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EP1408365
European procedure
Extract from the Register of European Patents
EP About this file: EP1408365
| EP1408365 - Circuit board and method of manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.12.2009 Database last updated on 19.07.2024 | Most recent event Tooltip | 25.12.2009 | No opposition filed within time limit | published on 27.01.2010 [2010/04] | Applicant(s) | For all designated states Seiko Epson Corporation 4-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP | [N/P] |
| Former [2009/08] | For all designated states Seiko Epson Corporation 4-1, Nishi-shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP | ||
| Former [2004/16] | For all designated states SEIKO EPSON CORPORATION 4-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 163-0811 / JP | Inventor(s) | 01 /
Kimura, Mutsumi c/o Seiko Epson Corporation, 3-5 Owa 3-chome Suwa-shi, Nagano-ken 392-8502 / JP | [2004/16] | Representative(s) | Kenyon, Sarah Elizabeth, et al Miller Sturt Kenyon 9 John Street London WC1N 2ES / GB | [N/P] |
| Former [2004/16] | Kenyon, Sarah Elizabeth, et al Miller Sturt Kenyon 9 John Street London WC1N 2ES / GB | Application number, filing date | 03256317.3 | 07.10.2003 | [2004/16] | Priority number, date | JP20020295134 | 08.10.2002 Original published format: JP 2002295134 | [2004/16] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1408365 | Date: | 14.04.2004 | Language: | EN | [2004/16] | Type: | A3 Search report | No.: | EP1408365 | Date: | 02.02.2005 | [2005/05] | Type: | B1 Patent specification | No.: | EP1408365 | Date: | 18.02.2009 | Language: | EN | [2009/08] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.12.2004 | Classification | IPC: | G02F1/1368, H01L25/04 | [2004/16] | CPC: |
H01L21/6835 (EP,US);
H05B33/10 (KR);
H01L21/6836 (EP,US);
H01L23/13 (EP,US);
H01L23/49816 (EP,US);
H01L24/10 (EP,US);
H01L24/29 (EP,US);
H01L24/81 (EP,US);
H01L24/83 (EP,US);
H10K59/131 (EP,KR,US);
G02F1/136281 (EP,US);
H01L2221/68322 (EP,US);
H01L2221/68327 (EP,US);
H01L2221/68354 (EP,US);
H01L2221/68363 (EP,US);
H01L2224/05568 (EP,US);
H01L2224/05573 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/2919 (EP,US);
H01L2224/2929 (EP,US);
H01L2224/29299 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/81001 (EP,US);
H01L2224/8319 (EP,US);
H01L2224/83851 (EP,US);
H01L2924/00013 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01022 (EP,US);
H01L2924/01025 (EP,US);
H01L2924/01027 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01039 (EP,US);
H01L2924/0104 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01057 (EP,US);
H01L2924/01058 (EP,US);
H01L2924/01059 (EP,US);
H01L2924/0106 (EP,US);
H01L2924/01064 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/04941 (EP,US);
H01L2924/0665 (EP,US);
H01L2924/0781 (EP,US);
H01L2924/12041 (EP,US);
H01L2924/12042 (EP,US);
H01L2924/12044 (EP,US);
H05K3/20 (EP,US);
H05K3/4614 (EP,US);
H10K59/12 (US);
Y10T29/49117 (EP,US);
Y10T29/49126 (EP,US);
Y10T29/49128 (EP,US);
| C-Set: |
H01L2224/29299, H01L2924/00014 (US,EP);
H01L2224/2929, H01L2924/00014 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/00013, H01L2224/29099 (EP,US);
H01L2924/00013, H01L2224/29199 (EP,US);
H01L2924/00013, H01L2224/2929 (EP,US);
H01L2924/00013, H01L2224/29299 (EP,US);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/13099 (US,EP);
H01L2924/0665, H01L2924/00 (US,EP); | Designated contracting states | DE, FR, GB [2005/42] |
| Former [2004/16] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Leiterplatte und ihr Herstellungsverfahren | [2004/16] | English: | Circuit board and method of manufacturing the same | [2004/16] | French: | Panneau à circuit et sa méthode de fabrication | [2004/16] | Examination procedure | 24.06.2005 | Examination requested [2005/34] | 09.09.2005 | Despatch of a communication from the examining division (Time limit: M04) | 09.01.2006 | Reply to a communication from the examining division | 12.09.2006 | Despatch of a communication from the examining division (Time limit: M04) | 12.01.2007 | Reply to a communication from the examining division | 30.07.2008 | Date of oral proceedings | 13.08.2008 | Minutes of oral proceedings despatched | 28.08.2008 | Communication of intention to grant the patent | 22.12.2008 | Fee for grant paid | 22.12.2008 | Fee for publishing/printing paid | Opposition(s) | 19.11.2009 | No opposition filed within time limit [2010/04] | Fees paid | Renewal fee | 13.10.2005 | Renewal fee patent year 03 | 10.10.2006 | Renewal fee patent year 04 | 23.10.2007 | Renewal fee patent year 05 | 18.03.2008 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US4808983 (BENJAMIN JOHN D [GB], et al) [X] 1-14 * column 4, line 65 - column 6, line 27; figures 4,5,7,8 * * column 8, line 25 - column 8, line 54; figures 14-27 * * column 11, line 37 - line 59 *; | [X]DE4032397 (BOSCH GMBH ROBERT [DE]) [X] 1-14 * column 2, line 46 - column 3, line 20 * * column 3, line 34 - line 48 * * column 4, line 20 - line 42 * * figure 2 *; | [PX]US2003094619 (AKIYAMA MASAHIKO [JP]) [PX] 1-14 * paragraph [0096] - paragraph [0099]; figures 2-4 * * paragraph [0106] - paragraph [0113]; figures 6-10 ** paragraph [0120] - paragraph [0121]; figure 16 * | Examination | JPH10125931 |