-
EP1418798
European procedure
Extract from the Register of European Patents
EP About this file: EP1418798
| EP1418798 - Printed circuit board and method for installing printed circuit board onto electro-conductive housing [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 18.04.2008 Database last updated on 09.05.2025 | Most recent event Tooltip | 18.04.2008 | No opposition filed within time limit | published on 21.05.2008 [2008/21] | Applicant(s) | For all designated states KONICA MINOLTA HOLDINGS, INC. 6-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100-0005 / JP | [N/P] |
| Former [2004/20] | For all designated states KONICA MINOLTA HOLDINGS, INC. 6-1, Marunouchi 1-chome, Chiyoda-ku Tokyo 100-0005 / JP | Inventor(s) | 01 /
Kishimoto, Tadao Konica Minolta Bus. Tech. Inc. 2970 Ishikawa-machi Hachioji-shi Tokyo, 192-8505 / JP | 02 /
Igarashi, Yutaka Konica Minolta Bus. Tech. Inc. 2970 Ishikawa-machi Hachioji-shi Tokyo, 192-8505 / JP | 03 /
Hirayama, Hironobu Konica Minolta Bus. Tech. Inc. 2970 Ishikawa-machi Hachioji-shi Tokyo, 192-8505 / JP | [2004/20] | Representative(s) | Henkel & Partner mbB Patentanwaltskanzlei, Rechtsanwaltskanzlei Maximiliansplatz 21 80333 München / DE | [N/P] |
| Former [2004/20] | Henkel, Feiler & Hänzel Möhlstrasse 37 81675 München / DE | Application number, filing date | 03024969.2 | 29.10.2003 | [2004/20] | Priority number, date | JP20020322327 | 06.11.2002 Original published format: JP 2002322327 | [2004/20] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1418798 | Date: | 12.05.2004 | Language: | EN | [2004/20] | Type: | A3 Search report | No.: | EP1418798 | Date: | 29.06.2005 | [2005/26] | Type: | B1 Patent specification | No.: | EP1418798 | Date: | 13.06.2007 | Language: | EN | [2007/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.05.2005 | Classification | IPC: | H05K7/04 | [2004/20] | CPC: |
H05K1/0234 (EP,US);
H05K1/0215 (EP,US);
H05K1/0218 (EP,US);
H05K7/142 (EP,US);
H05K9/0039 (EP,US);
H05K1/0231 (EP,US);
H05K1/116 (EP,US);
H05K2201/09354 (EP,US);
H05K2201/09618 (EP,US);
H05K2201/10022 (EP,US);
H05K2201/10409 (EP,US);
H05K2201/10446 (EP,US);
| Designated contracting states | DE, FR, GB [2006/12] |
| Former [2004/20] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Leiterplatte und Methode um eine Leiterplatte an einem elektrisch leitenden Gehäuse anzubringen | [2004/20] | English: | Printed circuit board and method for installing printed circuit board onto electro-conductive housing | [2004/20] | French: | Circuit imprimé et méthode pour installer un circuit imprimé dans un boîtier electriquement conducteur | [2004/20] | Examination procedure | 29.12.2005 | Examination requested [2006/09] | 02.05.2006 | Despatch of a communication from the examining division (Time limit: M04) | 11.09.2006 | Reply to a communication from the examining division | 24.11.2006 | Communication of intention to grant the patent | 26.03.2007 | Fee for grant paid | 26.03.2007 | Fee for publishing/printing paid | Opposition(s) | 14.03.2008 | No opposition filed within time limit [2008/21] | Fees paid | Renewal fee | 12.10.2005 | Renewal fee patent year 03 | 12.10.2006 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP0429037 (ALCATEL RADIOTELEPHONE [FR]) [Y] 1,3-6,8,10,11 * column 2, line 28 - line 53; figures 2,3 *; | [A]US5355105 (ANGELUCCI SR THOMAS L [US]) [A] 1-12* column 3, line 62 - column 6, line 46; figure 3 *; | [Y]US5376759 (MARX DIETER O [CA], et al) [Y] 1,3-6,8,10,11 * column 7, line 39 - column 8, line 62; figures 3,4 *; | [A]US5500789 (MILLER KEVIN L [US], et al) [A] 9 * column 4, line 57 - column 5, line 42; figure 6 * |