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Extract from the Register of European Patents

EP About this file: EP1408548

EP1408548 - Method of manufacturing an electronic component with a lead frame [Right-click to bookmark this link]
Former [2004/16]Electronic component with a lead frame
[2010/34]
StatusNo opposition filed within time limit
Status updated on  11.11.2011
Database last updated on 12.07.2024
Most recent event   Tooltip16.12.2011Lapse of the patent in a contracting state
New state(s): IT		published on 18.01.2012  [2012/03]
Applicant(s)For all designated states
Micronas GmbH
Hans-Bunte-Strasse 19
79108 Freiburg i. Br. / DE
[2011/01]
Former [2004/16]For all designated states
Micronas GmbH
Hans-Bunte-Strasse 19
79108 Freiburg / DE
Inventor(s)01 / Hauser, Wolfgang
Salzgartenstrasse 13
79346 Endingen / DE
02 / Joos, Christian
Erlenweg 2a
79238 Ehrenkirchen / DE
03 / Heitzler, Viktor
Schlossweg 4
79224 Umkrich / DE
 [2004/16]
Representative(s)Koch, Bertram
Koch Müller Patentanwaltsgesellschaft mbH Maassstrasse 32/1
69123 Heidelberg / DE
[2010/33]
Former [2009/30]Göhring, Robert
Westphal - Mussgnug & Partner Patentanwälte Am Riettor 5
78048 Villingen-Schwenningen / DE
Former [2004/16]Göhring, Robert, Dipl.-Ing.
Patentanwälte Westphal, Mussgnug Am Riettor 5
78048 Villingen-Schwenningen / DE
Application number, filing date03022722.709.10.2003
[2004/16]
Priority number, dateDE200214761011.10.2002         Original published format: DE 10247610
[2004/16]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1408548
Date:14.04.2004
Language:DE
[2004/16]
Type: A3 Search report 
No.:EP1408548
Date:29.09.2004
[2004/40]
Type: B1 Patent specification 
No.:EP1408548
Date:05.01.2011
Language:DE
[2011/01]
Search report(s)(Supplementary) European search report - dispatched on:EP18.08.2004
ClassificationIPC:H01L23/495, H01L21/56
[2004/40]
CPC:
H01L21/565 (EP); H01L23/49562 (EP); H01L24/49 (EP);
H01L2224/48091 (EP); H01L2224/48247 (EP); H01L2224/48257 (EP);
H01L2224/49 (EP); H01L24/48 (EP); H01L2924/00014 (EP);
H01L2924/0103 (EP); H01L2924/0105 (EP); H01L2924/01068 (EP);
H01L2924/01082 (EP); H01L2924/181 (EP); H01L2924/1815 (EP) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP);
H01L2924/00014, H01L2224/05599 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/181, H01L2924/00012 (EP)
Former IPC [2004/16]H01L23/495
Designated contracting statesDE,   FR,   GB,   IT,   NL [2005/24]
Former [2004/16]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Verfahren zur Herstellung eines elektronischen Bauelements mit einem Systemträger[2010/34]
English:Method of manufacturing an electronic component with a lead frame[2010/34]
French:Procédé pour la fabrication d'un composant électronique avec grille de connexion[2010/34]
Former [2004/16]Elektronisches Bauelement mit einem Systemträger
Former [2004/16]Electronic component with a lead frame
Former [2004/16]Composant électronique avec grille de connexion
Examination procedure12.03.2005Examination requested  [2005/19]
30.03.2005Loss of particular rights, legal effect: designated state(s)
18.07.2005Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, LU, MC, PT, RO, SE, SI, SK, TR
21.04.2006Despatch of a communication from the examining division (Time limit: M04)
16.08.2006Reply to a communication from the examining division
02.02.2007Despatch of a communication from the examining division (Time limit: M06)
13.08.2007Reply to a communication from the examining division
01.04.2008Despatch of a communication from the examining division (Time limit: M06)
10.10.2008Reply to a communication from the examining division
21.07.2010Cancellation of oral proceeding that was planned for 23.07.2010
23.07.2010Date of oral proceedings (cancelled)
30.09.2010Communication of intention to grant the patent
18.11.2010Fee for grant paid
18.11.2010Fee for publishing/printing paid
Opposition(s)06.10.2011No opposition filed within time limit [2011/50]
Fees paidRenewal fee
27.10.2005Renewal fee patent year 03
27.10.2006Renewal fee patent year 04
29.10.2007Renewal fee patent year 05
14.10.2008Renewal fee patent year 06
27.10.2009Renewal fee patent year 07
25.10.2010Renewal fee patent year 08
Penalty fee
Penalty fee Rule 85a EPC 1973
03.05.2005AT   M01   Not yet paid
03.05.2005BE   M01   Not yet paid
03.05.2005BG   M01   Not yet paid
03.05.2005CH   M01   Not yet paid
03.05.2005CY   M01   Not yet paid
03.05.2005CZ   M01   Not yet paid
03.05.2005DK   M01   Not yet paid
03.05.2005EE   M01   Not yet paid
03.05.2005ES   M01   Not yet paid
03.05.2005FI   M01   Not yet paid
03.05.2005GR   M01   Not yet paid
03.05.2005HU   M01   Not yet paid
03.05.2005IE   M01   Not yet paid
03.05.2005LU   M01   Not yet paid
03.05.2005MC   M01   Not yet paid
03.05.2005PT   M01   Not yet paid
03.05.2005RO   M01   Not yet paid
03.05.2005SE   M01   Not yet paid
03.05.2005SI   M01   Not yet paid
03.05.2005SK   M01   Not yet paid
03.05.2005TR   M01   Not yet paid
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT05.01.2011
NL05.01.2011
[2012/03]
Former [2011/42]NL05.01.2011
Documents cited:Search[X]JPH01158756  ;
 [X]JPS61140157  ;
 [A]JPS58154252  ;
 [A]JP2002040058  ;
 [A]US4451973  (TATENO KENICHI [JP], et al) [A] 1,12 * the whole document *;
 [A]US5427938  (MATSUMURA TSUNEO [JP], et al) [A] 1,12 * the whole document *;
 [X]US6255722  (EWER PETER R [GB], et al) [X] 1,6-12 * column 3, line 18 - column 4, line 63; figure 4 *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19890925), vol. 013, no. 429, Database accession no. (E - 823), & JP01158756 A 19890621 (SANKEN ELECTRIC CO LTD) [X] 1-4,6-12 * abstract *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19861114), vol. 010, no. 337, Database accession no. (E - 454), & JP61140157 A 19860627 (NEC CORP) [X] 1,2,4-12 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19831203), vol. 007, no. 272, Database accession no. (E - 214), & JP58154252 A 19830913 (HITACHI SEISAKUSHO KK) [A] 11 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20020604), vol. 2002, no. 06, & JP2002040058 A 20020206 (SANKEN ELECTRIC CO LTD) [A] 1-12 * abstract *
by applicantUS6255722
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.