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EP1462422
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EP About this file: EP1462422
| EP1462422 - Anodic bonding method and its use to manufacture an electronic device [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 06.01.2017 Database last updated on 20.07.2024 | Most recent event Tooltip | 06.01.2017 | Application deemed to be withdrawn | published on 08.02.2017 [2017/06] | Applicant(s) | For all designated states Hitachi, Ltd. 6 Kanda Surugadai 4-chome Chiyoda-ku Tokyo 100-8010 / JP | [N/P] |
| Former [2004/40] | For all designated states Hitachi, Ltd. 6 Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101-8010 / JP | Inventor(s) | 01 /
Hata, Shohei, c/oHitachi, Ltd., Intel. Prop. Group New Marunouchi Bldg. 5-1-1, Marunouchi Chiyoda-ku Tokyo / JP | 02 /
Sotokawa, Hideo, c/oHitachi, Ltd., Int. Prop. Grp. New Marunouchi Bldg. 5-1-1, Marunouchi Chiyoda-ku Tokyo / JP | 03 /
Furuichi, Hiroaki, c/oHitachi, Ltd., Int. Prop. Gr New Marunouchi Bldg. 5-1-1, Marunouchi Chiyoda-ku Tokyo / JP | [2004/40] | Representative(s) | Strehl Schübel-Hopf & Partner Maximilianstrasse 54 80538 München / DE | [2004/40] | Application number, filing date | 04004218.6 | 25.02.2004 | [2004/40] | Priority number, date | JP20030053410 | 28.02.2003 Original published format: JP 2003053410 | [2004/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1462422 | Date: | 29.09.2004 | Language: | EN | [2004/40] | Type: | A3 Search report | No.: | EP1462422 | Date: | 21.11.2007 | [2007/47] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.10.2007 | Classification | IPC: | C03C27/00, H01L21/58 | [2004/40] | CPC: |
H01L21/2007 (EP,US);
C03C27/00 (EP,US);
C03C27/02 (EP,US)
| Designated contracting states | DE, FR, GB [2008/31] |
| Former [2004/40] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Anodisches Bondenverfahren und ihre Verwendung zur Herstellung einer elektronischen Vorrichtung | [2004/40] | English: | Anodic bonding method and its use to manufacture an electronic device | [2004/40] | French: | Procédé de liaison anodique et application de ce procédé à la réalisation d'un dispositif électronique | [2004/40] | Examination procedure | 31.03.2006 | Examination requested [2006/22] | 22.05.2008 | Loss of particular rights, legal effect: designated state(s) | 27.06.2008 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR | 05.08.2008 | Despatch of a communication from the examining division (Time limit: M04) | 15.12.2008 | Reply to a communication from the examining division | 01.09.2016 | Application deemed to be withdrawn, date of legal effect [2017/06] | 30.09.2016 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2017/06] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 05.08.2008 | Fees paid | Renewal fee | 23.02.2006 | Renewal fee patent year 03 | 13.02.2007 | Renewal fee patent year 04 | 21.02.2008 | Renewal fee patent year 05 | 31.03.2008 | Renewal fee patent year 06 | 23.02.2010 | Renewal fee patent year 07 | 22.02.2011 | Renewal fee patent year 08 | 22.02.2012 | Renewal fee patent year 09 | 27.02.2013 | Renewal fee patent year 10 | 20.02.2014 | Renewal fee patent year 11 | 27.02.2015 | Renewal fee patent year 12 | Penalty fee | Additional fee for renewal fee | 29.02.2016 | 13 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]EP0153096 (VARIAN ASSOCIATES [US]) [X] 1,3-9 * page 5, lines 18,19; figure 1a * * page 3, line 14 * [Y] 2; | [Y]DE19508222 (SIEMENS AG [DE]) [Y] 2 * column 2, line 20; figure 1 *; | [DA]JPH10259039 (FUJITSU LTD); | [A]WO0210064 (HRL LAB LLC [US], et al) [A] 7 * page 16, line 18 - line 21 *; | [A]US6417478 (SHIRAISHI MASAYOSHI [JP], et al); | [A]US2002110754 (SKROBIS AMY V [US]) [A] 7 * paragraph [0008] *; | [PA]US2004029336 (HARPSTER TIMOTHY J [US], et al); | [A] - Journal of Applied Physics USA, (198305), vol. 54, no. 5, ISSN 0021-8979, pages 2419 - 2428, XP002454260 [A] 8 DOI: http://dx.doi.org/10.1063/1.332357 |