EP1351285 - Electrical device comprising two substrates bonded together and method of making same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 08.02.2008 Database last updated on 31.08.2024 | Most recent event Tooltip | 13.11.2009 | Change - representative | published on 16.12.2009 [2009/51] | Applicant(s) | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, CA 94304-1112 / US | [N/P] |
Former [2008/38] | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto CA 94304-1112 / US | ||
Former [2003/41] | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, CA 94304 / US | Inventor(s) | 01 /
Liebeskind, John 4775 NW Elmwood Drive Corvallis, OR 97330 / US | 02 /
McKinnell, James C. 2512 Daisy Lane NW Salem, OR 97304 / US | 03 /
Benning, Paul J. 4736 NW Jeanice Place Corvallis, OR 97330 / US | 04 /
Chen, Chien-Hua 2214 NW Dixon Street Corvallis, OR 97330 / US | [2003/41] | Representative(s) | Jackson, Richard Eric, et al Carpmaels & Ransford LLP One Southampton Row London WC1B 5HA / GB | [N/P] |
Former [2009/51] | Jackson, Richard Eric, et al Carpmaels & Ransford 43-45 Bloomsbury Square London WC1A 2RA / GB | ||
Former [2003/41] | Jackson, Richard Eric, et al Carpmaels & Ransford, 43 Bloomsbury Square London WC1A 2RA / GB | Application number, filing date | 03251979.5 | 28.03.2003 | [2003/41] | Priority number, date | US20020114392 | 01.04.2002 Original published format: US 114392 | [2003/41] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1351285 | Date: | 08.10.2003 | Language: | EN | [2003/41] | Type: | A3 Search report | No.: | EP1351285 | Date: | 27.12.2006 | [2006/52] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.11.2006 | Classification | IPC: | H01L21/60, B81B7/00 | [2006/52] | CPC: |
H01L25/50 (EP,US);
B81B7/0006 (EP,US);
H01L21/50 (EP,US);
H01L23/10 (EP,US);
H01L24/81 (EP,US);
H01L25/0657 (EP,US);
H01L2224/05001 (EP,US);
H01L2224/05023 (EP,US);
H01L2224/05568 (EP,US);
H01L2224/16105 (EP,US);
H01L2224/81191 (EP,US);
H01L2224/81801 (EP,US);
H01L2225/06513 (EP,US);
H01L2225/06565 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01032 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01073 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01322 (EP,US);
| C-Set: |
H01L2224/05541, H01L2224/05005 (EP,US)
|
Former IPC [2003/41] | H01L21/60 | Designated contracting states | (deleted) [2007/36] |
Former [2003/41] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Elektrisches Bauelement, das aus zwei miteinander gebondeten Substraten besteht, und Verfahren zur dessen Herstellung | [2003/41] | English: | Electrical device comprising two substrates bonded together and method of making same | [2003/41] | French: | Appareil électrique comprenant deux substrates liés et procédé pour sa fabrication | [2003/41] | Examination procedure | 28.06.2007 | Application deemed to be withdrawn, date of legal effect [2008/11] | 09.10.2007 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2008/11] | Fees paid | Renewal fee | 22.03.2005 | Renewal fee patent year 03 | 29.03.2006 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 31.03.2007 | 05   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]US3657610 (YAMAMOTO HIROHIKO, et al) [X] 1,8-10 * the whole document * [A] 6,7; | [XA]JP2000077970 (MURATA MANUFACTURING CO) [X] 1,8-10 [A] 6,7; | [XA]US2002000646 (GOOCH ROLAND W [US], et al) [X] 1,8-10 * paragraph [0033]; figure 4 *[A] 6,7 |