document *;
 [X]US5516875  (SIMMONS III HOWARD E [US]) [X] 1-10,12-14,16-19 * the whole document *;
 [A]EP0997777  (HITACHI CHEM DUPONT MICROSYS [JP]) [A] 1-19* the whole document *;
 [X]US2002048719  (JUNG MYUNG-SUP [KR], et al) [X] 1-10,12-14,16-19 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.