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Extract from the Register of European Patents

EP About this file: EP1558782

EP1558782 - DEVICE AND METHOD FOR THE EVAPORATIVE DEPOSITION OF A HIGH-TEMPERATURE SUPERCONDUCTOR IN A VACUUM WITH CONTINUOUS MATERIAL INTRODUCTION [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.03.2007
Database last updated on 25.09.2024
Most recent event   Tooltip28.08.2009Lapse of the patent in a contracting state
New state(s): BE		published on 30.09.2009  [2009/40]
Applicant(s)For all designated states
Theva Dünnschichttechnik GmbH
Rote-Kreuz-Strasse 8
85737 Ismaning / DE
[2006/13]
Former [2005/31]For all designated states
Theva Dünnschichttechnik GmbH
Rote-Kreuz-Strasse 8
85737 Ismaning / DE
Inventor(s)01 / KINDER, Helmut
Hohenbachernstrasse 55
85354 Freising / DE
 [2005/31]
Representative(s)Hess, Peter K. G.
Bardehle Pagenberg Partnerschaft mbB
Patentanwälte, Rechtsanwälte
Postfach 86 06 20
81633 München / DE
[N/P]
Former [2005/31]Hess, Peter K., Dipl.-Phys.
Patent- und Rechtsanwälte Bardehle . Pagenberg . Dost . Altenberg . Geissler Postfach 86 06 20
81633 München / DE
Application number, filing date03795784.215.10.2003
[2005/31]
WO2003EP11428
Priority number, dateEP2002002490105.11.2002         Original published format: EP 02024901
[2005/31]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report
No.:WO2004041985
Date:21.05.2004
Language:DE
[2004/21]
Type: A2 Application without search report 
No.:EP1558782
Date:03.08.2005
Language:DE
The application published by WIPO in one of the EPO official languages on 21.05.2004 takes the place of the publication of the European patent application.
[2005/31]
Type: B1 Patent specification 
No.:EP1558782
Date:29.03.2006
Language:DE
[2006/13]
Search report(s)International search report - published on:EP17.06.2004
ClassificationIPC:C23C14/28, C23C14/24
[2005/31]
CPC:
C23C14/30 (EP,KR,US); C23C14/0021 (EP,KR,US); C23C14/08 (EP,US);
C23C14/221 (KR); C23C14/246 (EP,KR,US); C23C14/34 (KR);
C23C14/56 (KR); H01L21/02631 (KR) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   RO,   SE,   SI,   SK,   TR [2005/31]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:VORRICHTUNG UND VERFAHREN ZUM AUFDAMPFEN EINES HOCHTEMPERATURSUPRALEITERS IM VAKUUM MIT KONTINUIERLICHER MATERIALNACHFÜHRUNG[2005/31]
English:DEVICE AND METHOD FOR THE EVAPORATIVE DEPOSITION OF A HIGH-TEMPERATURE SUPERCONDUCTOR IN A VACUUM WITH CONTINUOUS MATERIAL INTRODUCTION[2005/31]
French:DISPOSITIF ET PROCEDE DE DEPOT EN PHASE VAPEUR SOUS VIDE D'UN SUPRACONDUCTEUR À HAUTE TEMPÉRATURE AVEC REMPLISSAGE DE MATÉRIAU AUTOMATIQUE[2005/42]
Former [2005/31]DISPOSITIF ET PROCEDE DE DEPOT EN PHASE VAPEUR D'UN MATERIAU DE REVETEMENT
Entry into regional phase12.05.2005National basic fee paid 
12.05.2005Designation fee(s) paid 
12.05.2005Examination fee paid 
Examination procedure07.06.2004Request for preliminary examination filed
International Preliminary Examining Authority: EP
12.05.2005Examination requested  [2005/31]
19.07.2005Amendment by applicant (claims and/or description)
15.09.2005Communication of intention to grant the patent
25.01.2006Fee for grant paid
25.01.2006Fee for publishing/printing paid
Opposition(s)02.01.2007No opposition filed within time limit [2007/14]
Fees paidRenewal fee
12.10.2005Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCY29.03.2006
CZ29.03.2006
EE29.03.2006
FI29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
TR29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
HU30.09.2006
AT15.10.2006
LU15.10.2006
BE31.10.2006
MC31.10.2006
[2009/40]
Former [2009/03]CY29.03.2006
CZ29.03.2006
EE29.03.2006
FI29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
TR29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
HU30.09.2006
AT15.10.2006
LU15.10.2006
MC31.10.2006
Former [2008/37]CZ29.03.2006
EE29.03.2006
FI29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
TR29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
HU30.09.2006
AT15.10.2006
LU15.10.2006
MC31.10.2006
Former [2008/32]CZ29.03.2006
EE29.03.2006
FI29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
HU30.09.2006
AT15.10.2006
MC31.10.2006
Former [2008/28]CZ29.03.2006
EE29.03.2006
FI29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
AT15.10.2006
MC31.10.2006
Former [2008/21]CZ29.03.2006
IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
GR30.06.2006
ES10.07.2006
PT29.08.2006
AT15.10.2006
MC31.10.2006
Former [2008/14]IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
ES10.07.2006
PT29.08.2006
AT15.10.2006
MC31.10.2006
Former [2007/50]IE29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
ES10.07.2006
PT29.08.2006
MC31.10.2006
Former [2007/41]IE29.03.2006
IT29.03.2006
NL29.03.2006
RO29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
ES10.07.2006
PT29.08.2006
MC31.10.2006
Former [2007/20]IE29.03.2006
NL29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
ES10.07.2006
PT29.08.2006
Former [2007/14]IE29.03.2006
SI29.03.2006
SK29.03.2006
BG29.06.2006
DK29.06.2006
SE29.06.2006
ES10.07.2006
PT29.08.2006
Former [2007/03]SI29.03.2006
SK29.03.2006
BG29.06.2006
SE29.06.2006
ES10.07.2006
Former [2006/50]SI29.03.2006
BG29.06.2006
SE29.06.2006
ES10.07.2006
Former [2006/49]SI29.03.2006
BG29.06.2006
SE29.06.2006
Former [2006/46]SI29.03.2006
SE29.06.2006
Former [2006/40]SI29.03.2006
Cited inInternational search[XY]JPH01108364  ;
 [XY]JPH01108363  ;
 [X]JPS613880  ;
 [Y]JPH01264114  ;
 [A]JPH0995775  ;
 [Y]JPH1186647  ;
 [Y]US3654109  (HOHL JAKOB H, et al) [Y] 19,20 * column 5, line 1 - line 20 * * column 7, line 42 - line 44 * * column 8, line 36 - line 43 *;
 [XY]DE2513813  (AIRCO INC) [X] 1-4,9-13,16,18 * page 3 - page 5; figures 1-3 * [Y] 5-7,17,19-27;
 [Y]US4381894  (GOGOL JR CARL A, et al) [Y] 19,20 * column 2; figure 1 *;
 [Y]US5254832  (GARTNER GEORG [DE], et al) [Y] 5-7 * abstract * * column 3, line 13 - line 17 * * column 7, line 21 - line 25 * * column 9, line 5 - line 13 * * column 11, line 5 - line 17; figure 5 *;
 [Y]WO9822635  (MICRON TECHNOLOGY INC [US]) [Y] 8 * page 1 - page 4; figure 3 *;
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19890725), vol. 013, no. 331, Database accession no. (C - 622), & JP01108364 A 19890425 (ISHIKAWAJIMA HARIMA HEAVY IND CO LTD) [X] 1-4,9-13,16,18 * abstract * [Y] 5-7,17,19-27
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19890725), vol. 013, no. 331, Database accession no. (C - 622), & JP01108363 A 19890425 (ISHIKAWAJIMA HARIMA HEAVY IND CO LTD) [X] 1-4,9-13,16,18 * abstract * [Y] 5-7,17,19-27
 [X]  - PATENT ABSTRACTS OF JAPAN, (19860527), vol. 010, no. 144, Database accession no. (C - 349), & JP61003880 A 19860109 (TAIYOU YUUDEN KK) [X] 1,13,16 * abstract *
 [XDY]  - DAVIS M F ET AL, "ELECTRON BEAM FLASH EVAPORATION FOR YBACUO AND BICASRCUO THIN FILMS", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, (19891115), vol. 66, no. 10, ISSN 0021-8979, pages 4903 - 4908, XP000105104 [XD] 28 * the whole document * [Y] 23-27

DOI:   http://dx.doi.org/10.1063/1.343759
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19900117), vol. 014, no. 022, Database accession no. (E - 874), & JP01264114 A 19891020 (SUMITOMO ELECTRIC IND LTD) [Y] 17 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19970829), vol. 1997, no. 08, & JP09095775 A 19970408 (CHUGAI RO CO LTD) [A] 13-15 * abstract *
 [Y]  - LEE S-G ET AL, "DEPOSITION ANGLE-DEPENDENT MORPHOLOGY OF LASER DEPOSITED YBA2CU3O7 THIN FILMS", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, (19940808), vol. 65, no. 6, ISSN 0003-6951, pages 764 - 766, XP000464593 [Y] 8 * the whole document *

DOI:   http://dx.doi.org/10.1063/1.112223
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19990630), vol. 1999, no. 08, & JP11086647 A 19990330 (FUJIKURA LTD) [Y] 21,22 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.