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EP1526572
European procedure
Extract from the Register of European Patents
EP About this file: EP1526572
| EP1526572 - Semiconductor package with bond wire inductors [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.07.2020 Database last updated on 18.11.2024 | |
| Former | The patent has been granted Status updated on 17.05.2019 | ||
| Former | Grant of patent is intended Status updated on 08.01.2019 | ||
| Former | Examination is in progress Status updated on 08.02.2017 | Most recent event Tooltip | 30.10.2020 | Lapse of the patent in a contracting state | published on 02.12.2020 [2020/49] | Applicant(s) | For all designated states Avago Technologies International Sales Pte. Limited 1 Yishun Avenue 7 Singapore 768923 / SG | [2018/52] |
| Former [2017/36] | For all designated states Avago Technologies General IP (Singapore) Pte. Ltd. 1 Yishun Avenue 7 Singapore 768923 / SG | ||
| Former [2007/21] | For all designated states Broadcom Corporation 5300 California Avenue Irvine, CA 92617 / US | ||
| Former [2005/17] | For all designated states Broadcom Corporation 16215 Alton Parkway Irvine, California 92618-7013 / US | Inventor(s) | 01 /
Behzad, Arya 13708 Paseo de las Cumbres Poway, CA 92064 / US | [2005/17] | Representative(s) | Bosch Jehle Patentanwaltsgesellschaft mbH Flüggenstraße 13 80639 München / DE | [2019/25] |
| Former [2008/52] | Jehle, Volker Armin, et al Bosch Jehle Patentanwaltsgesellschaft mbH Flüggenstrasse 13 80639 München / DE | ||
| Former [2008/41] | Jehle, Volker Armin Patentanwälte Bosch, Graf von Stosch, Jehle Flüggenstrasse 13 80639 München / DE | ||
| Former [2005/17] | Jehle, Volker Armin, Dipl.-Ing. Bosch, Graf von Stosch, Jehle, Flüggenstrasse 13 80639 München / DE | Application number, filing date | 04025314.8 | 25.10.2004 | [2005/17] | Priority number, date | US20030513798P | 23.10.2003 Original published format: US 513798 P | US20030515213P | 28.10.2003 Original published format: US 515213 P | [2005/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1526572 | Date: | 27.04.2005 | Language: | EN | [2005/17] | Type: | A3 Search report | No.: | EP1526572 | Date: | 25.01.2006 | [2006/04] | Type: | B1 Patent specification | No.: | EP1526572 | Date: | 19.06.2019 | Language: | EN | [2019/25] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.12.2005 | Classification | IPC: | H01L23/49, H01L23/66, H03F1/56, H03F3/191, H03J5/24, // H01L23/36, H01L23/31 | [2019/02] | CPC: |
H03F3/191 (EP,US);
H01L23/36 (EP,US);
H01L23/66 (EP,US);
H01L24/49 (EP,US);
H03D7/1441 (EP,US);
H03D7/1458 (EP,US);
H03D7/1483 (EP,US);
H03F1/565 (EP,US);
H03F3/45188 (EP,US);
H03J5/244 (EP,US);
H01L2223/6611 (EP,US);
H01L2224/32188 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/48253 (EP,US);
H01L2224/48257 (EP,US);
H01L2224/49111 (EP,US);
H01L2224/49112 (EP,US);
H01L2224/49113 (EP,US);
H01L2224/49171 (EP,US);
H01L23/3677 (EP,US);
H01L23/49838 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/14 (EP,US);
H01L2924/19041 (EP,US);
H01L2924/19042 (EP,US);
H01L2924/19105 (EP,US);
H01L2924/30105 (EP,US);
H01L2924/30107 (EP,US);
H01L2924/3011 (EP,US);
H03D2200/0043 (EP,US);
H03F2200/111 (EP,US);
H03F2200/372 (EP,US);
H03F2203/45638 (EP,US);
H03F2203/45704 (EP,US);
H03F2203/45726 (EP,US);
H03F2203/45728 (EP,US);
H03F2203/7209 (EP,US);
H03J2200/10 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/49111, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/49111, H01L2224/48257, H01L2924/00 (US,EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (US,EP); |
| Former IPC [2005/17] | H01L23/66 | Designated contracting states | DE, FR, GB [2019/25] |
| Former [2006/39] | DE, FR, GB | ||
| Former [2005/17] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleitergehäuse mit Bonddrahtinduktoren | [2005/17] | English: | Semiconductor package with bond wire inductors | [2005/17] | French: | Boîtier de semi-conducteur avec inductances à fils de connexion | [2019/02] |
| Former [2005/17] | Boîtier de semi-conducteur avec inductance à fils de connexion | Examination procedure | 25.07.2006 | Examination requested [2006/36] | 24.11.2006 | Despatch of a communication from the examining division (Time limit: M06) | 24.05.2007 | Reply to a communication from the examining division | 30.01.2017 | Despatch of a communication from the examining division (Time limit: M04) | 30.05.2017 | Reply to a communication from the examining division | 06.11.2017 | Despatch of a communication from the examining division (Time limit: M04) | 25.01.2018 | Reply to a communication from the examining division | 03.12.2018 | Cancellation of oral proceeding that was planned for 04.12.2018 | 04.12.2018 | Date of oral proceedings (cancelled) | 09.01.2019 | Communication of intention to grant the patent | 03.05.2019 | Fee for grant paid | 03.05.2019 | Fee for publishing/printing paid | 03.05.2019 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 24.11.2006 | Opposition(s) | 03.06.2020 | No opposition filed within time limit [2020/32] | Fees paid | Renewal fee | 31.10.2006 | Renewal fee patent year 03 | 31.10.2007 | Renewal fee patent year 04 | 31.10.2008 | Renewal fee patent year 05 | 02.11.2009 | Renewal fee patent year 06 | 02.11.2010 | Renewal fee patent year 07 | 31.10.2011 | Renewal fee patent year 08 | 31.10.2012 | Renewal fee patent year 09 | 31.10.2013 | Renewal fee patent year 10 | 31.10.2014 | Renewal fee patent year 11 | 02.11.2015 | Renewal fee patent year 12 | 31.10.2016 | Renewal fee patent year 13 | 02.11.2017 | Renewal fee patent year 14 | 31.10.2018 | Renewal fee patent year 15 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 25.10.2019 | FR | 31.10.2019 | [2020/48] | Documents cited: | Search | [A]WO9712398 (ANALOG DEVICES INC [US]); | [A]US2002024122 (JUNG YOUNG-DOO [KR], et al); | [A]US2002151109 (NORSKOV SOREN [DK], et al); | [A]US2003038382 (COMBS EDWARD G [US]); | [A]US6538303 (KUSHINO MASAHIKO [JP]); | [X]US2003160306 (GIBSON JOEL ROBERT [US], et al); | [E]WO2004100263 (MA COM INC [US]) |