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EP1353366
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EP About this file: EP1353366
| EP1353366 - Non-invasive electrical measurement of semiconductor wafers [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 25.02.2011 Database last updated on 02.08.2024 | Most recent event Tooltip | 25.02.2011 | Application deemed to be withdrawn | published on 30.03.2011 [2011/13] | Applicant(s) | For all designated states Solid State Measurements, Inc. 2535 Secretariat Drive Wexford Pennsylvania 15090 / US | [N/P] |
| Former [2003/42] | For all designated states Solid State Measurements, Inc. 2535 Secretariat Drive Wexford, Pennsylvania 15090 / US | Inventor(s) | 01 /
Howland, William H. 2535 Secretariat Drive Wexford, Pennsylvania 15090 / US | [2003/42] | Representative(s) | Jorritsma, Ruurd, et al Nederlandsch Octrooibureau P.O. Box 29720 2502 LS The Hague / NL | [N/P] |
| Former [2003/42] | Jorritsma, Ruurd, et al Nederlandsch Octrooibureau Scheveningseweg 82 P.O. Box 29720 2502 LS Den Haag / NL | Application number, filing date | 03076093.8 | 11.04.2003 | [2003/42] | Priority number, date | US20020120661 | 11.04.2002 Original published format: US 120661 | [2003/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1353366 | Date: | 15.10.2003 | Language: | EN | [2003/42] | Type: | A3 Search report | No.: | EP1353366 | Date: | 24.03.2010 | [2010/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.02.2010 | Classification | IPC: | H01L21/66 | [2003/42] | CPC: |
H01L22/14 (EP,US);
G01R31/2886 (EP,US);
G01R31/312 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR [2003/42] | Title | German: | Nichtinvasive, elektrische Messung an Halbleiterscheiben | [2003/42] | English: | Non-invasive electrical measurement of semiconductor wafers | [2003/42] | French: | Mesure electrique non-invasiv sur des tranches semi-conductrices | [2003/42] | Examination procedure | 19.03.2004 | Examination requested [2004/21] | 25.09.2010 | Application deemed to be withdrawn, date of legal effect [2011/13] | 11.11.2010 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2011/13] | Fees paid | Renewal fee | 13.04.2005 | Renewal fee patent year 03 | 17.03.2006 | Renewal fee patent year 04 | 12.04.2007 | Renewal fee patent year 05 | 28.03.2008 | Renewal fee patent year 06 | 25.08.2009 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 30.04.2009 | 07 M06 Fee paid on 25.08.2009 | 30.04.2010 | 08 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAY]US5266895 (YAMASHITA SATORU [JP]) [X] 1-3 * column 2, line 22 - line 26; figures 3,4,5A,6,7 * [A] 12-13 [Y] 4-11,14; | [YA]JPH10223704 (TOKYO ELECTRON LTD) [Y] 9-11,14 * figures 1,2,4,5 *[A] 12-13; | [IAY]WO0129568 (SOLID STATE MEASUREMENTS INC [US], et al) [I] 1-2,9-11,15 * page 10, line 28 - line 32; figures 1-4 * [A] 12-13 [Y] 6-8; | [XYI]US2002024351 (ERIGUCHI KOJI [JP], et al) [X] 1-2,9 * paragraphs [0198] - [0200]; figures 4,5,13,23,28 * [Y] 4-5,7-8 [I] 15-17; | [X] - HILLARD ROBERT J ET AL, "Product wafer monitoring of ultrashallow channel implants with an elastic metal gate", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART B, AVS / AIP, MELVILLE, NEW YORK, NY, US, (200201), vol. 20, no. 1, ISSN 1071-1023, pages 488 - 491, XP012009239 [X] 15 * figures 1c,2 * DOI: http://dx.doi.org/10.1116/1.1424284 |