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Extract from the Register of European Patents

EP About this file: EP1548143

EP1548143 - COPPER-BASE AMORPHOUS ALLOY [Right-click to bookmark this link]
Former [2005/26]Cu-BASE AMORPHOUS ALLOY
[2006/40]
StatusNo opposition filed within time limit
Status updated on  21.03.2008
Database last updated on 24.08.2024
Most recent event   Tooltip21.03.2008No opposition filed within time limitpublished on 23.04.2008  [2008/17]
Applicant(s)For all designated states
Japan Science and Technology Agency
1-8, Honcho 4-chome Kawaguchi-shi
Saitama 332-0012 / JP
[2007/20]
Former [2005/26]For all designated states
Japan Science and Technology Agency
1-8, Honcho 4-chome
Kawaguchi-shi, Saitama 332-0012 / JP
Inventor(s)01 / INOUE, Akihisa
11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura
Aoba-ku Sendai-shi, Miyagi 980-0861 / JP
02 / ZHANG, Wei
c/o Institute for Materials Research Tohoku University Katahira 2-1-1,Aoba-ku
Sendai 980-8577 / JP
 [2007/20]
Former [2006/43]01 / INOUE, Akihisa
11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura
Aoba-ku Sendai-shi, Miyagi 980-0861 / JP
02 / ZHANG, Wei
Inst for Materials Research, Tohoku University
Katahira 2-1-1, Aobu-ku Sendai 980-8577 / JP
Former [2006/23]01 / INOUE, Akihisa
11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura
Aoba-ku Sendai-shi, Miyagi 980-0861 / JP
02 / ZHANG, Wei
Inst for Material Research, Tohoku University
Katahira 2-1-1, Aobu-ku Sendai 980-8577 / JP
Former [2005/26]01 / INOUE, Akihisa
11-806, Kawauchi-Jyutaku 35, Kawauchi Motohasekura
Aoba-ku Sendai-shi, Miyagi 980-0861 / JP
02 / ZHANG, Wei
Room 403, 3-4, Kadan Aoba-ku
Sendai-shi, Miyagi 980-0815 / JP
Representative(s)Röthinger, Rainer
Wuesthoff & Wuesthoff
Patentanwälte und Rechtsanwalt PartG mbB
Schweigerstrasse 2
81541 München / DE
[N/P]
Former [2005/26]Röthinger, Rainer, Dipl.-Phys.
c/o Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2
81541 München / DE
Application number, filing date03736165.612.06.2003
[2005/26]
WO2003JP07460
Priority number, dateJP2002025552930.08.2002         Original published format: JP 2002255529
[2005/26]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2004022811
Date:18.03.2004
Language:EN
[2004/12]
Type: A1 Application with search report 
No.:EP1548143
Date:29.06.2005
Language:EN
The application published by WIPO in one of the EPO official languages on 18.03.2004 takes the place of the publication of the European patent application.
[2005/26]
Type: B1 Patent specification 
No.:EP1548143
Date:16.05.2007
Language:EN
[2007/20]
Search report(s)International search report - published on:JP18.03.2004
(Supplementary) European search report - dispatched on:EP08.02.2006
ClassificationIPC:C22C45/00, C22C9/00, C22C9/01, C22C45/10
[2006/12]
CPC:
C22C45/001 (EP,US); C22C1/11 (EP,US)
Former IPC [2005/26]C22C45/00, C22C9/00
Designated contracting statesDE,   FR,   GB [2005/51]
Former [2005/26]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:AMORPHE LEGIERUNG AUF KUPFER-BASIS[2006/40]
English:COPPER-BASE AMORPHOUS ALLOY[2006/40]
French:ALLIAGE AMORPHE A BASE DE CUIVRE[2006/40]
Former [2005/26]AMORPHE LEGIERUNG AUF Cu-BASIS
Former [2005/26]Cu-BASE AMORPHOUS ALLOY
Former [2005/26]ALLIAGE AMORPHE A BASE DE CU
Entry into regional phase17.03.2005Translation filed 
17.03.2005National basic fee paid 
17.03.2005Search fee paid 
17.03.2005Designation fee(s) paid 
17.03.2005Examination fee paid 
Examination procedure03.09.2003Request for preliminary examination filed
International Preliminary Examining Authority: JP
17.03.2005Examination requested  [2005/26]
28.04.2006Despatch of a communication from the examining division (Time limit: M04)
18.08.2006Reply to a communication from the examining division
26.09.2006Communication of intention to grant the patent
05.01.2007Fee for grant paid
05.01.2007Fee for publishing/printing paid
Opposition(s)19.02.2008No opposition filed within time limit [2008/17]
Fees paidRenewal fee
16.06.2005Renewal fee patent year 03
19.06.2006Renewal fee patent year 04
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Documents cited:Search[A]JPH07188877  ;
 [A]EP0433670  (MASUMOTO TSUYOSHI [JP], et al) [A] 1,2 * abstract * * page 4, line 19 - line 20 * * page 4, line 38 - line 40 *;
 [A]US5803996  (INOUE AKIHISA [JP], et al) [A] 1,2* abstract *;
 [A]  - INOUE A ET AL, "Cu-based bulk glassy alloys with high tensile strength of over 2000 MPa", JOURNAL OF NON-CRYSTALLINE SOLIDS, NORTH-HOLLAND PHYSICS PUBLISHING. AMSTERDAM, NL, (200206), vol. 304, no. 1-3, ISSN 0022-3093, pages 200 - 209, XP004353421 [A] 1,2 * abstract * * page 205, column 2 *

DOI:   http://dx.doi.org/10.1016/S0022-3093(02)01025-6
 [A]  - PATENT ABSTRACTS OF JAPAN, (19951130), vol. 1995, no. 10, & JP07188877 A 19950725 (TAKESHI MASUMOTO; others: 02) [A] 1,2 * abstract *
International search[X]JPH0920968  (ELECT & MAGN ALLOYS RES INST);
 [X]WO0026425  (JAPAN SCIENCE & TECH CORP [JP], et al);
 [X]WO02053791  (JAPAN SCIENCE & TECH CORP [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.