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EP1484796
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EP About this file: EP1484796
| EP1484796 - Semiconductor device and manufacturing method of the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 29.01.2010 Database last updated on 02.11.2024 | Most recent event Tooltip | 29.01.2010 | Application deemed to be withdrawn | published on 03.03.2010 [2010/09] | Applicant(s) | For all designated states SANYO ELECTRIC CO., LTD. 5-5, Keihanhondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | [N/P] |
| Former [2004/50] | For all designated states Sanyo Electric Co., Ltd. 5-5, Keihanhondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | Inventor(s) | 01 /
Ikeda, Osamu 2-1-8 Fuji Oizumi-machi Ora-gun Gunma / JP | 02 /
Ohkoda, Toshiyuki 5-16-9 Asahi Oizumi-machi Ora-gun Gunma / JP | [2004/50] | Representative(s) | Glawe, Delfs, Moll Partnerschaft mbB von Patent- und Rechtsanwälten Rothenbaumchaussee 58 20148 Hamburg / DE | [N/P] |
| Former [2009/26] | Glawe, Delfs, Moll Patent- und Rechtsanwälte Rothenbaumchaussee 58 20148 Hamburg / DE | ||
| Former [2004/50] | Glawe, Delfs, Moll Patent- und Rechtsanwälte, Rothenbaumchaussee 58 20148 Hamburg / DE | Application number, filing date | 04013033.8 | 02.06.2004 | [2004/50] | Priority number, date | JP20030161634 | 06.06.2003 Original published format: JP 2003161634 | [2004/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1484796 | Date: | 08.12.2004 | Language: | EN | [2004/50] | Type: | A3 Search report | No.: | EP1484796 | Date: | 12.03.2008 | [2008/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.02.2008 | Classification | IPC: | H01L23/31 | [2004/50] | CPC: |
B81B7/007 (EP,US);
H01L27/14 (KR);
H01L23/00 (KR);
H01L27/14618 (EP,US);
H01L27/14806 (EP,US);
B81C2203/0118 (EP,US);
| Designated contracting states | DE, FI, FR, GB [2008/47] |
| Former [2004/50] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiteranordnung und Herstellungsverfahren dafür | [2004/50] | English: | Semiconductor device and manufacturing method of the same | [2004/50] | French: | Composant semi-conducteur et son procédé de fabrication | [2004/50] | Examination procedure | 05.09.2008 | Examination requested [2008/43] | 13.09.2008 | Loss of particular rights, legal effect: designated state(s) | 22.10.2008 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | 27.04.2009 | Despatch of a communication from the examining division (Time limit: M04) | 08.09.2009 | Application deemed to be withdrawn, date of legal effect [2010/09] | 14.10.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2010/09] | Fees paid | Renewal fee | 27.03.2006 | Renewal fee patent year 03 | 27.06.2007 | Renewal fee patent year 04 | 25.03.2008 | Renewal fee patent year 05 | 24.06.2009 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]JPH06249708 (NISSAN MOTOR) [X] 1-8 * abstract * [Y] 10-18; | [Y]US5686171 (VOKOUN EDWARD R [US], et al) [Y] 11-18* column 1, line 31 - column 2, line 26; figure 1 *; | [Y]US6384353 (HUANG JENN-HWA [US], et al) [Y] 10 * column 2, line 43 - column 3, line 11; figure 5 * |