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EP1518270
European procedure
Extract from the Register of European Patents
EP About this file: EP1518270
| EP1518270 - METHOD FOR PRODUCING A PACKAGING FOR SEMICONDUCTOR COMPONENTS [Right-click to bookmark this link] | |||
| Former [2005/13] | PACKAGING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR PRODUCING THE SAME | ||
| [2008/27] | Status | No opposition filed within time limit Status updated on 02.10.2009 Database last updated on 31.08.2024 | Most recent event Tooltip | 04.03.2011 | Lapse of the patent in a contracting state New state(s): IT | published on 06.04.2011 [2011/14] | Applicant(s) | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | [2008/48] |
| Former [2005/13] | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | Inventor(s) | 01 /
ZACHERL, Juergen Jahnstrasse 2 93093 Donaustauf / DE | 02 /
BLASZCZAK, Stephan Strasse des Friedens 9a 06632 Freyburg / DE | 03 /
REISS, Martin Boltenhaagener Platz 10 01109 Dresden / DE | 04 /
LUDEWIG, Sylke Reichenbachstrasse 66 01217 Dresden / DE | [2005/13] | Representative(s) | Hudler, Frank Lippert Stachow Patentanwälte Rechtanwälte Partnerschaft mbB Krenkelstrasse 3 01309 Dresden / DE | [N/P] |
| Former [2005/13] | Hudler, Frank, Dipl.-Ing. Lippert, Stachow & Partner Krenkelstrasse 3 01309 Dresden / DE | Application number, filing date | 03740078.5 | 10.06.2003 | [2005/13] | WO2003DE01925 | Priority number, date | DE2002127059 | 17.06.2002 Original published format: DE 10227059 | [2005/13] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO03107417 | Date: | 24.12.2003 | Language: | DE | [2003/52] | Type: | A1 Application with search report | No.: | EP1518270 | Date: | 30.03.2005 | Language: | DE | The application published by WIPO in one of the EPO official languages on 24.12.2003 takes the place of the publication of the European patent application. | [2005/13] | Type: | B1 Patent specification | No.: | EP1518270 | Date: | 26.11.2008 | Language: | DE | [2008/48] | Search report(s) | International search report - published on: | EP | 24.12.2003 | Classification | IPC: | H01L23/31, H01L21/56 | [2005/13] | CPC: |
H01L21/56 (KR);
H01L21/565 (EP,US);
H01L23/28 (KR);
H01L23/3142 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB, IE, IT, PT [2005/13] | Title | German: | VERFAHREN ZUM HERSTELLEN EINER VERPACKUNG FÜR HALBLEITERBAUELEMENTE | [2008/27] | English: | METHOD FOR PRODUCING A PACKAGING FOR SEMICONDUCTOR COMPONENTS | [2008/27] | French: | PROCEDE DE REALISATION D'UN ENCAPSULAGE POUR COMPOSANTS SEMI-CONDUCTEURS | [2008/27] |
| Former [2005/13] | VERPACKUNG FÜR HALBLEITERBAUELEMENTE UND VERFAHREN ZUM HERSTELLEN DERSELBEN | ||
| Former [2005/13] | PACKAGING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR PRODUCING THE SAME | ||
| Former [2005/13] | ENCAPSULAGE POUR COMPOSANTS SEMI-CONDUCTEURS ET SON PROCEDE DE REALISATION | Entry into regional phase | 07.01.2005 | National basic fee paid | 07.01.2005 | Designation fee(s) paid | 07.01.2005 | Examination fee paid | Examination procedure | 16.01.2004 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 07.01.2005 | Examination requested [2005/13] | 15.01.2007 | Despatch of a communication from the examining division (Time limit: M04) | 25.05.2007 | Reply to a communication from the examining division | 11.08.2008 | Communication of intention to grant the patent | 08.10.2008 | Fee for grant paid | 08.10.2008 | Fee for publishing/printing paid | Opposition(s) | 27.08.2009 | No opposition filed within time limit [2009/45] | Fees paid | Renewal fee | 07.06.2005 | Renewal fee patent year 03 | 29.06.2006 | Renewal fee patent year 04 | 18.06.2007 | Renewal fee patent year 05 | 18.06.2008 | Renewal fee patent year 06 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IE | 26.11.2008 | IT | 26.11.2008 | PT | 27.04.2009 | GB | 10.06.2009 | FR | 30.06.2009 | [2011/14] |
| Former [2010/25] | IE | 26.11.2008 | |
| PT | 27.04.2009 | ||
| GB | 10.06.2009 | ||
| FR | 30.06.2009 | ||
| Former [2010/23] | IE | 26.11.2008 | |
| PT | 27.04.2009 | ||
| FR | 30.06.2009 | ||
| Former [2009/39] | IE | 26.11.2008 | |
| PT | 27.04.2009 | ||
| Former [2009/34] | IE | 26.11.2008 | Cited in | International search | [X]JPH02178953 ; | JPH02178953 [ ] (NEC CORP) [ ] * the whole document *; | [X]US6107679 (NOGUCHI TAKASHI [JP]) [X] 1,5-7 * the whole document *; | [A]US2001026959 (JIMAREZ MIGUEL A [US], et al) [A] * the whole document * | [X] - PATENT ABSTRACTS OF JAPAN, (19900926), vol. 0144, no. 48, Database accession no. (E - 0983), & JP2178953 A 19900711 (NEC CORP) [X] 1,2 * abstract * |