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Extract from the Register of European Patents

EP About this file: EP1351285

EP1351285 - Electrical device comprising two substrates bonded together and method of making same [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  08.02.2008
Database last updated on 31.08.2024
Most recent event   Tooltip13.11.2009Change - representativepublished on 16.12.2009  [2009/51]
Applicant(s)For all designated states
Hewlett-Packard Company
3000 Hanover Street
Palo Alto, CA 94304-1112 / US
[N/P]
Former [2008/38]For all designated states
Hewlett-Packard Company
3000 Hanover Street
Palo Alto CA 94304-1112 / US
Former [2003/41]For all designated states
Hewlett-Packard Company
3000 Hanover Street
Palo Alto, CA 94304 / US
Inventor(s)01 / Liebeskind, John
4775 NW Elmwood Drive
Corvallis, OR 97330 / US
02 / McKinnell, James C.
2512 Daisy Lane NW
Salem, OR 97304 / US
03 / Benning, Paul J.
4736 NW Jeanice Place
Corvallis, OR 97330 / US
04 / Chen, Chien-Hua
2214 NW Dixon Street
Corvallis, OR 97330 / US
 [2003/41]
Representative(s)Jackson, Richard Eric, et al
Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[N/P]
Former [2009/51]Jackson, Richard Eric, et al
Carpmaels & Ransford 43-45 Bloomsbury Square
London WC1A 2RA / GB
Former [2003/41]Jackson, Richard Eric, et al
Carpmaels & Ransford, 43 Bloomsbury Square
London WC1A 2RA / GB
Application number, filing date03251979.528.03.2003
[2003/41]
Priority number, dateUS2002011439201.04.2002         Original published format: US 114392
[2003/41]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1351285
Date:08.10.2003
Language:EN
[2003/41]
Type: A3 Search report 
No.:EP1351285
Date:27.12.2006
[2006/52]
Search report(s)(Supplementary) European search report - dispatched on:EP23.11.2006
ClassificationIPC:H01L21/60, B81B7/00
[2006/52]
CPC:
H01L25/50 (EP,US); B81B7/0006 (EP,US); H01L21/50 (EP,US);
H01L23/10 (EP,US); H01L24/81 (EP,US); H01L25/0657 (EP,US);
H01L2224/05001 (EP,US); H01L2224/05023 (EP,US); H01L2224/05568 (EP,US);
H01L2224/16105 (EP,US); H01L2224/81191 (EP,US); H01L2224/81801 (EP,US);
H01L2225/06513 (EP,US); H01L2225/06565 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01032 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01073 (EP,US); H01L2924/01079 (EP,US); H01L2924/01322 (EP,US);
H01L2924/01327 (EP,US); H01L2924/014 (EP,US); H01L2924/14 (EP,US) (-)
C-Set:
H01L2224/05541, H01L2224/05005 (EP,US)
Former IPC [2003/41]H01L21/60
Designated contracting states(deleted) [2007/36]
Former [2003/41]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Elektrisches Bauelement, das aus zwei miteinander gebondeten Substraten besteht, und Verfahren zur dessen Herstellung[2003/41]
English:Electrical device comprising two substrates bonded together and method of making same[2003/41]
French:Appareil électrique comprenant deux substrates liés et procédé pour sa fabrication[2003/41]
Examination procedure28.06.2007Application deemed to be withdrawn, date of legal effect  [2008/11]
09.10.2007Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2008/11]
Fees paidRenewal fee
22.03.2005Renewal fee patent year 03
29.03.2006Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
31.03.200705   M06   Not yet paid
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Documents cited:Search[XA]US3657610  (YAMAMOTO HIROHIKO, et al) [X] 1,8-10 * the whole document * [A] 6,7;
 [XA]JP2000077970  (MURATA MANUFACTURING CO) [X] 1,8-10 [A] 6,7;
 [XA]US2002000646  (GOOCH ROLAND W [US], et al) [X] 1,8-10 * paragraph [0033]; figure 4 *[A] 6,7
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.