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EP1490894
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EP About this file: EP1490894
| EP1490894 - METHOD FOR PROCESSING ELECTRICAL COMPONENTS, ESPECIALLY SEMICONDUCTOR CHIPS, AND DEVICE FOR CARRYING OUT THE METHOD [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 31.03.2006 Database last updated on 02.11.2024 | Most recent event Tooltip | 31.03.2006 | Application deemed to be withdrawn | published on 17.05.2006 [2006/20] | Applicant(s) | For all designated states Sillner, Georg Buchenstrasse 23 D-93197 Zeitlarn / DE | [2005/01] | Inventor(s) | 01 /
see applicant ... | [2005/01] | Representative(s) | Graf, Helmut, et al Graf Glück Habersack Kritzenberger Postfach 10 08 26 93008 Regensburg / DE | [N/P] |
| Former [2005/01] | Graf, Helmut, Dipl.-Ing., et al Patentanwalt Postfach 10 08 26 93008 Regensburg / DE | Application number, filing date | 03745743.9 | 02.04.2003 | [2005/01] | WO2003DE01058 | Priority number, date | DE2002114969 | 04.04.2002 Original published format: DE 10214969 | DE2002118384 | 24.04.2002 Original published format: DE 10218384 | DE2002125097 | 05.06.2002 Original published format: DE 10225097 | [2005/01] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO03085702 | Date: | 16.10.2003 | Language: | DE | [2003/42] | Type: | A1 Application with search report | No.: | EP1490894 | Date: | 29.12.2004 | Language: | DE | The application published by WIPO in one of the EPO official languages on 16.10.2003 takes the place of the publication of the European patent application. | [2004/53] | Search report(s) | International search report - published on: | EP | 16.10.2003 | Classification | IPC: | H01L21/00 | [2005/01] | CPC: |
H01L21/67144 (EP,US);
H01L21/67132 (EP,US);
H01L24/75 (EP,US);
H01L2924/14 (EP,US);
Y10T29/49133 (EP,US);
Y10T29/53187 (EP,US)
| C-Set: |
H01L2924/14, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR [2005/01] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | Title | German: | VERFAHREN ZUM VERARBEITEN VON ELEKTRISCHEN BAUELEMENTEN, INSBESONDERE VON HALBLEITERCHIPS, SOWIE VORRICHTUNG ZUM DURCHF HREN DES VERFAHRENS | [2005/01] | English: | METHOD FOR PROCESSING ELECTRICAL COMPONENTS, ESPECIALLY SEMICONDUCTOR CHIPS, AND DEVICE FOR CARRYING OUT THE METHOD | [2005/01] | French: | PROCEDE DE TRAITEMENT DE COMPOSANTS ELECTRIQUES, NOTAMMENT DE PUCES A SEMI-CONDUCTEUR ET DISPOSITIF POUR METTRE LEDIT PROCEDE EN OEUVRE | [2005/01] | Entry into regional phase | 20.10.2004 | National basic fee paid | 20.10.2004 | Designation fee(s) paid | 20.10.2004 | Examination fee paid | Examination procedure | 29.09.2004 | Amendment by applicant (claims and/or description) | 20.10.2004 | Examination requested [2004/53] | 03.11.2005 | Application deemed to be withdrawn, date of legal effect [2006/20] | 06.12.2005 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2006/20] | Fees paid | Penalty fee | Additional fee for renewal fee | 30.04.2005 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [A]EP0075491 (TOKYO SHIBAURA ELECTRIC CO [JP]) [A] 1,22 * figure 3 *; | [A]EP0146197 (STAUFFER CHEMICAL CO [US]) [A] 1,22 * figures 1,2 * |