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Extract from the Register of European Patents

EP About this file: EP1518275

EP1518275 - METHOD FOR PRODUCING A COMPONENT COMPRISING A CONDUCTOR STRUCTURE THAT IS SUITABLE FOR USE AT HIGH FREQUENCIES AND CORRESPONDING COMPONENT [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  11.03.2016
Database last updated on 16.07.2024
Most recent event   Tooltip08.12.2017Lapse of the patent in a contracting state
New state(s): LU		published on 10.01.2018  [2018/02]
Applicant(s)For all designated states
Schott AG
Hattenbergstrasse 10
55122 Mainz / DE
[2015/19]
Former [2005/13]For all designated states
SCHOTT AG
Hattenbergstrasse 10
55122 Mainz / DE
Inventor(s)01 / LEIB, Jürgen
Philipp-Dirr-Strasse 14
85345 Freising / DE
02 / MUND, Dietrich
Buchenstrasse 9
84101 Obersüssbach / DE
 [2005/13]
Representative(s)Herden, Andreas F.
Blumbach - Zinngrebe
Patentanwälte PartG mbB
Alexandrastraße 5
65187 Wiesbaden / DE
[N/P]
Former [2015/19]Herden, Andreas F.
Blumbach - Zinngrebe PatentConsult Patentanwälte Alexandrastrasse 5
65187 Wiesbaden / DE
Former [2005/13]Herden, Andreas, Dipl.-Ing.
Blumbach - Zinngrebe Patentanwälte Alexandrastrasse 5
65187 Wiesbaden / DE
Application number, filing date03735449.523.05.2003
[2005/13]
WO2003EP05415
Priority number, dateDE2002102260923.05.2002         Original published format: DE 10222609
WO2003EP0390715.04.2003         Original published format: PCT/EP0303/907
[2005/13]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report
No.:WO03100859
Date:04.12.2003
Language:DE
[2003/49]
Type: A2 Application without search report 
No.:EP1518275
Date:30.03.2005
Language:DE
The application published by WIPO in one of the EPO official languages on 04.12.2003 takes the place of the publication of the European patent application.
[2005/13]
Type: B1 Patent specification 
No.:EP1518275
Date:06.05.2015
Language:DE
[2015/19]
Search report(s)International search report - published on:EP20.01.2005
ClassificationIPC:H01L23/66, H01L21/768
[2015/01]
CPC:
C03B19/00 (EP,US); C03C14/006 (EP,US); C03C15/00 (EP,US);
C03C17/02 (EP,US); C03C17/34 (EP,US); C03C3/083 (EP,US);
C03C3/089 (EP,US); C03C4/12 (EP,US); C23C14/10 (EP,US);
H01L21/02129 (EP,US); H01L21/02145 (EP,US); H01L21/02161 (EP,US);
H01L21/02263 (EP,US); H01L21/31616 (US); H01L21/31625 (US);
H01L21/50 (EP,US); H01L21/56 (EP,US); H01L21/76801 (US);
H01L21/76802 (US); H01L21/76885 (US); H01L23/10 (EP,US);
H01L23/291 (EP,US); H01L23/3114 (EP,US); H01L23/481 (EP,US);
H01L23/5329 (EP); H01L23/66 (EP,US); H01L24/97 (EP,US);
H01P11/003 (EP,US); H01P3/003 (EP,US); H05K3/467 (EP,US);
H10K50/84 (US); C03C2214/16 (EP,US); C03C2217/21 (EP,US);
C03C2217/77 (EP,US); C03C2218/15 (EP,US); C03C2218/32 (EP,US);
C03C2218/328 (EP,US); C03C2218/33 (EP,US); C03C2218/355 (EP,US);
H01L2223/6627 (EP,US); H01L2224/97 (EP,US); H01L23/49894 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/0101 (EP,US);
H01L2924/01011 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US);
H01L2924/01019 (EP,US); H01L2924/01027 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01038 (EP,US); H01L2924/01047 (EP,US); H01L2924/01058 (EP,US);
H01L2924/0106 (EP,US); H01L2924/01061 (EP,US); H01L2924/01068 (EP,US);
H01L2924/01072 (EP,US); H01L2924/01078 (EP,US); H01L2924/01082 (EP,US);
H01L2924/04953 (EP,US); H01L2924/09701 (EP,US); H01L2924/10329 (EP,US);
H01L2924/12041 (EP,US); H01L2924/12044 (EP,US); H01L2924/14 (EP,US);
H01L2924/15311 (EP,US); H01L2924/1903 (EP,US); H01L2924/19033 (EP,US);
H01L2924/19041 (EP,US); H01L2924/19042 (EP,US); H01L2924/19043 (EP,US);
H01L2924/351 (EP,US); H05K2201/0179 (EP,US); H05K3/28 (EP,US);
H10K50/805 (US); H10K50/85 (US); Y02P40/57 (EP,US) (-)
C-Set:
H01L2224/97, H01L2924/15311 (EP,US);
H01L2924/14, H01L2924/00 (US,EP);
H01L2924/351, H01L2924/00 (US,EP)
Former IPC [2005/13]H01L23/66
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   RO,   SE,   SI,   SK,   TR [2015/19]
Former [2005/13]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES BAUELEMENTS MIT HOCHFREQUENZTAUGLICHER LEITERANORNDNUNG UND ENTSPRECHENDES BAUELEMENT[2005/13]
English:METHOD FOR PRODUCING A COMPONENT COMPRISING A CONDUCTOR STRUCTURE THAT IS SUITABLE FOR USE AT HIGH FREQUENCIES AND CORRESPONDING COMPONENT[2005/13]
French:PROCEDE DE PRODUCTION D'UN DISPOSITIF COMPRENANT UN ENSEMBLE DE CONDUCTEURS ADAPTES AUX HAUTES FREQUENCES ET DISPOSITIF CORRESPONDANT[2005/13]
Entry into regional phase03.11.2004National basic fee paid 
03.11.2004Designation fee(s) paid 
03.11.2004Examination fee paid 
Examination procedure08.10.2003Request for preliminary examination filed
International Preliminary Examining Authority: EP
03.11.2004Examination requested  [2005/13]
16.01.2006Despatch of a communication from the examining division (Time limit: M04)
16.05.2006Reply to a communication from the examining division
11.09.2008Despatch of a communication from the examining division (Time limit: M04)
11.09.2008Invitation to provide information on prior art
06.11.2008Reply to the invitation to provide information on prior art
06.01.2009Reply to a communication from the examining division
28.09.2010Despatch of a communication from the examining division (Time limit: M06)
08.03.2011Reply to a communication from the examining division
16.08.2012Despatch of a communication from the examining division (Time limit: M04)
07.12.2012Reply to a communication from the examining division
19.11.2014Cancellation of oral proceeding that was planned for 21.11.2014
21.11.2014Date of oral proceedings (cancelled)
23.12.2014Communication of intention to grant the patent
25.03.2015Fee for grant paid
25.03.2015Fee for publishing/printing paid
25.03.2015Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  16.01.2006
Opposition(s)09.02.2016No opposition filed within time limit [2016/15]
Fees paidRenewal fee
13.05.2005Renewal fee patent year 03
12.05.2006Renewal fee patent year 04
14.05.2007Renewal fee patent year 05
13.05.2008Renewal fee patent year 06
25.05.2009Renewal fee patent year 07
28.05.2010Renewal fee patent year 08
24.05.2011Renewal fee patent year 09
22.05.2012Renewal fee patent year 10
27.05.2013Renewal fee patent year 11
27.03.2014Renewal fee patent year 12
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU23.05.2003
CY06.05.2015
CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
NL06.05.2015
RO06.05.2015
SE06.05.2015
SI06.05.2015
SK06.05.2015
TR06.05.2015
AT23.05.2015
IE23.05.2015
LU23.05.2015
BE31.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GB06.08.2015
GR07.08.2015
PT07.09.2015
[2018/02]
Former [2017/40]HU23.05.2003
CY06.05.2015
CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
NL06.05.2015
RO06.05.2015
SE06.05.2015
SI06.05.2015
SK06.05.2015
TR06.05.2015
AT23.05.2015
IE23.05.2015
BE31.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GB06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/36]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
RO06.05.2015
SI06.05.2015
SK06.05.2015
AT23.05.2015
IE23.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GB06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/34]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
RO06.05.2015
SI06.05.2015
SK06.05.2015
IE23.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GB06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/24]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
RO06.05.2015
SI06.05.2015
SK06.05.2015
IE23.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/20]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
RO06.05.2015
SK06.05.2015
IE23.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/13]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
MC06.05.2015
RO06.05.2015
SK06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/10]CZ06.05.2015
DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
RO06.05.2015
SK06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/09]DK06.05.2015
EE06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/08]DK06.05.2015
ES06.05.2015
FI06.05.2015
IT06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/07]DK06.05.2015
ES06.05.2015
FI06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2016/06]ES06.05.2015
FI06.05.2015
CH31.05.2015
LI31.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2015/50]ES06.05.2015
FI06.05.2015
BG06.08.2015
GR07.08.2015
PT07.09.2015
Former [2015/49]ES06.05.2015
FI06.05.2015
GR07.08.2015
PT07.09.2015
Cited inInternational search[Y]US4564997  (MATSUO SEITARO [JP], et al) [Y] 1-23,28,33 * column 5, line 55 - column 9, line 10; figures 6,7 * * column 18, line 28 - line 53 * * column 2, line 40 - line 43 *;
 [XY]US5929510  (GELLER BERNARD DOV [US], et al) [X] 24-27,29,30,32 * column 1, line 52 - column 5, line 28; figures 1,3 * [Y] 1-23,28,31,33,34;
 [Y]DE10042653  (BOSCH GMBH ROBERT [DE]) [Y] 16,17,31,34* column 1, line 22 - column 2, line 27; figure 1 *
ExaminationUS3417393
 US4492717
 US5710082
 DE19846691
 EP1168609
    - "Dünnschichttechnologie", DE.WIKIPEDIA.ORG, URL: http://de.wikipedia.org/wiki/D%C3%BCnnschichttechnologie
    - SASSEN S ET AL, "Anodic bonding of evaporated glass structured with lift-off technology for hermetical sealing", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH LNKD- DOI:10.1016/S0924-4247(00)00300-9, (20000501), vol. 83, no. 1-3, ISSN 0924-4247, pages 150 - 155, XP004198307

DOI:   http://dx.doi.org/10.1016/S0924-4247(00)00300-9
    - BHATTACHARYYA A. ET AL., "Lift-Off Insulator Process", IBM TECHNICAL DISCLOSURE BULLETIN, New York, US, (197902), vol. 21, no. 9, pages 3577 - 3578
by applicantUS3417393
 US4492717
 US4564997
 US5710082
 US5929510
 DE19846691
 EP1168609
 DE10042653
 WO03100846
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.