EP1548143 - COPPER-BASE AMORPHOUS ALLOY [Right-click to bookmark this link] | |||
Former [2005/26] | Cu-BASE AMORPHOUS ALLOY | ||
[2006/40] | Status | No opposition filed within time limit Status updated on 21.03.2008 Database last updated on 24.08.2024 | Most recent event Tooltip | 21.03.2008 | No opposition filed within time limit | published on 23.04.2008 [2008/17] | Applicant(s) | For all designated states Japan Science and Technology Agency 1-8, Honcho 4-chome Kawaguchi-shi Saitama 332-0012 / JP | [2007/20] |
Former [2005/26] | For all designated states Japan Science and Technology Agency 1-8, Honcho 4-chome Kawaguchi-shi, Saitama 332-0012 / JP | Inventor(s) | 01 /
INOUE, Akihisa 11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura Aoba-ku Sendai-shi, Miyagi 980-0861 / JP | 02 /
ZHANG, Wei c/o Institute for Materials Research Tohoku University Katahira 2-1-1,Aoba-ku Sendai 980-8577 / JP | [2007/20] |
Former [2006/43] | 01 /
INOUE, Akihisa 11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura Aoba-ku Sendai-shi, Miyagi 980-0861 / JP | ||
02 /
ZHANG, Wei Inst for Materials Research, Tohoku University Katahira 2-1-1, Aobu-ku Sendai 980-8577 / JP | |||
Former [2006/23] | 01 /
INOUE, Akihisa 11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura Aoba-ku Sendai-shi, Miyagi 980-0861 / JP | ||
02 /
ZHANG, Wei Inst for Material Research, Tohoku University Katahira 2-1-1, Aobu-ku Sendai 980-8577 / JP | |||
Former [2005/26] | 01 /
INOUE, Akihisa 11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura Aoba-ku Sendai-shi, Miyagi 980-0861 / JP | ||
02 /
ZHANG, Wei Room 403, 3-4, Kadan Aoba-ku Sendai-shi, Miyagi 980-0815 / JP | Representative(s) | Röthinger, Rainer Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [N/P] |
Former [2005/26] | Röthinger, Rainer, Dipl.-Phys. c/o Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2 81541 München / DE | Application number, filing date | 03736165.6 | 12.06.2003 | [2005/26] | WO2003JP07460 | Priority number, date | JP20020255529 | 30.08.2002 Original published format: JP 2002255529 | [2005/26] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2004022811 | Date: | 18.03.2004 | Language: | EN | [2004/12] | Type: | A1 Application with search report | No.: | EP1548143 | Date: | 29.06.2005 | Language: | EN | The application published by WIPO in one of the EPO official languages on 18.03.2004 takes the place of the publication of the European patent application. | [2005/26] | Type: | B1 Patent specification | No.: | EP1548143 | Date: | 16.05.2007 | Language: | EN | [2007/20] | Search report(s) | International search report - published on: | JP | 18.03.2004 | (Supplementary) European search report - dispatched on: | EP | 08.02.2006 | Classification | IPC: | C22C45/00, C22C9/00, C22C9/01, C22C45/10 | [2006/12] | CPC: |
C22C45/001 (EP,US);
C22C1/11 (EP,US)
|
Former IPC [2005/26] | C22C45/00, C22C9/00 | Designated contracting states | DE, FR, GB [2005/51] |
Former [2005/26] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | AMORPHE LEGIERUNG AUF KUPFER-BASIS | [2006/40] | English: | COPPER-BASE AMORPHOUS ALLOY | [2006/40] | French: | ALLIAGE AMORPHE A BASE DE CUIVRE | [2006/40] |
Former [2005/26] | AMORPHE LEGIERUNG AUF Cu-BASIS | ||
Former [2005/26] | Cu-BASE AMORPHOUS ALLOY | ||
Former [2005/26] | ALLIAGE AMORPHE A BASE DE CU | Entry into regional phase | 17.03.2005 | Translation filed | 17.03.2005 | National basic fee paid | 17.03.2005 | Search fee paid | 17.03.2005 | Designation fee(s) paid | 17.03.2005 | Examination fee paid | Examination procedure | 03.09.2003 | Request for preliminary examination filed International Preliminary Examining Authority: JP | 17.03.2005 | Examination requested [2005/26] | 28.04.2006 | Despatch of a communication from the examining division (Time limit: M04) | 18.08.2006 | Reply to a communication from the examining division | 26.09.2006 | Communication of intention to grant the patent | 05.01.2007 | Fee for grant paid | 05.01.2007 | Fee for publishing/printing paid | Opposition(s) | 19.02.2008 | No opposition filed within time limit [2008/17] | Fees paid | Renewal fee | 16.06.2005 | Renewal fee patent year 03 | 19.06.2006 | Renewal fee patent year 04 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH07188877 ; | [A]EP0433670 (MASUMOTO TSUYOSHI [JP], et al) [A] 1,2 * abstract * * page 4, line 19 - line 20 * * page 4, line 38 - line 40 *; | [A]US5803996 (INOUE AKIHISA [JP], et al) [A] 1,2* abstract *; | [A] - INOUE A ET AL, "Cu-based bulk glassy alloys with high tensile strength of over 2000 MPa", JOURNAL OF NON-CRYSTALLINE SOLIDS, NORTH-HOLLAND PHYSICS PUBLISHING. AMSTERDAM, NL, (200206), vol. 304, no. 1-3, ISSN 0022-3093, pages 200 - 209, XP004353421 [A] 1,2 * abstract * * page 205, column 2 * DOI: http://dx.doi.org/10.1016/S0022-3093(02)01025-6 | [A] - PATENT ABSTRACTS OF JAPAN, (19951130), vol. 1995, no. 10, & JP07188877 A 19950725 (TAKESHI MASUMOTO; others: 02) [A] 1,2 * abstract * | International search | [X]JPH0920968 (ELECT & MAGN ALLOYS RES INST); | [X]WO0026425 (JAPAN SCIENCE & TECH CORP [JP], et al); | [X]WO02053791 (JAPAN SCIENCE & TECH CORP [JP], et al) |